Abstract: The disclosure relates to a curable mixture for use in impregnation of paper bushings comprising a resin mixture of a bisphenol-A-diglycidylether (BADGE) and a bisphenol-F-diglycidylether (BFDGE), methyltetrahydrophthalic anhydride (MTHPA) as hardener, and an accelerator selected from the group consisting of tertiary alkylamine aminoethylalcohols and corresponding ethers thereof as well as paper bushings impregnated with such mixture and uses of such mixture.

Abstract: The present disclosure relates to a hybrid material panel assembly for a vehicle. The panel assembly includes a panel and a plurality of mounting flanges integrally formed with the panel. The panel is formed of a first material having a first coefficient of thermal expansion. The plurality of mounting flanges are formed of a second material having a second coefficient of thermal expansion, where each of the plurality of mounting flanges include a mounting area that defines a mounting surface and at least one mounting hole. The first coefficient of thermal expansion is greater than the second coefficient of thermal expansion.

Abstract: Disclosed is a micro LED display having a multi-color pixel array and a method of fabricating the same based on integration with a driving circuit thereof. According to various embodiments, the display may be fabricated by providing an IC device in which a driving circuit has been wired, forming, in one surface of the IC device, a plurality of pixels on which a plurality of partial pixels for emitting different color lights has been stacked, and electrically connecting the partial pixels to the driving circuit using connection members.

Abstract: A conductive structure includes a core portion, a plurality of electronic devices and a filling material. The core portion defines a cavity. The electronic devices are disposed in the cavity of the core portion. The filling material is disposed between the electronic devices and a sidewall of the cavity of the core portion.

Abstract: Embodiments relate to illuminated electrosurgical devices and related systems and methods. An electrosurgical device can include an electrosurgical blade having a proximal end and a distal end and comprising a plurality of light elements. A plurality of separation walls and a plurality of apertures can be arranged relative to the plurality of light elements to guide light from the plurality of light elements to illuminate an area around the distal end of the electrosurgical blade.

Abstract: The present invention discloses a red light and near-infrared light-emitting material and a light-emitting device. The red light and near-infrared light-emitting material contains a compound represented by a molecular formula, xA2O3·yIn2O3·bR2O3, wherein the element A is Sc and/or Ga; the element R is one or two of Cr, Yb, Nd or Er and necessarily includes Cr; and 0.001?x?1, 0.001?y?1, 0.001?b?0.2, and 0.001?b/(x+y)?0.2. The light-emitting material can be excited by a technically mature blue light source to emit light with a high-intensity wide-spectrum or multiple spectra. Compared with existing materials, the light-emitting material has higher luminescent intensity. The light-emitting device uses an LED chip to combine an infrared light-emitting material and a visible light light-emitting material. In this way, the same LED chip can emit near-infrared light and visible light at the same time, which greatly simplifies the packaging process and reduces the packaging cost.

Abstract: An apparatus and method for managing packet transfer between a memory fabric having a physical layer interface higher data rate than a data rate of a physical layer interface of another device, receives incoming packets from the memory fabric physical layer interface wherein at least some of the packets include different instruction types. The apparatus and method determine a packet type of the incoming packet received from the memory fabric physical layer interface and when the determined incoming packet type is of a type containing an atomic request, the method and apparatus prioritizes transfer of the incoming packet with the atomic request over other packet types of incoming packets, to memory access logic that accesses local memory within an apparatus.

Abstract: Automatic memory overclocking, including: increasing a memory frequency setting for a memory module until a memory stability test fails; determining an overclocked memory frequency setting including a highest memory frequency setting passing the memory stability test; and generating a profile including the overclocked memory frequency setting.

Abstract: Stormwater management systems, methods, and apparatuses for containing and filtering runoff are provided. Disclosed embodiments may include a top plate including a first plurality of side panel attachments and a bottom plate including a second plurality of side panel attachments. Embodiments may include a plurality of support column assemblies between the top plate and the bottom plate. Each support column assembly of the plurality of support column assemblies may include an upper portion and a lower portion and the upper portion and lower portion may be configured to connect at a mating connection. Embodiments may also include one or more side panels. Each of the one or more side panels may include one or more column bearing components. The one or more column bearing components may be configured to contact at least one support column assembly of the plurality of support column assemblies at one or more contact areas. The one or more contact areas may be located above or below the mating connection.

Abstract: Disclosed are a method of encoding a division block in video encoding and a method of decoding a division block in video decoding. An input picture is divided into encoding unit blocks. The encoding unit blocks are divided into sub-blocks. The sub-blocks are encoded by selectively using at least one of intra prediction encoding and inter prediction encoding. A decoding process is performed through a reverse process of the encoding method. When pixel values of an encoding unit block are encoded in video encoding, the flexibility in selecting an encoding mode is increased and the efficiency of encoding is increased.

