Abstract: A current sensor integrated circuit configured to sense a current through a current conductor includes a lead frame at least one signal lead, a fan out wafer level package (FOWLP), and a mold material enclosing the FOWLP and a portion of the lead frame. The FOWLP includes a semiconductor die configured to support at least one magnetic field sensing element to sense a magnetic field associated with the current, wherein the semiconductor die has a first surface on which at least one connection pad is accessible, a redistribution layer in contact with the at least one connection pad, and an insulating layer in contact with the redistribution layer, wherein the insulating layer is configured to extend beyond a periphery of the semiconductor die by a minimum distance. The die connection pad is configured to be electrically coupled to the at least one signal lead.

Abstract: In one aspect, a magnetic-field sensor includes main coil circuitry configured to generate a first magnetic field signal at a first frequency. A reflected signal is generated from a target caused by the first signal generated by the main coil circuitry. The magnetic field sensor also includes magnetoresistance circuitry configured to receive an error signal. The error signal is formed from a combination of the reflected signal and a second magnetic field signal. The magnetic-field sensor further includes analog circuitry configured to receive an output signal from the magnetoresistance circuitry, digital circuitry configured to receive an output signal from the analog circuitry, a mixer configured to receive a feedback signal from one of the digital circuitry or the analog circuitry, and secondary coil circuitry configured to receive a driver signal from the mixer causing the secondary coil circuitry to generate the second magnetic field signal at the first frequency.

Abstract: A method for use in a sensor includes generating a first signal by a first sensing module in response to a magnetic field associated with a rotating target, generating a base word based on the first signal, the base word including a first base bit that is generated by comparing respective components of the first signal, reversing a respective polarity of the first signal and offsetting the first signal, generating a test word based on the first signal, the test word being generated after the respective polarity of the first signal is reversed and the first signal is offset, the test word including a first test bit that is generated by comparing the respective components of the first signal, and setting a value of an error signal based on whether the test word matches the base word.

Abstract: A motor control system includes a gate driver motor controller and a microcontroller configured to generate a commutation command signal for coupling to the gate driver motor controller. The gate driver motor controller includes a current measurement circuit to measure current in each of three current paths corresponding to three motor windings, an interface to transmit a first subset of the measured currents corresponding to a first subset of the current paths, and a calibrator to calibrate a current path that is not part of the first subset of current paths when the first subset of the measured currents is transmitted. The microcontroller includes an interface to receive the first subset of measured currents and a processor to compute the current in the current path that is not part of the first subset of current paths based on the first subset of measured currents.

Abstract: Methods and apparatus for an arrayed time to digital converter (TDC) having matched delay line sampling. In embodiments, a TDC includes a coarse counter circuit to provide an event coarse timing measurement for an event, a coarse counter delivery network to deliver a count value in the coarse counter circuit to a memory storage element circuit, and an array of matched delay lines to provide an event fine timing measurement to the memory storage element circuit. An array of event sample signal generators can generate signals for the event and an array of encoders can encode fine timing measurement information from the memory storage element circuit, where an output of the encoder and the event coarse timing measurement information provide a timestamp for the event. A global delay-locked loop can incorporate a matched delay line coupled to the array of matched delay lines.

Abstract: In one aspect, bridge circuitry includes a first magnetoresistance (MR) element; a second MR element connected in series with the first MR element at a first node; a third MR element; a fourth MR element connected in series with the third MR element at a second node; a first switch connected at one end to a supply voltage and connected at the other end to the third MR element; a second switch connected at one end to ground and connected at the other end to the fourth MR element; a third switch connected at one end to ground and connected at the other end to the third MR element and the first switch; and a fourth switch connected at one end to the supply voltage and the other end to the fourth MR element and the second switch. The first and second MR elements are in parallel with the third and fourth MR elements.

Abstract: An apparatus including; a substrate; an isolator that is formed over the substrate, the isolator including a silicon shield layer that is formed between a first buried oxide (BOX) layer and a second BOX layer; a silicon layer having an oxide trench structure formed therein, the oxide trench structure being arranged to define a first silicon island and a second silicon island; a first electronic circuit that is formed over the first silicon island; and a second electronic circuit that is formed over the second silicon island, the first electronic circuit being electrically coupled to the first electronic circuit.

Abstract: In one aspect, an angle sensor includes a first linear sensor and a second linear sensor. A first magnetic-field direction of a target magnet measured by the first linear sensor is substantially equal to a second magnetic-field direction of the target magnet measured by the second linear sensor. The first linear sensor, the second linear sensor and the target magnet are on an axis. The angle sensor determines an angle of a magnetic field.

