Abstract: In one aspect, a double-diffused metal oxide semiconductor (DMOS) includes a region of a semiconductor having a first region of a semiconductor having a first-type dopant, a first well having a second-type dopant, a dielectric within the first well, the dielectric having a bottom surface and a top surface opposite the bottom surface, a gate disposed on the top surface of the dielectric. The gate, the dielectric and the first well are configured to form a first reduced surface field (RESURF). The bottom surface of the dielectric has a first portion and a second portion, and the first portion of the bottom surface of the dielectric is closer to the top surface of the dielectric than the second portion of the bottom surface of the dielectric.

Abstract: In one aspect, a bridge includes at least eight sets of sub-arrays. Each one of the at least eight sets of sub-arrays forms a corresponding one magnetoresistance element. Each one of the at least eight sets of sub-arrays has a reference direction. The at least eight sets of sub-arrays are arranged in a matrix on a die. A reference direction of each one of the at least eight sets of sub-arrays is different from a reference direction of at least one other of the at least eight sets of sub-arrays.

Abstract: Aspects of the present disclosure include galvanically-isolated (voltage-isolated) transformer-based integrated circuit (IC) packages providing cavities or spaces for an included magnetic core to underdo size changes due to magnetostriction without being constrained or substantially constrained, thus, providing for improved magnetic performance. The circuits, ICs and IC packages and modules may include various types of circuits. In some examples, IC packages or modules may include a galvanically-isolated gate driver or other high voltage circuit.

Abstract: A system, comprising: a reference magnetic field source that is configured to generate a reference magnetic field; a plurality of magnetic field sensing elements arranged in a sensing bridge, the sensing bridge being configured to sense the reference magnetic field and an external magnetic field simultaneously, the sensing bridge being configured to output a first signal and a second signal; a first circuit that is configured to generate a common mode signal of the sensing bridge based on the first signal and the second signal; an adjustment circuit that is configured to adjust a sensitivity of the sensing bridge based, at least in part, on a common mode signal of the sensing bridge; and a processing circuitry that is configured to use a differential signal of the sensing bridge to generate an output signal, the differential signal being based on a strength of the external magnetic field.

Abstract: A sensor integrated circuit includes a sensing element configured to generate a sensor output signal proportional to a sensed parameter, a front-end amplifier coupled to receive the sensor output signal and configured to generate an amplifier output signal, and a sigma-delta modulator coupled to receive the amplifier output signal and configured to generate a digital sensor output signal indicative of the sensed parameter. At least one of the front-end amplifier or the sigma-delta modulator has an adjustable setting configured to change a resolution of the digital sensor output signal.

Abstract: Methods and apparatus for a magnetic field sensor having a first set of MR elements configured to change in resistance due to an applied magnetic field having an orientation in a sensitive axis of the first set of MR elements and a second set of MR elements that are immune to the applied magnetic field. The second set of MR elements is configured to change in resistance due to temperature. A processor can compensate for the response of the first set of MR elements based on the temperature information from the second set of MR elements.

Abstract: Methods and apparatus for a signal isolator that mitigates the effects of CMTI strikes. In embodiments, a first die comprises a transmit module and the first die has a first voltage domain; and a second die comprises a receive module including a receive amplifier configured to receive from the transmit module a transmit signal that includes a differential signal and a common mode current. The second die may have a second voltage domain with the first and second die being separated by an isolation barrier. In embodiment, the receive amplifier includes a differential amplifier to receive the differential input signal from the transmit module; and a common mode module configured to sense the common mode current and sink or source the common mode current and minimize changes to an input impedance of the receive amplifier.

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

Abstract: A current sensor assembly can include: a coil structure having a first coil and a second coil connected in series, the coil structure configured to generate a differential magnetic field responsive to an electrical current passing through the first and second coils; a first magnetic field sensing element disposed proximate to the first coil and operable to generate a first signal responsive to the differential magnetic field passing through the first magnetic field sensing element in a first direction; a second magnetic field sensing element disposed proximate to the second coil and operable to generate a second signal responsive to the differential magnetic field passing through the second magnetic field sensing element in a second direction; and a circuit operable to subtract the first and second signals to generate a differential signal proportional to the electrical current.

Abstract: A semiconductor package, comprising: a substrate; an analog circuitry that is formed on the substrate; a first heating element that is formed on the substrate; a first temperature sensing element that is formed on the substrate; a first heating control circuitry that is formed on the substrate, the first heating control circuitry being configured to detect whether a first temperature measurement that is taken with the first temperature sensing element is below a first threshold, and turn on the first heating element in response to detecting that the first temperature measurement is below the first threshold, the first heating element being turned on only when the first temperature measurement is below the first threshold; and an encapsulating material configured to encapsulate the substrate, the analog circuitry, the first temperature sensing element, the first heating element, and the first heating control circuitry.

