Abstract: The present invention relates to a flexible pressure sensor using a multi-material 3D-printed microchannel mold, and a method for manufacturing the same, and more particularly, to a flexible pressure sensor having improved flexibility, sensitivity, and stability for use in a wearable device, and a method for manufacturing the same. Further, the present invention relates to a physical sensor for measuring a force applied from the outside, and more particularly, to a multi-directional physical sensor using a multi-layer microchannel array, which may sense all forces applied from the outside in three-dimensional directions such as a perpendicular direction and a parallel direction by applying the multi-layer microchannel array to a body having a three-dimensionally protruding shape.

Abstract: A wireless interface device for communicating an input signal to a processor-based host is provided. The wireless interface device includes a processor, a display and a wireless communication component. The display comprises a touchscreen, a touchscreen controller and a memory liquid crystal display. The display is configured to receive and translate an input to an input signal and communicate the input signal to the microprocessor. The wireless communication component is configured to receive the input signal from the processor and communicate the input signal over a communications channel to the processor-based host.

Abstract: An apparatus, system and redox membrane for efficient lithium-ion extraction from natural salt waters or geothermal brines or manmade sources such as from lithium battery recycling are provided. The redox membrane is selective for lithium ions over other spectator ions making the system capable of selectively extracting lithium-ions from multiple-ion source solutions. The system uses the redox membrane as an electrochemically active material acting as a Li-selective membrane for direct lithium extraction from a lithium-ion source. The redox membrane is also not porous to solvents and is stable in caustic and high temperature environments. The features of the redox membrane and system allow the recovery of lithium from low purity sources and the production of higher purity products at reduced costs and process steps over conventional processes.

Abstract: A display panel and a display device are provided. The display panel includes: a pixel circuit, a light-emitting element and an initialization signal line. The initialization signal includes an enabling level and a non-enabling level, and the enabling level of the initialization signal is configured to initialize a target node of the pixel circuit. The initialization signal line extends in a first direction, and includes a first initialization signal line and a second initialization signal line. The pixel circuit includes a first pixel circuit connected to the first initialization signal line and a second pixel circuit connected to the second initialization signal. A screen refresh cycle of the display panel includes a first stage, the first initialization signal line transmits the enabling level, and the second initialization signal line transmits the non-enabling level, in the first stage.

Abstract: The present disclosure provides an oxidization electrode for anion exchange membrane water electrolysis having low cost, high performance, and high stability. Specifically, an embodiment of the present disclosure provides an oxidization electrode for anion exchange membrane water electrolysis, comprising: a nickel metal; and a layered double hydroxide (LDH) with a monolayer structure containing nickel and iron and disposed on one surface or both surfaces of the nickel metal.

Abstract: Proposed are a stretchable display panel device capable of effectively correcting an image according to a strain ratio and a method of correcting the image. The stretchable display panel device includes a stretchable display panel, a measurement unit, and a correction unit. The measurement unit measures the strain ratio of the stretchable display panel. The correction unit corrects the image on the stretchable display panel on the basis of the strain ratio. The expandable and contractible display panel overall has a uniform strain ratio and has a negative effective Poisson’s ratio. The strain ratio is a strain ratio in a first direction.

Abstract: The present invention discloses a real-time ultrasonic stimulation electric signal recording chip and a preparation method thereof, where the preparation method includes the following steps: S1 manufacturing an interdigital electrode on a piezoelectric substrate to obtain a surface acoustic wave chip, and manufacturing a recording electrode and an electrode lead; S2, manufacturing an insulation protection layer on the chip obtained in the S1, and processing the insulation protection layer to form the recording electrode, so as to obtain a chip combining the interdigital electrode and the recording electrode; S3, preparing a PDMS cavity; and S4, bonding the PDMS cavity prepared in the S3 and the chip obtained in the S2. In the present invention, combining the interdigital electrode generating a surface acoustic wave ultrasound with a multi-channel recording electrode, such that real-time recording of a multi-channel electric signal under ultrasonic stimulation is achieved.

Abstract: The present invention provides a method comprising the steps of: generating a second anchor on the second convolutional feature map by scaling and shifting a first anchor in the ground-truth box; generating a third convolutional feature map by convolving the second convolutional feature map by means of a second convolution; determining whether the overlap ratio between the ground-truth box and a second single anchor is greater than or equal to a reference value; generating a third anchor by scaling and shifting the second anchor having an overlap ratio that is greater than or equal to the reference value; assigning an objectivity score to the third anchor; and presenting the third anchor, which has an objectivity score that is equal to or greater than a reference value, as a proposal on the third convolutional feature map.

