Abstract: The illumination module for emitting light (5) can operate in at least two different modes, wherein in each of the modes, the emitted light (5) has a different light distribution. The module has a mode selector (10) for selecting the mode in which the module operates, and it has an optical arrangement. The arrangement includes—a microlens array (LL1) with a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P (P1);—an illuminating unit for illuminating the microlens array (LL1). The illuminating unit includes a first array of light sources (S1) operable to emit light of a first wavelength L1 each and having an aperture each. The apertures are located in a common emission plane which is located at a distance D (D1) from the microlens array (LL1). In a first one of the modes, for the lens pitch P, the distance D and the wavelength L1 applies P2=2·L1·D/N wherein N is an integer with N?1.

Abstract: The present disclosure describes optical and optoelectronic assemblies that, in some cases, include screen-printed micro-spacers, as well as methods for manufacturing such assemblies and modules. For example, an optoelectronic device mounted on a substrate can include an optical sub-assembly including a first optical element and a first micro-spacer on the optical element. The optical sub-assembly can be disposed over the optoelectronic device, with a first air or vacuum gap separating the first optical element from the optoelectronic device, and the first micro-spacer laterally surrounding the first air or vacuum gap.

Abstract: For an optical dot projector having multiple light emitters, a relationship is determined between locations of the light emitters with respect to a substrate of the optical dot projector and corresponding first locations of dots projected by the dot projector onto an imaging plane. An optical grating approximating one or more optical characteristics of one or more optical elements of the optical dot projector is determined based on the relationship. Second locations of dots corresponding to a replacement of the one or more optical elements of the optical dot projector by the optical grating are determined, and modified locations of the light emitters with respect to the substrate are determined based on the second locations of dots. Optical dot projectors are constructed according to the determined modified locations.

Abstract: An example system includes a light source, a first spectrometer, a second spectrometer, and an electronic control module. The light source is operable to emit light within a first range of wavelengths in a field of illumination. The first spectrometer is operable to measure first sample light reflected from an object within a second range of wavelengths and in a first field of detection. The second spectrometer is operable to measure second sample light reflected from the object within a third range of wavelengths and in a second field of detection. The electronic control module operable to determine, based on the measured first sample light and the measured second sample light, a distance between the system and the object, and determine, based on the measured first sample light and the measured second sample light, a spectral distribution of light corresponding to the object.

Abstract: An optoelectronic device has an asymmetric field overlap and is operable to measure proximity independently of object surface reflectivity. In some instances, the optoelectronic device includes a plurality of light-emitting assemblies and a light-sensitive assembly. In some instances, the optoelectronic devices include a plurality of light-sensitive assemblies and a light-emitting assembly. An asymmetric field overlap is attained in various implementations via various field-of-view axis, field-of-view angle, field-of-illumination axis, field-of-illumination angle, optical element and/or pitch configurations.

Abstract: The present disclosure is directed to optoelectronic modules with substantially temperature-independent performance characteristics and host devices into which such optoelectronic modules can be integrated. In some instances, an optoelectronic module can collect proximity data using light-generating components and light-sensitive components that exhibit temperature-dependent performance characteristics. The light-generating components and light-sensitive components can be configured such that they exhibit complementing temperature-dependent performance characteristics such that the operating performance of the optoelectronic module is substantially temperature independent.

Abstract: Fabricating light guide elements includes forming a first portion of the light guide element using a replication technique (104), and forming a second portion of the light guide element using a photolithographic technique (106). Use of replication can facilitate formation of more complex-shaped optical elements as part of the light guide element. The replication process sometimes results in the formation of a “yard,” or excess replication material, which may lead to light leakage if not removed or smoothed over. In some instances, at least part of the yard portion is embedded within the second portion of the light guide element, thereby resulting in a smoothing over of the yard portion.

Abstract: Optoelectronic modules exhibiting relatively small thickness and methods for their manufacture are disclosed. The optoelectronic modules include substrates and transparent covers. Each optoelectronic module includes a transparent substrate on which an optoelectronic component is mounted. The optoelectronic component can be sensitive to and/or operable to generate a particular wavelength of electromagnetic radiation. The transparent substrate is transmissive to the particular wavelength of electromagnetic radiation. In some instances, the transparent substrate is composed, at least partially of glass.