Abstract: A buffer includes a first branch to receive a digital input signal and generate a first intermediate signal having falling edges that are delayed and faster than rising edges of the digital input signal and rising edges that are substantially coincident with falling edges of the digital input signal and a second branch to receive the digital input signal and generate a second intermediate signal having rising edges that are delayed and faster than falling edges of the digital input signal and falling edges that are substantially coincident with rising edges of the digital input signal. An output stage has a first input to receive the first intermediate signal, a second input to receive the second intermediate signal, and an output at which a buffer output signal is provided as a delayed version of the digital input signal having faster rising and falling edges than the digital input signal.

Abstract: A current sensor IC includes a lead frame having a first surface, a second opposite surface and including a primary conductor and signal leads. A first semiconductor die has a first surface adjacent to the first surface of the lead frame and supporting a first magnetic field sensing element and a second semiconductor die has a first surface adjacent to the second surface of the lead frame and a second opposite surface supporting a second magnetic field sensing element. Fabrication methods include a single mold method and a two-mold method in which a mold material can provide isolation between the first semiconductor die and the primary conductor. Also described is a current sensor IC in which both first and second semiconductor die are arranged in a flip-chip configuration. Diagnostic circuits and inter-die connections permit one semiconductor die to sense faults with the other semiconductor die.

Abstract: Magnetic angular sensor element destined to sense an external magnetic field, including a magnetic tunnel junction containing a ferromagnetic pinned layer having a pinned magnetization, a ferromagnetic sensing layer, and a tunnel magnetoresistance barrier layer; the ferromagnetic sensing layer including a first sensing layer being in direct contact with the barrier layer and having a first sensing magnetization, a second sensing layer having a second sense magnetization, and a metallic spacer between the first sensing layer and the second sensing layer; wherein the metallic spacer is configured to provide an antiferromagnetic coupling between the first sensing magnetization and the second sensing magnetization such that the first sensing magnetization is oriented substantially antiparallel to the second sensing magnetization; the second sensing magnetization being larger than the first sensing magnetization, such that the second sensing magnetization is oriented in accordance with the direction of the externa

Abstract: A system, comprising: a conductor having a pair of primary surfaces, the conductor including a through-hole formed therein, the conductor including a first notch that is formed adjacent to the through-hole; and a printed circuit board that is inserted in the through-hole, the printed circuit board having a current sensor mounted thereon, the current sensor being disposed inside the through-hole, the current sensor including a first magnetic field sensing element and a second magnetic field sensing element having respective axes of maximum sensitivity that are substantially perpendicular to the primary surfaces of the conductor.

Abstract: In one aspect, a bridge includes at least eight sets of sub-arrays. Each one of the at least eight sets of sub-arrays forms a corresponding one magnetoresistance element. Each one of the at least eight sets of sub-arrays has a reference direction. The at least eight sets of sub-arrays are arranged in a matrix on a die. A reference direction of each one of the at least eight sets of sub-arrays is different from a reference direction of at least one other of the at least eight sets of sub-arrays.

Abstract: A method comprising: transmitting a data block that is part of a message, the data block including a plurality of data block symbols; detecting a duration of an end portion of the message, the duration being detected based on a difference between: (i) a time that is allotted for transmitting the message and (ii) a time needed for transmitting the data block as well as any other element of the message that precedes the end portion; and transmitting one or more auxiliary data symbols as part of the end portion of the message, wherein the end portion has a flexible duration that is selected to synchronize a total duration of the message to the time that is allotted for transmitting the message, and wherein each of the data block symbols and each of the auxiliary data symbols is encoded by using pulse-width modulation (PWM).

Abstract: Split-detector lidar photoreceivers are described which utilize range-dependent focus to transition from illuminating two detector elements with returns from near targets, within a close-range threshold distance, to illuminating just one detector element for all other returns. In some examples, a split-detector can have or include a “bullseye” (concentric) detector configuration. Because two separate detector elements with separate amplifier chains are used, one channel can be optimized for the strong to and near-target returns, while another channel can be optimized and used for all other returns.

Abstract: According to one aspect of the disclosure, a method includes: receiving, by a magnetic field sensor, first and second magnetic field signals responsive to motion of a target; generating first and second digital pulse signals responsive to the first and second magnetic field signals, respectively; calculating a first time between a pulse edge of the first digital pulse signal and a next pulse edge of the second digital pulse signal; calculating a second time between two different pulse edges of the first digital pulse signal or two different pulse edges of the second digital pulse signal; calculating, using the calculated first and second times, a phase shift between the first and second magnetic field signals; and generating, using the calculated phase shift, a third magnetic field signal having a predetermined phase shift from the first magnetic field signal or from the first magnetic field signal.

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

Abstract: In one aspect, a magnetic-field biosensor includes an insulator and a plurality of magnetic-field sensing elements that includes a first and a second magnetic-field sensing elements. The insulator has a first and a second plurality of portions, and the second plurality of portions is thicker than the first plurality of portions. The magnetic-field biosensor further includes a first receptor configured to attach to biological material and being on a first portion of the first plurality of portions and directly above the first magnetic-field sensing element; and a second receptor configured to attach to the biological material and being on a first portion of the second plurality of portions and directly above the second magnetic-field sensing element. Outputs of the first and the second magnetic-field sensing elements are used to sense a magnetic field from a first magnetic nanoparticle by reducing an effect of an applied magnetic field.