Patents Assigned to Amphenol Corporation
  • Publication number: 20230420874
    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.
    Type: Application
    Filed: April 24, 2023
    Publication date: December 28, 2023
    Applicant: Amphenol Corporation
    Inventors: John Robert Dunham, Marc B. Cartier, JR., Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
  • Publication number: 20230402828
    Abstract: Support structures and methods for securing at least one element, such as a wire or bundle of wires, in an opening of a panel or other structure. A support assembly may comprise a grommet having an opening to accommodate the at least one element and a bushing configured to clamp around an outer surface of the grommet. The bushing may comprise one or more petals configured to contact a first surface of the structure and one or more snaps configured to contact a second surface of the structure that is opposite to the first surface.
    Type: Application
    Filed: June 13, 2023
    Publication date: December 14, 2023
    Applicant: Amphenol Corporation
    Inventors: Dimitri Laflamme, Mathieu Desjardins, Jeremi Proulx, Rachid Ouallou
  • Patent number: 11837814
    Abstract: A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: December 5, 2023
    Assignee: Amphenol Corporation
    Inventors: Allan Astbury, John Robert Dunham, Marc B. Cartier, Jr., Mark W. Gailus, Daniel B. Provencher
  • Patent number: 11835774
    Abstract: A fiber optic connector plug includes a housing. The housing includes a central axis, opposing lateral sides and a top side extending between the opposing lateral sides, and an interior channel, extending through the housing, in a direction parallel to the central axis, from a first end portion of the housing to a second end portion of the housing. The housing also includes a latch, coupled to the housing at the top side. The housing further includes a ferrule, extending from the first end portion of the housing. The housing additionally includes a shutter, coupled to the first end portion of the housing such that the shutter is pivotable and translationally slidable, relative to the first end portion of the housing, between a closed position, in which the shutter covers the ferrule, and an open position, in which the shutter does not cover the ferrule.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: December 5, 2023
    Assignee: AMPHENOL CORPORATION
    Inventors: Phuc Thanh Le, Hien Khuu
  • Patent number: 11831106
    Abstract: A cable assembly comprising a termination with at least one conductive, compressible member and a conductive ground shield. The conductive, compressible member may be held within a connector module forming the termination such that the conductive compressive member is pressed against, and therefore makes electrical contact with, both an outer conductive layer of the cable and ground structures within the connector module. In some embodiments, these connections may be formed using a conductive, compressible member with an opening configured to receive the end of the cable therethrough. The conductive ground shield may be configured to compress the conductive, compressible member, and to cause the conductive, compressible member to electrically contact the cable's conductive layer. The conductive, compressible member may be formed from a compressible material and may comprise a plurality of conductive particulates configured to provide electrically conductive paths.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: November 28, 2023
    Assignee: Amphenol Corporation
    Inventors: Donald A. Girard, Jr., David Manter, Vysakh Sivarajan
  • Patent number: 11824311
    Abstract: A modular electrical connector facilitates low loss connections to components on a printed circuit board. A portion is of the connector is formed of one or more first type units with conductive elements designed to be attached to a printed circuit board. Signals passing through those units may be routed to components on the printed circuit board through traces in the board. One or more second type units may be integrated with the connector. Those units may be designed for attachment to a cable, which may provide signal paths to a location on the printed circuit board near relatively distant components.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: November 21, 2023
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, Allan Astbury, David Manter, Marc B. Cartier, Jr., Vysakh Sivarajan, John Robert Dunham
  • Publication number: 20230371178
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Application
    Filed: July 24, 2023
    Publication date: November 16, 2023
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., Mark W. Gailus, Tom Pitten, Donald A. Girard, JR., Huilin Ren
  • Publication number: 20230352866
    Abstract: Connector assemblies for making connections to a subassembly, such as a processor card, may include signal contact tips formed of a material different than that of an associated cable conductor. The signal contact tips may be formed of a super elastic material, such as nickel titanium. The connector assembly may include ground contact tips that similarly make a pressure contact to the electrical component may be electrically connected to a shield of the cable shield Housing modules that interlock or interface with a support member may be employed to manufacture connectors with any desired quantity of signal and ground contact tips in any suitable number of columns and rows. Each module may terminate a cable and provide pressure mount connections between signal conductors and the shield of the cable and conductive pads on the subassembly, and conductive or lossy grounded structures around the conductive elements carrying signals through the module.
