Patents Assigned to ADVANCED
  • Patent number: 11883890
    Abstract: An orbital drilling device includes, on the same frame: a motor rotating a cutting tool on itself; a first, interior, eccentric, receiving the motor, mounted so as to be able to rotate; a second, exterior, eccentric, receiving the first eccentric, mounted so as to be able to rotate; a reference body, secured to the frame, receiving the second eccentric, mounted so as to be able to rotate; a first unit for driving the first eccentric; a second unit for driving the second eccentric, simultaneously with the rotation of the first eccentric; and a controller configured to reproduce any path of the cutting tool in the zone by continuous control of the angular offset between the first eccentric and the second eccentric.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: January 30, 2024
    Assignee: ADVANCED ELECTRICAL TOOLS
    Inventor: Sylvain Guerin
  • Patent number: 11885122
    Abstract: An adjustable support system has a base bracket member, a clip member, and an outer bracket. The base bracket member has a first end wall that overlays a substrate, a body wall extending outwardly therefrom and a second end wall opposite the first end wall. The clip member has a base bracket member coupling, and a projecting arm. The base bracket member coupling is attached to the first end wall and overlies a portion of the body wall. The projecting arm is spaceable apart from the body wall. The outer bracket has a spanning wall with inner and outer sides. An outer end wall extends from the outer side. The spanning wall is slidably positionable between the body wall of the base bracket member and the at least one clip member, to sandwich the same. Wall assemblies and methods are likewise disclosed.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: January 30, 2024
    Assignee: ADVANCED ARCHITECTURAL PRODUCTS, LLC
    Inventor: G. Matt Krause
  • Patent number: 11888992
    Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for generating digital marks. One of the methods includes: obtaining entity information of an entity; transmitting the entity information to one or more nodes of a blockchain for storage in the blockchain; obtaining a transaction identification associated with storing the entity information in the blockchain; and generating a digital mark for the entity based at least on the transaction identification.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: January 30, 2024
    Assignee: ADVANCED NEW TECHNOLOGIES CO., LTD.
    Inventors: Long Cheng, Yanpeng Li
  • Patent number: 11888106
    Abstract: A method for forming a battery assembly including: a) stacking a plurality of battery plates to form a plurality of electrochemical cells, and b) welding about an exterior periphery of the plurality of battery plates to form one or more integrated edge seals such that one or more individual battery plates are bonded to one or more adjacent battery plates. The one or more individual battery plates may include one or more projections extending from the exterior periphery of the individual battery plate toward the adjacent one or more battery plates; and wherein upon stacking, the one or more projections of the one or more individual battery plates overlap about an exterior of the one or more adjacent battery plates. The integrated edge seal may be formed by one or more projections bonding to the one or more adjacent battery plates.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: January 30, 2024
    Assignee: ADVANCED BATTERY CONCEPTS, LLC
    Inventors: Edward O. Shaffer, II, Don Hobday, Brian Sturdavant, Adam Cadena
  • Patent number: 11883789
    Abstract: A microwave heating method using a microwave, including: controlling a frequency of the microwave, to form a single-mode standing wave; disposing an object to be heated in a magnetic field region where a strength of a magnetic field formed by the single-mode standing wave is uniform and maximum; and heating the object to be heated by magnetic heat generation by magnetic loss caused by an action of the magnetic field of the magnetic field region, and/or induction heating by an induced current generated in the object to be heated due to the magnetic field of the magnetic field region.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: January 30, 2024
    Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Yuichi Watanabe, Sei Uemura, Masateru Nishioka, Masato Miyakawa, Takashi Nakamura
  • Patent number: 11888210
    Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: January 30, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jenchun Chen, Ya-Wen Liao
  • Patent number: 11887330
    Abstract: A method of assisting object registration in a smart home system including a plurality of objects is disclosed. The disclosed method may include allowing a user to select an object from among a plurality of objects, capturing a plurality of pointing gestures by allowing the user to perform the plurality of pointing gestures at the selected object, configuring a pointing ray using each of the plurality of captured pointing gestures, estimating a position of a nearest point extending from the plurality of pointing rays, and registering the estimated position of the nearest point as a position of the selected object.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: January 30, 2024