Abstract: Provided are a graphene preparation apparatus, including: a chamber having a space for preparation of graphene; a first electrode and a second electrode disposed in the chamber to be separated a predetermined distance from each other, the first electrode and the second electrode supporting a catalytic metal and receiving electric current for preparation of the graphene to heat the catalytic metal using Joule heating; additional heaters disposed at opposite sides of the catalytic metal, respectively, and heating the catalytic metal to compensate for a temperature difference between both end regions and a central region of the catalytic metal heated using Joule heating induced by the first electrode and the second electrode; and a current supply unit supplying electric current to the first electrode and the second electrode.

Abstract: One or more processors are operative to carry out neural network operations and include a plurality of compute units (CUs) configurable for neural network operations. The neural network compute unit remapping logic detects a condition to remap neural network compute units that are currently used in carrying out a neural network operation in a processor with at least one replacement compute unit that is not currently being used to carry out the neural network operation. In response to detecting the condition, the logic remaps a logical address of at least one currently used compute unit to a different physical address that corresponds to the replacement compute unit and causes the replacement compute unit to carry out neural network operations.

Abstract: Disclosed invention comprises innovations in the fabrication process and the associated design methodology for producing refined prestressed concrete elements/components. The innovations disclosed are fabrication using multiple stages, the use of ultra high strength materials for only critical subcomponents, utilizing thinner sections made of ultra high strength materials, and a unique method of inducing and controlling camber. The embodiments of this invention enable the accelerated construction of concrete structures that are both durable and cost effective. This disclosure demonstrates the significant improvements to the prior art in the areas of durability, constructability, and cost reduction for prestressed concrete components. The embodiments presented in this disclosure are for bridge superstructure applications.

Abstract: An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.

Abstract: For an easy calibration using calibration particles, provided is a measuring device to capture images of target objects. An image analyzer acquires multiple images obtained at a predetermined time interval, (a) specifies the mean-square displacement of a bright point of a calibration particle based on the displacement of the bright point of the calibration particle in the multiple images in a calibration mode, and (b) specifies the mean-square displacement of a bright point of the target particle based on the displacement of the bright point of the target particle in the multiple images in a measurement mode. A particle size analyzer (c) derives the particle size of the target particle from the mean-square displacement of the bright point of the target particle based on the mean-square displacement of the bright point of the calibration particle and the particle size of the calibration particle in an analysis mode.

Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.

Abstract: A touch sensor having a visible area and a peripheral area includes a substrate, a metal nanowire layer, and a silver layer. The metal nanowire layer is disposed on a main surface of the substrate and defines a plurality of electrode portions corresponding to the visible area and a plurality of wiring portions corresponding to the peripheral area. The electrode portions are arranged at intervals, and the wiring portions are respectively connected to the electrode portions and arranged at intervals. Two adjacent electrode portions are spaced apart by a first spacer region, and two adjacent wiring portions are spaced apart by a second spacer region. The silver layer is disposed on the wiring portions and in contact with the wiring portions. A thickness of the substrate corresponding to the first spacer region is smaller than a thickness of the substrate corresponding to the second spacer region.

Abstract: The present disclosure provides an electronic package and method of manufacturing the same. The electronic package includes an electronic device including a first carrier and a first electronic component disposed on the first carrier, a second carrier adjacent to the first carrier of the electronic device, and a conductive layer at least partially covering the electronic device, and separating the electronic device from the second carrier.

Abstract: A substrate includes a first dielectric layer having a first surface and a second dielectric layer having a first surface disposed adjacent to the first surface of the first dielectric layer. The substrate further includes a first conductive via disposed in the first dielectric layer and having a first end adjacent to the first surface of the first dielectric layer and a second end opposite the first end. The substrate further includes a second conductive via disposed in the second dielectric layer and having a first end adjacent to the first surface of the second dielectric layer. A width of the first end of the first conductive via is smaller than a width of the second end of the first conductive via, and a width of the first end of the second conductive via is smaller than the width of the first end of the first conductive via.

Abstract: The present disclosure provides a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a semiconductor structure, a conductive trace and a tenting structure. The semiconductor structure has a first surface, a second surface and a third surface extending between the first surface and the second surface, and the first surface, the second surface and the third surface define a through-silicon via recessed from the first surface. The conductive trace is disposed adjacent to the first surface, the second surface and the third surface of the semiconductor structure. The tenting structure covering the TSV of the semiconductor structure. A cavity is defined by the tenting structure and the TSV.

Abstract: A semiconductor device package includes a carrier provided with a first conductive element, a second conductive element arranged on a semiconductor disposed on the carrier, and a second semiconductor device disposed on and across the first conductive element and the first semiconductor device, wherein the first conductive element having a surface that is substantially coplanar with a surface of the second conductive element.

Abstract: The present disclosure relates to a wireless communication module. The wireless communication module includes a first antenna layer and a second antenna layer non-coplanar with the second antenna layer. An electromagnetic wave of the first antenna and the second antenna are configured to have far-field interference to each other.