Abstract: An electronic structure, an electronic package structure and method of manufacturing an electronic device are provided. The electronic structure includes a carrier and a protection layer. The carrier includes a first pad, a second pad and a first dielectric layer. The first pad is at a side of the carrier and configured to bond with a conductive pad. The second pad is at the side of carrier and configured to electrically connect an exterior circuit. The first dielectric layer includes a first portion around the first pad and a second portion around the second pad, wherein a top surface of the first portion and a top surface of the second portion are substantially coplanar. The protection layer is on the second pad and covers the second pad.

Abstract: Organically modified metal oxide nanoparticles containing two or more cores including a plurality of metal atoms and a plurality of oxygen atoms covalently bonded to the plurality of metal atoms; a first modifying group that is a ligand coordinated to each of the cores and selected from the group consisting of a carboxylic acid carboxylate, a sulfonic acid sulfonate, and a phosphonic acid phosphonate; and a second modifying group that is coordinated to each of the cores and is a ligand having a structure different from that of the first modifying group and/or an inorganic anion, in which organically modified metal oxide nanoparticles have a structure in which the cores are crosslinked through a coordinate bond by at least the first modifying group.

Abstract: The invention discloses a control method for balancing scaling errors of multiple current sensors for PMSM. An impedance network is set between a direct current power supply and a three-phase inverter connected to a PMSM to avoid positive and negative poles of the direct current power supply being short-circuited under actions of shoot-through vectors. Under actions of two shoot-through vectors in a PWM cycle, three-phase current sensors are used to respectively sample the sum of currents in each branch of three-phase output branches of the three-phase inverter and a branch of the same bridge arm of the three-phase inverter, according to the sampled currents, operating to obtain the relationship between the scaling error coefficients of the three-phase current sensors. Then, correction coefficients are calculated. The correction of the scaling errors of the current sensors is implemented using correction coefficient feedback control.

Abstract: Disclosed a wireless power transfer system configured to selectively drive at least one transmitting coil among transmitting coils that are included in a transmitter; and an operation method of the wireless power transfer system, and more particularly, to a technology of verifying a coupling coefficient between each of transmitting coils and a receiving coil when the receiving coil is located on the transmitting coils and selectively driving at least one transmitting coil among the transmitting coils based on the verified coupling coefficient.

Abstract: A semiconductor package for high-speed die connections using a conductive insert, the semiconductor package comprising: a die; a plurality of redistribution layers; a conductive insert housed in a perforation through the plurality of redistribution layers; and a conductive bump conductively coupled to an input/output (I/O) connection point of the die via the conductive insert.

Abstract: A package substrate and method of manufacturing a package substrate and a semiconductor device package are provided. The package substrate includes a circuit layer, a molding layer and a sacrificial layer. The circuit layer includes conductive traces and conductive pads. The molding layer has an upper surface and a lower surface opposite to the upper surface, wherein the molding layer partially covers the conductive traces and the conductive pads, and first surfaces of the conductive traces and first surfaces of the conductive pads are exposed from the upper surface of the molding layer. The sacrificial layer covers the lower surface of the molding layer, second surfaces of the conductive pads.

Abstract: A method for screening for a polypeptide that acts on a target protein, including (1) providing a polynucleotide library constituted of a plurality of expression vectors that can be expressed in a gram-negative bacterium, where the plurality of expression vectors each include a first polynucleotide encoding a polypeptide different from one another, a secretory signal sequence positioned upstream of the first polynucleotide, and a second polynucleotide encoding a target protein, (2) transforming a gram-negative bacterium with the expression vector to express the polypeptide in a periplasmic space and the target protein on an inner membrane surface, (3) contacting the polypeptide with the target protein in the periplasmic space, (4) allowing the gram-negative bacterium to form a spheroplast to measure activity of the polypeptide on the target protein by a patch clamp technique, and (5) identifying the polypeptide that acts on the target protein based on the measured activity.

Abstract: A direct-drive type annular flexible transportation system and a collaborative control method thereof are provided. The direct-drive type annular flexible transportation system includes an annular base, a primary excitation type linear motor, an power supplying module, a power driving module, a position detection module, and a wireless communication module. The primary excitation type linear motor includes a long stator and a plurality of movers. The long stator is formed by connection of stator iron cores presenting a multi-segment cogging structure and is installed on the annular base. Each of the movers includes a short primary, a power driving module, a position detection module, and a wireless communication module. The short primary is formed by an asymmetrically-structured permanent magnet array, an armature winding, and a primary iron core.

Abstract: An organic-inorganic adhesive composition and a gas barrier film including the same are disclosed. The organic-inorganic adhesive composition includes: a silane compound including at least one functional group of a vinyl group, an acryloxy group, a methacryloxy group, or a combination thereof; an amine group-containing compound; an isocyanate-based compound; and an acid catalyst, wherein a pH of the organic-inorganic adhesive composition is from 5 to 8.

