Abstract: A dense, high-speed interconnection may be formed with a mating header and receptacle connector. The header connector may have groups of mating contact portions extending from the connector housing. Structural projections may extend from the housing adjacent some or all of the groups of mating contact portions. The groups of mating contact portions may be signal and ground mating contact portions associated with a signal pair. The groups may be arranged in an array and the structural projections may be arranged in an array intercalated with the array of the groups of mating contact portions. A receptacle connector may include an array of apertures configured to receive the structural projections. The structural projections may be shaped and positioned to reduce damage to the mating contact portions of the header connector, enable reliable manufacture, and to provide a high-density mating interface.

Abstract: A printed circuit board includes a dielectric substrate; first and second conductive traces disposed on the dielectric substrate; and a compensation structure disposed in the first conductive trace. The compensation structure includes a compensation segment connected in line with the first conductive trace; and a dielectric layer on all or part of the compensation segment. The first and second conductive traces may form a differential signal pair. The compensation segment may limit one or more of signal skew, mode conversion from differential mode to common mode, and impedance variations caused by a bend in the differential signal pair.

Abstract: An interposer configured for connecting offset arrays of signal pads on parallel surfaces. Contacts of the interposer have mating portions with multiple beams. One of the beams makes contact with a pad on a first of the surfaces and is deflected when the surfaces are pressed together with the interposer between them. A second of the beams is positioned so that the first beam presses into that second beam as the first beam deflects. The second beam may contact a central location on the first beam. An electrical path through the contact from a pad on the first surface to a pad on the second surface may be shorter when the first beam is pressed into the second beam than through the first beam alone. A shorter path may improve signal integrity. Moreover, the spring force of the contact may be set by the second beam.

Abstract: An interposer configured for connecting arrays of signal pads on parallel surfaces is described. Contacts of the interposer are configured to provide multiple conductive paths. A first conductive path extends through the body of the contact. A second conductive path is formed in parallel to the first conductive path when the contact is compressed between opposed substrates. The contact includes an intermediate portion, a rigid portion laterally extending from the intermediate portion, and a pair of compliant arms extending from the intermediate portion in opposite directions along the mating axis. When the contact is compressed, both arms touch and form an electrical connection with the rigid portion. The presence of the rigid portion allows for a reduction in the length of the beams in tall contacts.

Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.

Abstract: A cable termination that provides low signal distortion even at high frequencies. Conductive elements of the cable are fused to edges of signal conductors in a cable connector or other component terminating the cable. For terminating a differential pair, the conductive elements of the cable may be terminated to opposing edges of a pair of signal conductors in the cable termination. The conductive elements may be shaped such that the spacing between signal paths passing through the conductive elements of the cable and into the signal conductors of the cable termination is uniform.

Abstract: An electrical connector includes a connector shell, a coupling nut, and an indicator surrounding the connector shell. The indicator includes a clamp member and a check member. The clamp member includes a ring and a coupling structure extending from the ring to the check member and coupling the ring to the check member. The indicator may assist a user in determining if the electrical connector is in a fully-mated state.

Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

Abstract: An electrical connector with improved high frequency performance. The connector has conductive elements, forming both signal and ground conductors, that have multiple points of contact distributed along an elongated dimension. The ground conductors may be formed with multiple beams of different length. The signal conductors may be formed with multiple contact regions on a single beam, with different characteristics. Signal conductors may have beams that are jogged to provide both a desired impedance and mating contact pitch. Additionally, electromagnetic radiation, inside and/or outside the connector, may be shaped with an insert electrically connecting multiple ground structures and/or a contact feature coupling ground conductors to a stiffener. The conductive elements in different columns may be shaped differently to reduce crosstalk.

Abstract: A contact member includes, an outer conductor including a mating interface section that includes a front end of the outer conductor, a termination section including a rear end of the outer conductor, and a middle section therebetween joining the mating interface and termination sections; an inner conductor received in the mating interface section; and a protective insulator including a main portion received in the mating interface section of the outer conductor and supporting the inner conductor and including an end portion configured for closed entry mating. The end portion has an end face extending outside of the front end of the outer conductor.

Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.

Abstract: A subassembly for efficiently and reliably assembling a high performance electronic device. The electronic device may include numerous cabled interconnects in a subassembly that is subsequently mechanically and electrically connected to a PCB populated with high performance electronic components. First ends of cables in the cabled interconnects may be terminated by a first type of connector configured for connection to the PCB via a downward force. The second ends of the cables may be terminated with a second type of connectors that may make connections to other portions of an electronic system incorporating the electronic device. The connectors at the first ends of the cables may be releasably held within an organizer. The connectors may be simply mounted to the PCB by positioning the organizer with respect to the PCB, releasing the connectors from the organizer, and pushing the connectors into engagement with mounting locations on the PCB.

Abstract: A high frequency cable connector with a plug connector terminating shielded cables via a plurality of cable connection modules attached to a paddle card. The terminations do not significantly disrupt the high integrity signal paths within the cables, even at high frequencies. Various techniques may be used, alone or in combination, to form the termination, including that the wire insulators and shields of the cables extend almost to the point of termination, with a relatively small length of wire extending beyond the insulator and shield; welding of cable wires to signal terminals in the modules; signal terminals and ground terminals held within the modules with a controlled relative spacing; signal terminals of the modules surface mount soldered to pads on the paddle card; narrow pads approximating the width of traces in the paddle card; and short pads, approximating the length of mounting ends of the signal terminals.

Abstract: A subassembly for efficiently and reliably assembling a high performance electronic device. The electronic device may include numerous cabled interconnects in a subassembly that is subsequently mechanically and electrically connected to a PCB populated with high performance electronic components. First ends of cables in the cabled interconnects may be terminated by a first type of connector configured for connection to the PCB via a downward force. The second ends of the cables may be terminated with a second type of connectors that may make connections to other portions of an electronic system incorporating the electronic device. The connectors at the first ends of the cables may be releasably held within an organizer. The connectors may be simply mounted to the PCB by positioning the organizer with respect to the PCB, releasing the connectors from the organizer, and pushing the connectors into engagement with mounting locations on the PCB.

Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.

Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

Abstract: An electrical connector that includes an outer conductive shell that encloses at least one signal contact therein and includes a front end for mating with a mating connector and a back end opposite the front end for electrically connecting to a printed circuit board. A primary ground connection is located inside or outside of the outer conductive shell, the primary ground connection being configured to electrically engage the mating connector with the printed circuit board or coaxial cable. A secondary ground connection is located inside or outside of the outer conductive shell and is configured to electrically engage the mating connector with the printed circuit board or the coaxial cable.