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Junyong Noh, Hyunggoog Seo, Jaedong Kim, Kwanggyoon Seo, Bumki Kim
  • Patent number: 11887967
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: January 30, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao
  • Patent number: 11887943
    Abstract: A capacitor structure includes a first metal layer, a first metal oxide layer, a second metal oxide layer, a first conductive member, a second conductive member and a metal composite structure. The first metal layer has a first surface and a second surface opposite the first surface. The first metal oxide layer is formed on the first surface of the first metal layer. The second metal oxide layer is formed on the second surface of the first metal layer. The first conductive member penetrates through the capacitor structure and is electrically isolated from the first metal layer. The second conductive member is electrically connected to the first metal layer. The metal composite structure is disposed between the second conductive member and the first metal layer.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: January 30, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen Hung Huang
  • Publication number: 20240029866
    Abstract: The present application provides an image-driven brain atlas construction method and apparatus, a device and a storage medium, and involves in the field of medical imaging technologies. The method includes: acquiring a node feature matrix, where the node feature matrix includes time sequences of multiple nodes of a brain; performing hypergraph data structure transformation on the node feature matrix to acquire a first hypergraph incidence matrix; inputting the first hypergraph incidence matrix and the node feature matrix into a trained hypergraph transition matrix generator for processing to output and acquire a first hypergraph transition matrix, where the first hypergraph transition matrix characterizes a constructed multi-modal brain atlas. The technical solution provided by the present application can construct the multi-modal brain atlas, and this multi-modal brain connection structure can express more feature information.
    Type: Application
    Filed: February 7, 2021
    Publication date: January 25, 2024
    Applicant: SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY
    Inventors: Shuqiang WANG, Junren PAN, Yanyan SHEN
  • Publication number: 20240027068
    Abstract: The present invention relates to an injector, a combustor comprising same, and a gas turbine comprising same. The injector comprises: an injector body; and a slit portion formed through the injector body in a reference direction, wherein the slit portion comprises: a first slit portion having a shape extending along the circumferential direction of a virtual reference circle having a virtual reference axis extending in the reference direction as a center thereof; and a second slit portion having a shape extending in the radial direction of the reference circle.
    Type: Application
    Filed: August 30, 2022
    Publication date: January 25, 2024
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Kyu Tae KIM, Taesong LEE
  • Publication number: 20240030368
    Abstract: A novel photodiode structure, a preparation method and a circuit structure are provided. The novel photodiode structure includes a substrate having a first doping type, a functional doping area having a second doping type, a surface doping area having the first doping type, and an auxiliary doping area having the second doping type. By forming a non-uniformly doped functional doping area, the present disclosure forms a self-built potential difference in the functional doping area and drives the moving direction of the photogenerated carriers. The photogenerated carriers may be accelerated by the potential difference, so that the collected carriers will directly enter the subsequent circuit through the transport gate. In addition, the loop shape of the auxiliary doping area can increase the area of receiving charges, in a result, the auxiliary doping area can receive the transported carriers faster, thereby further enhancing the transport efficiency of the photogenerated carriers.
    Type: Application
    Filed: July 2, 2021
    Publication date: January 25, 2024
    Applicant: SHANGHAI ADVANCED RESEARCH INSTITUTE, CHINESE ACADEMY OF SCIENCES
    Inventors: Zunkai HUANG, Quanze LI, Hui WANG, Yongxin ZHU, Ning WANG, Li TIAN
  • Patent number: 11879139
    Abstract: The present disclosure provides a scalable and cost-effective method of purifying recombinant viruses, such as recombinant lentiviruses. Also provided herein are recombinant viruses (e.g., lentiviruses) purified using the methods provided herein, which have a low level of impurities and high activity retention.
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: January 23, 2024
    Assignee: PORTON ADVANCED SOLUTIONS LTD.
