Abstract: The present invention provides a backlight unit including an LED module and a frame separately, and each separated part is stable and is capable of simple use and assembly. The backlight unit of direct type includes a plurality of makeup LED modules including an LED package of direct type on a PCB and a heat sink releasing heat generated from driving the LED package of direct type, a reflection plate reflecting light emitted from the makeup LED module to a front face, and attached at the remaining surface except for the makeup LED packages, an optical sheet disposed on the reflection plate, and improving brightness and uniformity of the light emitted from the makeup LED module and the reflection plate, and guide the light into a front face of the optical sheet and a frame including a guide rail to combine the makeup LED module by a sliding combination.

Abstract: A method for manufacturing a lens for a light emitting diode (LED) package is disclosed. The method for manufacturing a lens for an LED package includes: forming a dome lens on each of a plurality of LED packages placed on a fixing plate, the dome lens made of silicon; forming a concave groove in the dome lens by using a jig for pressing the dome lens; curing the dome lens; and removing the LED packages from the fixing plate.

Abstract: A high power light emitting diode (“LED”) package is disclosed. The high power LED package includes a housing made of an insulating material and having a cavity in its central portion; a lead frame made of a conductive material, including an inner lead exposed by the cavity of the housing and an outer lead extending outside the housing; a heat sink above which the inner lead is placed and having a portion exposed by the cavity of the housing; an LED chip mounted on the exposed portion of the heat sink and electrically connected to the inner lead; a lens portion coupled to the housing to cover the cavity of the housing; and an insulating adhesive sheet interposed between the inner lead and the heat sink for electrically insulating and thermally coupling the inner lead and the heat sink.