Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.

Abstract: A display panel, a display device and a method for manufacturing a display device are provided. The display panel includes: a display area and a non-display area, at least a part of the non-display area is located on a side of the display area in a first direction; and the non-display area includes at least one first metal portion and a first marker, and the first marker extends through the first metal portion. With the display panel, display device and method, whether an actual grinding line reaches the target grinding line can be determined in real time.

Abstract: A transfer substrate, a method for transferring a microdevice and a display panel are provided. The transfer substrate includes a substrate body, a first functional layer and a second functional layer. Protrusions and grooves are alternately formed on one side of the substrate body. The first functional layer is arranged on the side of the substrate body where the protrusion is formed. The first functional layer at least partially overlaps the protrusion along a direction perpendicular to a plane in which the substrate body extends. The second functional layer at least partially overlaps the first functional layer along the direction perpendicular to the plane in which the substrate body extends. The second functional layer extends from the protrusion to at least a sidewall of the groove.

Abstract: A color-changing sheet according to an embodiment of the present invention may include a base layer having a brightness (L value) of less than 40 and a color layer positioned on at least one surface of the base layer, containing a color dye or a pigment, and having a transmittance of to 90%, wherein a thickness ratio of the base layer to the color layer is 0.1 to 10, and may realize color change without adding additional particles.

Abstract: A method and apparatus controls power management of a graphics processing core when multiple virtual machines are allocated to the graphics processing core on a much finer-grain level than conventional systems. In one example, the method and apparatus processes a plurality of virtual machine power control setting requests to determine a power control request for a power management unit of a graphics processing core. The method and apparatus then controls power levels of the graphics processing core with the power management unit based on the determined power control request.

Abstract: A computing system includes a processor and a non-transitory, computer-readable medium including instructions that, when executed by the processor, causes the computing system to receive a machine data set; process the machine data set using a trained machine-learned model to generate predicted variety profile index values, and transmit the variety profile index values to a client computing device. A computer-implemented method includes receiving a machine data set; processing the machine data set using a trained machine-learned model to generate predicted variety profile index values, and transmitting the variety profile index values to a client computing device.

Abstract: A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes a semiconductor substrate, at least one conductive via, a second insulation layer and a conductive layer. The conductive via is disposed in the semiconductor substrate and includes an interconnection metal and a first insulation layer around the interconnection metal. A portion of the first insulation layer defines an opening to expose the interconnection metal. The second insulation layer is disposed on a surface of the semiconductor substrate and in the opening. The conductive layer is electrically disconnected with the semiconductor substrate by the second insulation layer and electrically connected to the interconnection metal of the at least one conductive via.

Abstract: A method for systematic application of agricultural products includes receiving a label, analyzing the label to generate procedures, receiving a product and field selection, generating a prescription including a map and the procedures, executing the procedures in the field, and displaying the map. A computing system includes a processor and a memory storing instructions that, when executed by the processor, cause the computing system to: receive a label, analyze the label to generate procedures, receive a product and field selection, generate a prescription including a map and the procedures, execute the procedures in the field, and display the map. A non-transitory computer readable medium stores program instructions that when executed, cause a computer to receive a label, analyze the label to generate procedures, receive a product and field selection, generate a prescription including a map and the procedures, execute the procedures in the field, and display the map.

Abstract: Proposed is a vibration sensor including: a substrate; a first electrode positioned on the substrate; a support positioned on the first electrode and including a cylindrical hollow hole; and a diaphragm including a thin film positioned on the support and a second electrode positioned on the thin film. According to the present disclosure, it is possible to manufacture a skin-attachable vibration sensor that is attached to a user's neck to detect vibration acceleration in user's neck skin, thus exhibiting a uniform and high sensitivity to a user's voice over the frequency range of the human voice. In addition, the sensor sensitively detects a user's voice through neck skin vibrations rather than through air, thus being free from the influence of external noise or wind, and can recognize the user's voice even in a situation where a user's mouth is covered.

Abstract: There is provided a 3D image generation method and apparatus. A 3D image generation method according to an embodiment includes outputting a signal to an object from at least one point, receiving the signal reflected by the object at one or more points, and generating a 3D image of the object based on a temporal feature and a spectral feature of the signal reflected by the object.