Abstract: A current sensor system, includes: a plurality of conductors that are integrated into a substrate, each of the plurality of conductors having a respective first through-hole formed therein and a plurality of current sensors, each of the plurality of current sensors being disposed on the substrate. Each of the plurality of current sensors is disposed above or below the respective first through-hole of a different one of the plurality of conductors, and the substrate includes a plurality of conductive traces, each coupled to at least one of the plurality of current sensors.

Abstract: Methods and apparatus for linear inductive torque sensing that may include transmitting an AC magnetic field with a transmit coil toward a conductive target and receiving a field reflected by the conductive target with a receive coil, wherein the conductive target comprises first and second targets positioned with respect to each other and each shaped to linearly increase or decrease an amount of conductive area of the conductive target due to relative movement of the first and second targets which changes an amount of the field reflected by the conductive target. A signal from the receive coil can be processed to determine a relative position of the first and second targets corresponding to an amount of torque on an elongate member connected to the first and second targets. In other embodiments, a change in inductance of the transmit coil is measured to determine relative target position.

Abstract: Methods and apparatus for temperature sensing in a detector system. Dark current from pixels in a pixel array of the detector system can be filtered to remove noise and processed to determine a temperature of the pixel array from the filtered dark current. Calibration of the dark current for a range of temperatures can be performed. In embodiments, the pixels comprise photodiodes.

Abstract: In one aspect, an integrated circuit (IC) includes a magnetic-field sensor. The magnetic-field sensor includes digital circuitry that includes a first and second analog-to-digital converter (ADC). The digital circuitry is configured to receive a first and second analog output signals and, using the first and second ADC, configured to convert the first and second analog output signals to a first and second digital signals. The magnetic-field sensor also includes diagnostic circuitry configured to receive, from the digital circuitry, an input signal related to the first and/or the second digital signals and configured to provide a test signal at a pin of the IC. In response to a range parameter, the diagnostic circuitry is further configured to provide the test signal comprising a range of codes from the first and/or the second ADC corresponding to the range parameter.

Abstract: Methods and apparatus for a sensor including a series of tunneling magnetoresistance (TMR) pillars and a heatsink adjacent to at least one of the TMR pillars, where the heatsink comprises Titanium Nitride (TiN).

Abstract: A method includes forming a plurality of identical arrays on a semiconductor wafer, each array having a plurality of detectors, screening each of the plurality of arrays to determine an operational status of each of the plurality of arrays, and selecting one of the plurality of arrays for use based on the determination of the operational status of the plurality of arrays. Also described is a focal plane array including a circuit having a plurality of electrical contacts and a die including a plurality of identical arrays, each including a plurality of detectors. The plurality of identical arrays includes at least one selected array that is fully functional and at least one non-selected array that is not fully functional and the selected array is positioned with respect to the circuit so that the detectors of the selected array contact the plurality of electrical contacts of the circuit.

Abstract: A magnetic field angle sensor includes a coil configured to generate a magnetic field that induces an eddy current in a rotatable target, a first magnetic field sensing structure positioned proximate to the coil and configured to detect a reflected magnetic field generated by the eddy current induced in the target, a second magnetic field sensing structure positioned proximate to the coil and configured to detect the reflected magnetic field generated by the eddy current induced in the target, wherein the first and second magnetic field sensing structures are configured to detect quadrature components of the reflected magnetic field, and a processing module configured to process the reflected magnetic field detected by the first and second magnetic field sensing structures for determining an angular position of the target.

Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by one or more magnetic sensing elements supported by a semiconductor die adjacent to the primary conductor. A method of fabricating the packaged current sensor integrated circuit includes partially encasing the lead frame in a first mold material, applying an insulator to one or more die attach pads, attaching a die to the insulator, electrically connecting the die to secondary leads, and providing a second mold to the subassembly. The package is configured to provide increased voltage isolation.

Abstract: A sensor, comprising: a substrate having a reference crystal orientation and a plurality of vertical Hall element pairs that are formed on the substrate. Each vertical Hall element pair includes: (i) a respective first vertical Hall element that is oriented at a respective first angle relative to the reference crystal orientation of the substrate and (ii) a respective second vertical Hall element that is oriented at a respective second angle relative to the reference crystal orientation of the substrate. The substrate has a rectangular shape, and each of the vertical Hall element pairs is disposed in a different respective corner of the substrate.

Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. The primary current path contains a mechanical locking feature. The thickness of the molded body of the package is reduced to improve vibration immunity.

Abstract: A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.

Abstract: Systems, methods, and apparatuses for magnetic field sensors with self-test include a detection circuit to detect speed and direction of a target. One or more circuits to test accuracy of the detected speed and direction may be included. One or more circuits to test accuracy of an oscillator may also be included. One or more circuits to test the accuracy of an analog-to-digital converter may also be included. Additionally, one or more IDDQ and/or built-in-self test (BIST) circuits may be included.