Abstract: Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant.

Abstract: Methods for making packages and leadframes are enclosed. The package includes a die, a die pad, leads, bond wires, and an encapsulant. The lower surfaces of the die pad and leads are provided with a stepped profile by an etching step that etches partially through the thickness of a peripheral portion of the die pad, and also etches partially through the thickness of portions of the leads. Encapsulant material is applied by molding or liquid encapsulation techniques. The encapsulant material fills in beneath the recessed, substantially horizontal surfaces of the die pad and leads formed by the above-described partial etching step, and thereby prevents the die pad and leads from being pulled vertically from the package body. Other surface of the die pad and leads are not covered during the encapsulation step, but rather remain exposed at the lower surface of the package for connecting the package externally.

Abstract: Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts,.bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant.