Electronic component cooling apparatus

- AMA Precision Inc.
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of an electronic component cooling apparatus showing the new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken line shown in FIG. 5 is for illustrative purposes only and forms no part of the claimed design.

Claims

The ornamental design for an electronic component cooling apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
D467559 December 24, 2002 Lee
6779595 August 24, 2004 Chiang
6883592 April 26, 2005 Lee
6918429 July 19, 2005 Lin et al.
6955214 October 18, 2005 Wang
D533145 December 5, 2006 O'Sullivan et al.
20020043360 April 18, 2002 Lee
20030019610 January 30, 2003 Liu
Patent History
Patent number: D585393
Type: Grant
Filed: Oct 21, 2007
Date of Patent: Jan 27, 2009
Assignee: AMA Precision Inc. (Taipei)
Inventors: Yuh-Wen Jeng (Taipei), Guo-Shiung Tzeng (Taipei)
Primary Examiner: Selina Sikder
Attorney: Jianq Chyun IP Office
Application Number: 29/296,449
Classifications
Current U.S. Class: Heat Sink (D13/179)