Abstract: Provided is a hot melt adhesive for insulating glass spacer, prepared from raw meterials comprising the following components: 1-10 parts by weight of butyl rubber, 25-50 parts by weight of a polyisobutylene mixture; 5-15 parts by weight of a tackifying resin; 1-15 parts by weight of a tackifier; 5-15 parts by weight of a polymer; 0.1-1 part by weight of a lubricant; 0.1-1 part by weight of an antioxidant; 15-50 parts by weight of a filler; 1-10 parts by weight of a water absorbent; and 5-25 parts by weight of carbon black. Compared with the prior art, in the hot melt adhesive for insulating glass spacer provided in the present disclosure, components with specific contents are used, such that relatively good overall interaction is achieved, the thixotropy of the product is good, and the adhesion to both silicone sealant and glass is excellent.

Abstract: Disclosed are beta-type active zinc sulfide and a preparation method therefor. The method includes: adding an oil phase containing styrene monomers into a water phase containing a pore-forming agent, a surfactant, a Zn salt, a complexing agent, a sulfur source and a water-soluble initiator, conducting mixing and emulsification, introducing metal elements, dissolving polystyrene of microspheres prepared through reaction in tetrahydrofuran, and then conducting calcination, pickling and activation to obtain the beta-type active zinc sulfide. The zinc sulfide microspheres prepared by the present invention are beta-type, and have excellent photoelectric properties and broad application prospects.

Abstract: Device of inspection of an inner surface of a hollow body comprising an emitter (1) and a receiver (3) of a line of light (L1, L2), a tube (8) which is configured for being housed in the hollow body during the inspection, and optical means comprising at least one mirror (4, 5) which is arranged inside the upper end (9) of the tube (8), and mirrors (6, 7) which are arranged inside the lower end (10) of the tube (8), the mirror (4 or 5) is facing one opening (11) of the upper end (9) for reflecting the line (L1) emitted by the emitter (1) and directing it towards the mirror (6), or it is facing another opening (12) of the upper end (9) for receiving the line (L2) reflected by the inner surface from the mirror (7) and directing it towards the receiver (3), the mirror (6) is facing one opening (13) of the lower end (10) for receiving the line (L1) emitted by the emitter (1) and directing it onto the inner surface, and the mirror (7) is facing the opening (13) of the lower end (10) for reflecting the line (L2) ref

Abstract: In a method of making a gaseous emissions treatment component, a ‘green’ ceramic mix is extruded through a die to form an extrusion having cells extending along the extrusion, the cells being bounded by walls dividing adjacent cells from one another. In concert with the extruding, metal is fed through the die with the extruded mix. A length of the extrusion and associated metal is then cut off and fired to form the component.

Abstract: The presence of biomarkers or other analytes can be detected in the bodily fluid using Electrochemical Impedance Spectroscopy (EIS) or Electrochemical Capacitance Spectroscopy (ECS) in devices, such as handheld point-of-care devices. The devices, as well as systems and methods, utilize using Electrochemical Impedance Spectroscopy (EIS) or Electrochemical Capacitance Spectroscopy (EIS) in combination with an antibody or other target-capturing molecule on a working electrode. Imaginary impedance or phase shift, as well as background subtraction, also may be utilized.

Abstract: Exemplary embodiments provide wear spreading among die regions (i.e., one or more circuits) in an integrated circuit or among dies by using operating condition data in addition to or instead of environmental data such as temperature data, from each of a plurality of die regions. Control logic produces a cumulative amount of time each of the plurality of die regions has spent at an operating condition based on operating condition data wherein the operating condition data is based on at least one of the following operating characteristics: frequency of operation of the plurality of die regions, an operating voltage of the plurality of die regions, an activity level of the plurality of die regions, a timing margin of the plurality of die regions, and a number of detected faults of the plurality of die regions. The method and apparatus spreads wear among the plurality of same type of die regions by controlling task execution among the plurality of die regions using the die wear-out data.

Abstract: Various circuit board embodiments are disclosed. In one aspect, an apparatus is provided that includes a circuit board and a first phase change material pocket positioned on or in the circuit board and contacting a surface of the circuit board.

Abstract: Disclosed are a data sample label processing method and apparatus.

Abstract: Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package is provided that includes a fan-out redistribution layer (RDL) structure that has plural stacked polymer layers, plural metallization layers, plural conductive vias interconnecting adjacent metallization layers of the metallization layers, and plural rivets configured to resist delamination of one or more of the polymer layers. Each of the plural rivets includes a first head, a second head and a shank connected between the first head and the second head. The first head is part of one of the metallization layers. The shank includes at least one of the conductive vias and at least one part of another of the metallization layers.

Abstract: Various semiconductor chip metallization layers and methods of manufacturing the same are disclosed. In aspect, a semiconductor chip is provided that includes a substrate, plural metallization layers on the substrate, a first conductor line in one of the metallization layers and a second conductor line in the one of the metallization layers in spaced apart relation to the first conductor line, each of the first conductor line and the second conductor line has a first line portion and a second line portion stacked on the first line portion, and a dielectric layer that has a portion positioned between the first conductor line and a second line, the portion has an air gap.

Abstract: A semiconductor device package includes a first conductive layer, a second conductive layer and a third conductive layer. The first conductive layer has a first pitch. The second conductive layer has a second pitch and is arranged at two different sides of the first conductive layer. The third conductive layer has a third pitch and is disposed above the first conductive layer and the second conductive layer. The third conductive layer is electrically connected to the first conductive layer. The first pitch is smaller than the third pitch, and the third pitch is smaller than the second pitch.