    Inventors: Dichao Hu, Chuanzhen Pi, Kai Weng, Jinbo Guo, Hailong Liu, Yangzhou Wang, Weimeng Zhang, Jun Hua
  • Patent number: 11881752
    Abstract: A direct-drive type annular flexible transportation system and a collaborative control method thereof are provided. The direct-drive type annular flexible transportation system includes an annular base, a primary excitation type linear motor, an power supplying module, a power driving module, a position detection module, and a wireless communication module. The primary excitation type linear motor includes a long stator and a plurality of movers. The long stator is formed by connection of stator iron cores presenting a multi-segment cogging structure and is installed on the annular base. Each of the movers includes a short primary, a power driving module, a position detection module, and a wireless communication module. The short primary is formed by an asymmetrically-structured permanent magnet array, an armature winding, and a primary iron core.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: January 23, 2024
    Assignees: ZHEJIANG UNIVERSITY, ZHEJIANG UNIVERSITY ADVANCED ELECTRICAL EQUIPMENT INNOVATION CENTER
    Inventors: Yiming Shen, Yanfei Cao, Yan Yan, Tingna Shi, Changliang Xia
  • Patent number: 11880248
    Abstract: A docking station for secondary external cooling for mobile computing devices, including: one or more ports for docking a mobile computing device; a docking platform for supporting the mobile computing device; a cooling element; and a thermal interface housed in the docking platform for transferring heat between the mobile computing device and the cooling element.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: January 23, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Christopher M. Jaggers, Christopher M. Helberg
  • Patent number: 11881448
    Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first package and a second package. The first package includes a first substrate, an electronic component, a trace layer, and a first conductive structure. The first substrate has a first surface and a second surface opposite to the first surface. The electronic component is embedded in the first substrate. The trace layer has an uppermost conductive layer embedded in the first substrate and exposed from the first surface of the first substrate. The first conductive structure electrically connects the trace layer to the second surface of the first substrate. The second package is disposed on the first surface of the first substrate of the first package.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: January 23, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: You-Lung Yen, Bernd Karl Appelt, Kay Stefan Essig
  • Patent number: 11880277
    Abstract: Selecting an error correction code type for a memory device includes: selecting, by the memory device in dependence upon predefined selection criteria, one of a plurality of error correction code types and carrying out memory access requests utilizing the selected error correction code type.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: January 23, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Sudhanva Gurumurthi, Vilas Sridharan
  • Patent number: 11882660
    Abstract: A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.
    Type: Grant
    Filed: January 10, 2023
    Date of Patent: January 23, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chien-Fan Chen, Chien-Hao Wang
  • Patent number: 11880073
    Abstract: An optical connector cleaning tool includes a cleaning portion (101), a container (102) configured to store a cleaning liquid (121), and an atomizer (103) configured to atomize the cleaning liquid (121) stored in the container (102) by ultrasonic atomization. The atomizer (103) includes an atomizing separation portion (105) configured to cover a liquid supply port (104) and pass not a liquid but mist. In addition, the cleaning tool includes a control circuit (107) configured to control an operation time of the atomizer (103) by a set time.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: January 23, 2024
    Assignee: NTT ADVANCED TECHNOLOGY CORPORATION
    Inventors: Shuichiro Asakawa, Kenta Arai, Etsu Hashimoto
  • Publication number: 20240017850
    Abstract: A method for producing a nacelle inlet assembly includes forming a composite panel that has a carbon fiber reinforced polymer (CFRP) material. The composite panel is formed to have a curved contour that represents at least a portion of an annular barrel shape. The method includes applying a metallic coating to the composite panel to form a lipskin. The metallic coating is applied such that the metallic coating defines an exterior surface of the lipskin and the composite panel defines an interior surface of the lipskin. The method includes laser drilling a plurality of perforations through the lipskin. The laser drilling involves emitting a laser beam that impinges upon the interior surface of the lipskin and penetrates the CFRP material of the composite panel before penetrating the metallic coating and exiting the lipskin through the exterior surface.
    Type: Application
    Filed: February 7, 2023
    Publication date: January 18, 2024
    Applicants: THE BOEING COMPANY, CAV ADVANCED TECHNOLOGIES LTD.
    Inventors: Charles William Rust, John Alfred Weidler, Martin Wood