Patents Assigned to Amkor Technology
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Publication number: 20230282532Abstract: In one example, a semiconductor device includes a substrate comprising a conductive structure including internal terminals over a substrate first side and external terminals over a substrate second side coupled to the internal terminals. An electronic component includes an electronic component first side, an electronic component second side opposite to the electronic component first side, and an electronic component lateral side connecting the electronic component first side to the electronic component second side. The electronic component second side is coupled to one or more of the internal terminals. A guide structure is over the substrate first side and can include an inner portion that is laterally inward from the electronic component lateral side and an outer portion that is laterally outward from the electronic component lateral side. An underfill is interposed between the electronic component second side and the substrate first side and is over the guide structure.Type: ApplicationFiled: May 12, 2023Publication date: September 7, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Wang Gu LEE, Gam Han YONG, Ju Hong SHIN, Ji Hun YI
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Patent number: 11749637Abstract: In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: June 23, 2020Date of Patent: September 5, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Min Ho Kim, Seok Ho Na, Dong Hyeon Park, Choong Hoe Kim, Woo Kyung Ju, Yun Seok Song, Dong Su Ryu
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Patent number: 11749654Abstract: In one example, a semiconductor structure comprises a redistribution structure comprising a conductive structure, a cavity substrate on a top side of the redistribution structure and having a cavity and a pillar contacting the redistribution structure, an electronic component on the top surface of the redistribution structure and in the cavity, wherein the electronic component is electrically coupled with the conductive structure, and an encapsulant in the cavity and on the top side of the redistribution structure, contacting a lateral side of the electronic component, a lateral side of the cavity, and a lateral side of the pillar. Other examples and related methods are also disclosed herein.Type: GrantFiled: November 8, 2021Date of Patent: September 5, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gi Tae Lim, Jae Yun Kim, Myung Jea Choi
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Patent number: 11742300Abstract: In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.Type: GrantFiled: June 7, 2022Date of Patent: August 29, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Ji Hoon Oh, Dong Hyun Bang, Soo Jin Shin, Young Ik Kwon, Tae Kyeong Hwang, Min Jae Lee, Min Jae Kong
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Patent number: 11742565Abstract: A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.Type: GrantFiled: August 18, 2021Date of Patent: August 29, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Tae Yong Lee, Doo Soub Shin, Seon A Lee, Woo Bin Jung, Ji Yeon Ryu, Jin Young Khim
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Patent number: 11742327Abstract: A packaged semiconductor device includes a substrate with first and second opposing major surfaces. A stacked semiconductor device structure is connected to the first major surface and includes a plurality of semiconductor die having terminals. Conductive interconnect structures electrically connect the terminals of the semiconductor dies together. The semiconductor dies are stacked together so that the terminals are exposed, and the stacked semiconductor device structure comprises a stepped profile. The conductive interconnect structures comprise a conformal layer that substantially follows the stepped profile.Type: GrantFiled: May 20, 2021Date of Patent: August 29, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Shaun Bowers, Ramakanth Alapati
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Patent number: 11742216Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.Type: GrantFiled: August 27, 2020Date of Patent: August 29, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
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Publication number: 20230260863Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.Type: ApplicationFiled: April 26, 2023Publication date: August 17, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Se Man Oh, Kyoung Yeon Lee, Sang Hyeon Lee, Min Cheol Shin
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Patent number: 11728280Abstract: In one example, an electronic device includes a substrate comprising a substrate top side, a substrate bottom side, and outward terminals. An electronic component is connected to the outward terminals. External interconnects are connected to the outward terminals and include a first external interconnect connected to a first outward terminal. A lower shield is adjacent to the substrate bottom side and is laterally between the external interconnects. The lower shield is electrically isolated from the first external interconnect by one or more of 1) a dielectric buffer interposed between the lower shield and the first external interconnect; or 2) the lower shield including a first part and a second part, the first part being laterally separated from the second part by a first gap, wherein the first part laterally surrounds lateral sides of the first external interconnect; and the second part is vertically interposed between the first outward terminal and the first external interconnect.Type: GrantFiled: January 15, 2021Date of Patent: August 15, 2023Assignee: Amkor Technology Singapore Holding Pte. Lid.Inventors: Min Won Park, Tae Yong Lee, Ji Hun Yi, Cheol Ho Lee
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Publication number: 20230245937Abstract: In one example, a semiconductor device comprises a main substrate comprising a first side and a main conductive structure, and a first component module over the first side of the main substrate. The first component module comprises a first electronic component and a first module encapsulant contacting a lateral side of the first electronic component. The semiconductor device further comprises a second component module over the first side of the main substrate. The second component module comprises a second electronic component and a second module encapsulant contacting a lateral side of the second electronic component. The semiconductor device further comprises a main encapsulant over a first side of the main substrate and between the first component module and the second component module. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: April 11, 2023Publication date: August 3, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventor: Cheol Ho Lee
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Publication number: 20230240457Abstract: An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer. In one embodiment, a package body encapsulates the top surface of the insulating material and the electronic device, wherein the land bottom surfaces are exposed to the outside of the package body.Type: ApplicationFiled: December 22, 2020Publication date: August 3, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Won Bae BANG, Byong Jin KIM, Gi Jeong KIM, Ji Young CHUNG
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Patent number: 11715676Abstract: A packaged electronic device includes a substrate comprising a die pad and a lead spaced apart from the die. An electronic device is attached to the die pad top side. A conductive clip is connected to the substrate and the electronic device, and the conductive clip comprises a plate portion attached to the device top side with a conductive material, a clip connecting portion connected to the plate portion and the lead, and channels disposed to extend inward from a lower side of the plate portion above the device top side. The conductive material is disposed within the channels. In another example, the plate portion comprises a lower side having a first sloped profile in a first cross-sectional view such that an outer section of the first sloped profile towards a first edge portion of the plate portion is spaced away from the electronic device further than an inner section of the first sloped profile towards a central portion of the plate portion. Other examples and related methods are also disclosed herein.Type: GrantFiled: January 22, 2021Date of Patent: August 1, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventor: Kenji Nishikawa
