Abstract: Provided are a random access method and a terminal supporting the random access method. The terminal may monitor a state of a channel, when the state of the channel is idle, attempt a packet transmission at a first packet transmission probability, and transmit a packet including the first packet transmission probability.

Abstract: A heat pipe assembly that includes at least one axial groove heat pipe and at least one porous media heat pipe. The porous media heat pipe may be embedded into a flange of the axial groove heat pipe, or embedded into a wall of the axial groove heat pipe, or embedded into another bore of the axial groove heat pipe. The evaporator of the at least one porous media heat pipe may be located remotely and can accept a high heat flux, while a condenser of the at least one porous media heat pipe is attached to the axial groove heat pipe.

Abstract: The invention is directed to a droplet actuator device and methods for integrating gel electrophoresis analysis with pre or post-analytical sample handling as well as other molecular analysis processes. Using digital microfluidics technology, the droplet actuator device and methods of the invention provide the ability to perform gel electrophoresis and liquid handling operations on a single integrated device. The integrated liquid handling operations may be used to prepare and deliver samples to the electrophoresis gel, capture and subsequently process products of the electrophoresis gel or perform additional assays on the same sample materials which are analyzed by gel electrophoresis. In one embodiment, one or more molecular assays, such as nucleic acid (e.g., DNA) quantification by real-time PCR, and one or more sample processing operations such as sample dilution is performed on a droplet actuator integrated with an electrophoresis gel.

Abstract: The present disclosure relates to redistribution layer structures useful in semiconductor substrate packages, semiconductor package structures, and chip structures. In an embodiment, a redistribution layer structure includes a dielectric layer, an anti-plating layer, and a conductive material. The dielectric layer defines one or more trenches. The conductive material is disposed in the trench(es), and the anti-plating layer is disposed on a surface of the dielectric layer.

Abstract: The present invention relates to a method of concentrating an aqueous solution at low pressure under a zero osmotic pressure difference condition, and more particularly, to a method of concentrating an aqueous solution containing a solute to be concentrated, at low pressure under a zero osmotic pressure difference condition. The method of the present invention comprises the steps of: (a) discharging water of a solute-containing aqueous solution to be concentrated, from a reverse osmosis separator to the outside, and transferring the concentrated aqueous solution to a zero osmotic pressure difference concentrator; (b) further concentrating the concentrated aqueous solution using the zero osmotic pressure difference concentrator comprising a feed chamber and a draw chamber, which are separated from each other by a reverse osmosis membrane or a forward osmosis membrane; and (c) recovering the solute and water from the aqueous solution further concentrated in the zero osmotic pressure difference concentrator.

Abstract: An interlock circuit utilizes a single combinatorial pseudo-dynamic logic gate to take inputs from two voltage domains at the same time without requiring either input to be level shifted. The interlock design allows hold timing to be met across a large voltage range of both supplies in a dual-voltage supply environment while not significantly hurting setup time by having much lower latency than the latency of a level shifter.

Abstract: A semiconductor device package comprises a substrate, a first electronic component, first and second conductive pads, a first frame board, an encapsulation layer, and a conductive layer. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component, the first and second conductive pads, and the first frame board are on the first surface of the substrate. The first frame board surrounds the first electronic component and comprises a first conductive via and a second electronic component. The encapsulation layer encapsulates the first electronic component and the first frame board. The conductive layer is on the first frame board and the encapsulation layer. The first conductive via is electrically connected to the second conductive pad and the conductive layer, and the second electronic component is electrically connected to the first conductive pad.

Abstract: A semiconductor package structure includes a substrate, a semiconductor element, an encapsulant, an adhesion layer and a metal cap. The semiconductor element is disposed on the substrate. The encapsulant covers the semiconductor element. The adhesion layer is disposed on the encapsulant. The metal cap is attached to the encapsulant by the adhesion layer, and the metal cap is conformal with the encapsulant.

Abstract: Methods, devices, and systems for transmitting data over a computer communications network are disclosed. A queue of communications commands can be pre-generated using a central processing unit (CPU) and stored in a device memory of a network interface controller (NIC). Thereafter, if a graphics processing unit (GPU) has data to communicate to a remote GPU, it can store the data in a send buffer, where the location in the buffer is pointed to by a pre-generated command. The GPU can then signal to the interface device that the data is ready, triggering execution of the pre-generated command to send the data.