Abstract: An optical ranging system includes a support, a light emitter mounted on the support, and a time-of-flight (“TOF”) sensor chip mounted on the support. The TOF sensor chip, for example, includes at least one main pixel and at least one reference pixel in a semiconductor substrate. A barrier that is substantially non-transparent to light emitted by the light emitter separates the at least one reference pixel from the at least one main pixel. The optical ranging system also includes features for reducing optical cross-talk between the light emitter and the pixels of the TOF sensor.

Abstract: Wafer-level methods for manufacturing one or more uniform layers of material on one or more surfaces of a plurality of optoelectronic modules include assembling a wafer assembly, injecting a formable material into the wafer assembly, ejecting excess formable material form the wafer assembly, and hardening one or more formable material layers on one or more surfaces of the plurality of optoelectronic modules such that the hardened one or more formable material layers are the one or more uniform layers of material.

Abstract: The present disclosure describes calibration methods for optoelectronic modules with active illumination, such as 3D ranging systems. Calibration methods include determining cross-talk calibration parameters for an optoelectronic module having an emitting channel and a receiving channel where the optoelectronic module is operable to demodulate modulated light incident on the receiving channel. Cross-talk calibration parameters are saved to a readable storage medium and recalled during distance measurements to an object or objects in a scene.

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

Abstract: This disclosure describes optoelectronic modules, methods for manufacturing pluralities of discrete optoelectronic modules, and optoelectronic molding tools. The methods include coating a substrate wafer and a plurality of optoelectronic components with a photosensitive material, and further include exposing select portions of the photosensitive material to electromagnetic radiation. The exposed portions delineate at least in part the dimensions of the optical channels, wherein the optical channels are associated with at least one optoelectronic component. In some instances, optical elements are incorporated into the optical channels. In some instances, the exposed portions are the optical channels. In some instances, the exposed portions are spacers between the optical channels.

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

Abstract: An optics wafer includes replicated optical elements such as lenses that can be formed without the use of a separate glass or other substrate on which the optical elements would otherwise need to be replicated or mounted.

Abstract: In an example implementation, a first light measurement is obtained using a photodetector of a sensor module. The first light measurement corresponds, at least in part, to ambient light in an environment of the sensor module. Modulated light is generated using a light source of the sensor module, and a second light measurement is obtained using the photodetector of the sensor module. The second light measurement corresponds, at least in part, to modulated light reflected from an object toward the photodetector. A distance between the sensor module and the object is estimated, using an electronic control device, based on the first measurement, the second light measurement, and the modulated light.

Abstract: This disclosure describes optical assemblies that generate output with substantial stability over a wide variation in temperature. The optical assemblies can be integrated, for example, as part of array generators arranged to project an array or other pattern of dots onto an object or projection plane.

Abstract: A method for manufacturing an optical device comprising providing a plurality of initials bars each having a first side face presented with a first optical component arrangement; positioning the initial bars in a row with their first side faces facing a neighboring one of the initial bars; fixing the initial bars to obtain a bar arrangement; obtaining prism bars by segmenting the bar arrangement by at least one of the steps: conducting a plurality of cuts so that each prism bar comprises a portion of at least two different ones of the initial bars, separating the bar arrangement into sections along cut lines or by creating cut faces at an angle with initial-bar directions; dividing the first optical component arrangement for obtaining a plurality of passive optical components, wherein each prism bar comprises one or more passive optical components comprising a first reflective face each which is of non-planar shape; segmenting prism bars into parts.

Abstract: Compact spectrometer modules include an illumination channel and a detection channel. The illumination channel includes an illumination source operable to generate a broad spectrum of electromagnetic radiation. The detection channel includes an illumination detector and a Fabry-Perot component. The Fabry-Perot component is operable to pass a narrow spectrum of wavelengths to the illumination detector. Further, the Fabry-Perot component can be actuatable such that the Fabry-Perot component is operable to pass a plurality of narrow spectrums of wavelengths to the illumination detector.

Abstract: This disclosure is directed to methods for acquiring distance data using optical ranging systems. Optical ranging systems include one or more reference pixels and one or more object pixels. The methods employ operations for optimizing reference-pixel integration times and object-pixel integration times such that accurate distance data can be collected.