Abstract: A method may verify that a fuel tank cap is present and properly closed after refueling of a motor vehicle fuel tank. The method may include, in response to a request for refueling: (a1) enabling refueling of the motor vehicle fuel tank by opening a first vent valve connected in series in a vent line, downstream from a first port of a recirculation line coupled to the vent line, so that to vent the motor vehicle fuel tank to the atmosphere through a fuel vapor canister; (b1) disabling refueling of the motor vehicle fuel tank by closing the first vent valve; (c1) monitoring the internal pressure within the motor vehicle fuel tank when the refueling request is finished; and (d1) concluding that the fuel tank cap is deemed present and properly closed when the internal pressure increases and/or remains higher than the atmospheric pressure.

Abstract: Stormwater management systems, methods, and apparatus for containing and filtering runoff may be provided. In one implementation, a stormwater management crate for managing stormwater runoff may be provided. The stormwater management crate may include a top plate having a first plurality of support column attachments and one or more support column assemblies located below the top plate; the one or more support column assemblies being affixed to the top plate at the support column attachments. The stormwater management crate may further include an intermediate plate may be located below the top plate and above the bottom plate. The intermediate plate may have a third plurality of support column attachments. The intermediate plate may be lightweight and may weigh less than one or both of the top plate and the bottom plate.

Abstract: A superjunction semiconductor device having a termination structure portion surrounding an active region in a plan view. The device includes: a semiconductor substrate; a first semiconductor layer provided on the semiconductor substrate; and a parallel pn structure and a channel stopper provided in the first semiconductor layer. The channel stopper surrounds the parallel pn structure in the plan view, and contacts the parallel pn structure in the termination structure portion. The parallel pn structure includes a plurality of first columns each having a first width and a plurality of second columns each having a second width that repeatedly alternate one another parallel to the main surface. In a region of the parallel pn structure contacting the channel stopper, a product of the second width and an impurity concentration of the second columns is less than a product of the first width and an impurity concentration of the first columns.

Abstract: Various semiconductor chip devices and methods of making the same are disclosed. In one aspect, an apparatus is provided that includes a first redistribution layer (RDL) structure having a first plurality of conductor traces, a first molding layer on the first RDL structure, plural conductive pillars in the first molding layer, each of the conductive pillars including a first end and a second end, a second RDL structure on the first molding layer, the second RDL structure having a second plurality of conductor traces, and wherein some of the conductive pillars are electrically connected between some of the first plurality of conductor traces and some of the second plurality of conductor traces to provide a first inductor coil.

Abstract: A method for preparing an electronic grade sulfuric acid from a waste sulfuric acid solution includes the steps of: performing, in sequence, a concentration treatment, a cracking treatment, and a purification treatment; performing a first oxidation treatment on sulfur dioxide; performing a first absorption treatment and a second oxidization treatment; performing an evaporation treatment; performing a first removal treatment on an acid mist containing metal ions and anion impurities; performing a second absorption treatment; and performing a second removal treatment on residual sulfur dioxide.

Abstract: A thin-film solar module with a substrate and a layer structure applied thereon, which comprises a rear electrode layer, a front electrode layer, and an absorber layer arranged between the rear electrode layer and the front electrode layer, wherein serially connected solar cells are formed in the layer structure by patterning zones, wherein at least one solar cell has one or more optically transparent zones that are in each case rear-electrode-layer-free, wherein the one or more optically transparent zones are implemented such that the rear electrode layer of the solar cell is continuous.

Abstract: A power connector socket includes a main body and a lamella cage. The main body includes a socket, an opening at a side portion of the socket, and a chamber inside the socket. The lamella cage passes through the socket. The lamella cage includes a ring portion and contact lamellae. The contact lamellae outwardly extend from a side portion of the ring portion and are annularly arranged. The ring portion is in an inner side of the chamber. One of two ends of each of the contact lamellae includes a fixed end formed on the ring portion, a free end outwardly extends from the other end of each of the contact lamellae, and the free ends are positioned at a portion of the main body adjacent to the opening.

Abstract: The present invention is suitable for optical applications with excellent transparency through a haze value of 1.5% or lower and particles that are hardly visible to the naked eye, by producing a film using particles having little difference in refractive index in polyethylene terephthalate (PET), which is a commonly-used polyester film, and can provide a highly transparent optical film capable of improving a winding property by forming surface roughness of 4 nm or higher.

Abstract: A semiconductor device package includes a magnetically permeable layer having a top surface and a bottom surface opposite to the top surface. The semiconductor device package further includes a first conductive element in the magnetically permeable layer. The semiconductor device package further includes a first conductive via extending from the top surface of the magnetically permeable layer into the magnetically permeable layer to be electrically connected to the first conductive element. The first conductive via is separated from the magnetically permeable layer. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: A payment method, apparatus, and device are provided. The method includes: determining, according to geographical location information of a user, a third-party payment institute corresponding to the user's location, obtaining, through a payment server, a payment account of the third-party payment institute compatible for a local transaction, and scanning a barcode to complete a payment using the payment account. During the payment process, a DOI including information of the payment account is presented to a merchant, and the merchant extracts the payment account therein, and forwards order information and the payment account to the third-party payment institute. The third-party payment institute identifies the payment account and forwards the same to the payment server. The payment server identifies a user identity corresponding to the payment account, and then completes the payment process.