Abstract: The present disclosure relates to the technical field of semiconductor processes, and discloses a semiconductor device and a manufacturing method therefor.

Abstract: Disclosed herein are a multifunctional optical element and method using multiple light scattering. An optical control method using multiple light scattering may include the steps of splitting coherent light into a signal beam and a reference beam, controlling the wavefront of the signal beam, forming an interference pattern by making the signal beam having the controlled wavefront and the reference beam incident on photorefractive materials, recording the interference pattern on the photorefractive materials, reconstructing the signal beam having the controlled wavefront by the interference pattern by radiating the reference beam to the photorefractive materials on which the interference pattern has been recorded again, and controlling the properties of light passing through complex media based on multiple light scattering generated by the complex media as the reconstructed signal beam is incident on the complex media.

Abstract: A system and method for motivating a particle, for example a drug molecule, to a predetermined location in three dimensional space by applying magnetic fields, which may be static or time-varying, to the particle. The magnetic fields may be applied by one or a plurality of magnets, and may be multipole of any order such as octopole or decapole. The electric current driving the magnet coils may be pulsed for inducing a voltage in the molecules to aid in motivation. In an exemplary embodiment of the invention in which the substance is a drug, for example a drug molecule or plurality of drug molecules, the magnets may be positioned outside the body of the person to be treated, and the magnetic field(s), which may be time-varying, are used to motivate the drug molecule(s) to a predetermined location in an animal's body. The animal may be a human.

Abstract: A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.

Abstract: A laminate sheet includes at least one base layer including a first thermoplastic resin; and at least one metallic resin layer disposed on one side or both sides of the base layer and including a second thermoplastic resin and a metal-resin composite particles, wherein the first thermoplastic resin and the second thermoplastic resin are the same or different from each other, the metal-resin composite particles includes a metal deposition layer, a first coating layer positioned on one side of the metal deposition layer, and a second coating layer positioned on the other side of the metal deposition layer, and each of the first coating layer and the second coating layer includes a thermosetting resin. A method of manufacturing the laminate sheet, an article using the laminate sheet and a method of manufacturing the article are also provided.

Abstract: An electrical plug connector includes a metallic shell, an insulated housing, a grounding plate, a first terminal module, a second terminal module, and a molding block. The first terminal module includes first plug terminals and a first combining block. The second terminal module includes second plug terminals and a second combining block. The insulated housing is received in the metallic shell. The first and the second combining blocks are respectively combined with the first plug terminals and the second plug terminals by insert-molding techniques. Then, the first combining block and the second combining block are respectively assembled to the grounding plate. Next, the molding block is provided to combine the first combining block with the second combining block, so that an assembly of the first terminal module, the second terminal module, and the grounding plate can be firmly assembled to the rear of the insulated housing.

Abstract: A laminated antenna includes a bases board having a grounding port and a feed-in port, a feed-in portion on the base board, a dielectric layer, a conductive layer, and a second winding portion. The feed-in portion has opposite first and second ends. The first end is connected to the feed-in port. The dielectric layer has a covering surface covering the feed-in portion and an assembling surface. The conductive layer is on the assembling surface. The conductive layer includes a main radiation portion, an extension radiation portion, and a first winding portion. A segment of the main radiation portion is overlapped with the second end to form a coupling capacitor. The first winding portion is extending between the main radiation portion and the extension radiation portion to form a first inductor. The second winding portion is connected between the main radiation portion and the grounding port to form a second inductor.

Abstract: The present disclosure described herein pertain generally to a method for stabilizing and improving a soil by using a high-molecular viscous biopolymer, a soil composition for promoting germination or growth of vegetation, a composition for preventing soil erosion, and a soil construction material and member.

Abstract: A processor system includes first and second regulators for regulating an adjusted supply voltage. In one embodiment, the regulator system comprises a digital low-dropout (DLDO) control system comprising first and second regulators that generate a plurality of control signals to regulate an adjusted power supply voltage and that generate a charge when a droop level falls below a droop threshold value. The first regulator implements a first control loop and the second regulator implements a second and much faster acting control loop. A supply adjustment block with the two regulators and control loops are provided for each processor core allowing different cores to have different regulated supply levels all based on one common supply.