    Type: Application
    Filed: July 6, 2023
    Publication date: November 2, 2023
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., Donald A. Girard, JR., Eric Leo
  • Patent number: 11804671
    Abstract: An electrical receptacle assemblies and methods for assembling and mounting toolless receptacle assemblies to a housing of a luminaire. The receptacle assembly includes a rotatable receptacle that has an insert portion with an electrical face configured to mate with a photoelectric device and includes an outer ring portion that has a mounting face opposite the electrical face. The mounting face is configured to mount on the housing. A locating mechanism of the receptacle assembly is configured to orient the rotatable receptacle on the housing in a desired direction for optimal positioning of the photoelectric device. A locking base is configured to receive at least a portion of the insert portion. A releasable retention member if configured to couple to the locking base and the insert portion of the rotatable receptacle for securing the receptacle assembly to the housing.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: October 31, 2023
    Assignee: AMPHENOL CORPORATION
    Inventors: Shan Mugan, Adrian Green
  • Patent number: 11805595
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: October 31, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Publication number: 20230327363
    Abstract: A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.
    Type: Application
    Filed: June 12, 2023
    Publication date: October 12, 2023
    Applicant: Amphenol Corporation
    Inventors: Allan Astbury, John Robert Dunham, Marc B. Cartier, Mark W. Gailus, Daniel B. Provencher
  • Patent number: 11765813
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including a signal layer; and via patterns formed in the plurality of layers, each of the via patterns comprising first and second signal vias extending from a first surface of the printed circuit board to the signal layer, the signal layer including first and second signal traces connected to the first and second signal vias, respectively, the signal layer further including a ground conductor located between the signal traces and adjacent signal-carrying elements.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: September 19, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Patent number: 11764523
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. In some embodiments, the connector is may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. In some embodiments, the modules may have projecting portions, of conductive and/or dielectric material, that are shaped and positioned to reduce changes in impedance along the signal paths as a function of separation of conductive elements, when the connectors are separated by less than the functional mating range.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: September 19, 2023
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, John Robert Dunham, Marc B. Cartier, Jr., Donald A. Girard, Jr.
  • Patent number: 11758656
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: September 12, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, Tom Pitten, Donald A. Girard, Jr., Huilin Ren
  • Patent number: 11757224
    Abstract: A cable connector with improved performance and ease of use. The connector has staggered ports to reduce crosstalk and to prevent incorrect insertion of a plug into a receptacle. The plug may be constructed with subassemblies, each of which has a lossy central portion. Conductive members embedded within an insulative housing of the subassemblies may be used to electrically connect ground conductors within the subassemblies. Further, the connector may have a quick connect locking screw that can be engaged by pressing on the screw, but requires rotation of the screw to remove. Additionally, a ferrule may be used in making a mechanical connection between a cable bundle and a plug and making an electrical connection between a braid of the cable bundle and a conductive shell of the plug. The ferrule may be in multiple pieces for easy attachment while precluding deformation of the cable, which disrupts electrical performance.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: September 12, 2023
    Assignee: Amphenol Corporation
    Inventors: Donald W. Milbrand, Jr., Prescott B. Atkinson, Brian Kirk
  • Patent number: 11742620
    Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: August 29, 2023
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, Robert Richard, Eric Leo
  • Patent number: 11742601
    Abstract: A modular high speed, high density electrical connector configurable for use in multiple configurations, including a direct attach orthogonal configuration. The connector is assembled with modules that include shielded pairs of signal conductors with mating ends that are rotated approximately 45 degrees with respect to intermediate portions of the signal conductors. The connector may have a mating interface with receptacles in one connector and pins in the mating connector. The pins may be small diameter and may be implemented with superelastic wires so as to resist damage despite having very small effective diameter. A compact mating interface resulting from small diameter mating contact portions may enable other portions of the connector, including the shielding surrounding the signal conductors to be smaller, which may raise the resonant frequency of the connector and extend its bandwidth.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: August 29, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, John Pitten
  • Patent number: D1002551
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: October 24, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten
  • Patent number: D1002552
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: October 24, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten
  • Patent number: D1002553
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: October 24, 2023
    Assignee: Amphenol Corporation
    Inventors: Donald A. Girard, Jr., Barbara Calderon, Marc B. Cartier, Jr., David Levine, David Manter