Abstract: In the present disclosure, there is provided a permeability measurement jig including a first waveguide, wherein a signal line of the first waveguide comprises an excited magnetic part at one end side, and a magnetic field is generated at the excited magnetic part by an excitation signal, and a second waveguide, wherein a signal line of the second waveguide comprises a detection part at one end side, a detection signal is induced at the detection part due to an action of the magnetic field generated at the excited magnetic part to a measurement sample, and the detection part is placed on the excited magnetic part to face the excited magnetic part at a predetermined distance. A permeability measurement device having the permeability measurement jig and a permeability measurement method are disclosed.

Abstract: The present invention provides a reciprocal-flow-type nucleic acid amplification device comprising: heaters capable of forming a denaturation temperature zone and an extension/annealing temperature zone; a fluorescence detector capable of detecting movement of a sample solution between the two temperature zones; a pair of liquid delivery mechanisms that allow the sample solution to move between the two temperature zones and that are configured to be open to atmospheric pressure when liquid delivery stops; a substrate on which the chip for nucleic acid amplification according to claim 2 can be placed; and a control mechanism that controls driving of each liquid delivery mechanism by receiving an electrical signal from the fluorescence detector relating to movement of the sample solution from the control mechanism; the device being capable of performing real-time PCR by measuring fluorescence intensity for each thermal cycle.

Abstract: A system includes one or more processors; and one or more non-transitory, computer-readable media including instructions that, when executed by the one or more processors, cause the computing system to: receive a machine data set; process the machine data set with a trained machine-learned model to generate predicted variety profile index values; and cause a visualization to be displayed. A computer-implemented method includes receiving a machine data set; processing the machine data set with a trained machine-learned model to generate predicted variety profile index values; and causing a visualization to be displayed. A non-transitory computer-readable medium includes computer-executable instructions that, when executed by one or more processors, cause a computer to: receive a machine data set; process the machine data set with a trained machine-learned model to generate predicted variety profile index values; and cause a visualization to be displayed.

Abstract: A method of analysing a sample in the form of a droplet provided on a sample-receiving surface includes providing a light source and a detector in a housing, positioning said sample-receiving surface in or on the housing, and focussing an incident beam of light to a focal point in the vicinity of the sample. Light is detected from the sample resulting from an interaction with the sample, the sample-receiving surface, or the atmosphere surrounding the sample. At least one parameter of the detected light is measured, and the sample-receiving surface is translated relative to the housing such that the focal point is at a different region of the sample, the sample-receiving surface, or the atmosphere surrounding the sample. The step of measuring one or more parameters of the detected light is repeated following the translating step.

Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a first die, a bumping structure, and a second die. The first die is on a carrier. The bumping structure is over the first die. The bumping structure includes a light-transmitting portion and a light-blocking portion embedded in the light-transmitting portion. The second die is electrically connected to the carrier. The light-blocking portion of the bumping structure is free from covering the second die.

Abstract: A socket actuation mechanism for package insertion and package-socket alignment, including: a socket frame comprising a plurality of first hinge portions; a carrier frame comprising: a center portion comprising one or more package interlocks; and a tab extending from a first end of the carrier frame, the tab comprising a second hinge portion couplable with the plurality of first hinge portions to form a hinge coupling the carrier frame to the socket frame.

Abstract: The invention relates to a system for recording a track comprising: a utensil comprising a tip and equipped with a magnetic object; a device for locating the magnetic object configured to determine an estimated reference position on a writing surface; and a matrix-array touch sensor configured to define a set of M pixels, among N pixels, at least partially encircling the estimated reference position, and to detect the contact of the tip on the writing surface on the basis of the electrical signals generated by said set of M pixels.

Abstract: A semiconductor device package includes a first electronic device and a second electronic device. The first electronic device includes a first redistribution layer (RDL) including a circuit layer. The second electronic device is disposed on the first RDL of the first electronic device. The second electronic device includes an encapsulant and a patterned conductive layer. The encapsulant has a first surface facing the first RDL of the first electronic device, and a second surface opposite to the first surface. The patterned conductive layer is disposed at the second surface of the encapsulant, and is configured to be electrically coupled to the circuit layer of the first RDL of the first electronic device.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

Abstract: A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.