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Patent number: 11715699Abstract: In one example, a semiconductor device, comprises a first redistribution layer (RDL) substrate comprising a first dielectric structure and a first conductive structure through the first dielectric structure and comprising one or more first conductive redistribution layers, an electronic component over the first RDL substrate, wherein the electronic component is coupled with the first conductive structure, a body over a top side of the first RDL substrate, wherein the electronic component is in the body, a second RDL substrate comprising a second dielectric structure over the body, and a second conductive structure through the second dielectric structure and comprising one or more second conductive redistribution layers, and an internal interconnect coupled between the first conductive structure and the second conductive structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: March 17, 2020Date of Patent: August 1, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Young Khim, Won Chul Do, Sang Hyoun Lee, Ji Hun Yi, Ji Yeon Ryu
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Patent number: 11715714Abstract: In one example, a semiconductor device structure relates to an electronic device, which includes a device top surface, a device bottom surface opposite to the device top surface, device side surfaces extending between the device top surface and the device bottom surface, and pads disposed over the device top surface. Interconnects are connected to the pads, and the interconnects first regions that each extend from a respective pad in in an upward direction, and second regions each connected to a respective first region, wherein each second region extends from the respective first region in a lateral direction. The interconnects comprise a redistribution pattern on the pads. Other examples and related methods are also disclosed herein.Type: GrantFiled: August 20, 2021Date of Patent: August 1, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Yeong Beom Ko, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim
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Publication number: 20230230890Abstract: In one example, an electronic device comprises a base substrate comprising a base substrate conductive structure, a first electronic component over a first side of the base substrate, an encapsulant over the first side of the base substrate, wherein the encapsulant contacts a lateral side of the electronic component, an interposer substrate over a first side of the encapsulant and comprising an interposer substrate conductive structure, and a vertical interconnect in the encapsulant and coupled with the base substrate conductive structure and the interposer substrate conductive structure. A first one of the base substrate or the interposer substrate comprises a redistribution layer (RDL) substrate, and a second one of the base substrate or the interposer substrate comprises a laminate substrate. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: January 20, 2023Publication date: July 20, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Seung Nam Son, Dong Hyun Khim, Jin Kun Yoo
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Patent number: 11700692Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<1/2×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.Type: GrantFiled: August 6, 2021Date of Patent: July 11, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Patent number: 11694946Abstract: In one example, a semiconductor device includes a substrate having leads that include lead terminals, lead steps, and lead offsets extending between the lead steps so that at least some lead steps reside on different planes. A first electronic component is coupled to a first lead step side and includes a first electronic component first side, and a first electronic component second side opposite to the first electronic component first side. A second electronic component is coupled to a second lead step side, and includes a second electronic component first side, and a second electronic component second side opposite to the second electronic component first side. An encapsulant encapsulates the first electronic component, the second electronic component, and portions of the substrate. The lead terminals are exposed from a first side of the encapsulant. Other examples and related methods are also disclosed herein.Type: GrantFiled: May 24, 2021Date of Patent: July 4, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jae Min Bae, Hyung Jun Cho, Seung Woo Lee
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Patent number: 11694906Abstract: In one example, a semiconductor device can comprise a unit substrate comprising a unit conductive structure and a unit dielectric structure, and an electronic component coupled to the unit conductive structure. The unit substrate can comprise a portion of a singulated subpanel substrate of a panel substrate. Other examples and related methods are also disclosed herein.Type: GrantFiled: January 22, 2020Date of Patent: July 4, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jae Yoon Kim, Ji Hun Lee, Suresh Jayaraman, David Hiner, Won Chul Do, Jin Young Khim, Ju Hong Shin, Kye Ryung Kim
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Patent number: 11688657Abstract: In one example, a semiconductor device includes a substrate having a substrate first side, a substrate second side opposite to the substrate first side, and a conductive structure including internal terminals over the substrate first side; and external terminals over the substrate second side and coupled to the internal terminals. An electronic component includes an electronic component first side, an electronic component second side opposite to the electronic component first side, and an electronic component lateral side connecting the electronic component first side to the electronic component second side. The electronic component second side is coupled to one or more of the internal terminals. A guide structure is over the substrate first side and can include an inner portion that is laterally inward from the electronic component lateral side and an outer portion that is laterally outward from the electronic component lateral side.Type: GrantFiled: February 10, 2021Date of Patent: June 27, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Wang Gu Lee, Gam Han Yong, Ju Hong Shin, Ji Hun Yi
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Publication number: 20230197769Abstract: A method for forming a packaged electronic device includes providing a substrate having a first major surface and an opposing second major surface. The method includes attaching an electronic device to the first major surface of the substrate and providing a first conductive structure coupled to at least a first portion of the substrate. The method includes forming a dielectric layer overlying at least part of the first conductive structure. The method includes forming a conductive layer overlying the dielectric layer and connected to a second portion of the substrate. The first conductive structure, the dielectric layer, and conductive layer are configured as a capacitor structure and further configured as one or more of an enclosure structure or a stiffener structure for the packaged electronic device.Type: ApplicationFiled: February 17, 2023Publication date: June 22, 2023Applicant: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventor: Ramakanth ALAPATI