Abstract: An optoelectronic module includes an optical filter and can have a relatively small overall height. The module includes a semiconductor die for the optical filter, where the die has a cavity in its underside. The cavity provides space to accommodate an optoelectronic device such as a light sensor or light emitter. Such an arrangement can reduce the overall height of the module, thereby facilitating its integration into a host device in which space is at a premium.

Abstract: Fabricating light guide elements includes forming a first portion of the light guide element using a replication technique (104), and forming a second portion of the light guide element using a photolithographic technique (106). Use of replication can facilitate formation of more complex-shaped optical elements as part of the light guide element. The replication process sometimes results in the formation of a “yard,” or excess replication material, which may lead to light leakage if not removed or smoothed over. In some instances, at least part of the yard portion is embedded within the second portion of the light guide element, thereby resulting in a smoothing over of the yard portion.

Abstract: An example system includes a housing defining a cavity and an aperture, a photodetector disposed within the cavity, a voltage-tunable interferometer disposed within the cavity between the aperture and the photodetector, a first light source disposed within the cavity, and an electronic control device. The electronic control device is operable to vary an input voltage applied to the interferometer, and concurrently, cause the first light source to emit light towards the interferometer and measure light reflected from the interferometer using the photodetector. The electronic control device is also operable to determine a calibrated input voltage based on light reflected from the interferometer and measured by the photodetector. The electronic control device is also operable to apply the calibrated input voltage to the interferometer, and concurrently, obtain one or more spectral measurements using the photodetector.

Abstract: The disclosure describes systems and methods for wirelessly authenticating devices based on proximity using time-of-flight.

Abstract: An optoelectronic module includes a spacer with an optical component mounting surface, a fluid permeable channel, and a module mounting surface. The fluid permeable channel and module mounting surface allow the channels to be sealed to foreign matter during certain manufacturing steps and to remain free from blockages, such as solidified flux, during certain manufacturing steps. Further, the channels can permit heat to escape from the optoelectronic module during operation.

Abstract: A method of manufacturing a plurality of optical elements (140) comprising the steps of providing a substrate (120), and a tool (101) comprising a plurality of replication sections (106), each defining a surface structure of one of the optical elements (140), the tool (101) further comprising at least one contact spacer portion (112), aligning the tool (101) and the substrate (120) with respect to each other and bringing the tool (101) and a first side of the substrate (122) together, with replication material (124) between the tool (101) and the substrate (120), the contact spacer portion (112) contacting the first side of the substrate (122), and thereby causing the spacer portion (112) to adhere to the first side of the substrate (122), hardening the replication material (124), wherein the substrate (120) has yard line features (138) around at least a portion of the replication sections (106), the yard line features (138) containing the replication material (124) on a first side of the yard line with respe

Abstract: Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

Abstract: An apparatus, e.g. a proximity sensor module (10), for optical distance sensing includes a target surface (25) having a non-uniform design including a high-reflectivity region and a low-reflectivity region for light of a particular wavelength. The position of the target surface (25) is displaceable within the apparatus. The apparatus includes a light source (12) operable to emit light at the particular wavelength toward the target surface (25), and a photodetector (14) operable to sense at least some of the light emitted by the light source and subsequently reflected by the target surface (25). A processor is operable to correlate an output from the photodetector (14) with a distance to the target surface (25). A wall (22) may separate the light source (12) and photodetector (14) from one another, which can help reduce internal optical crosstalk.

Abstract: Techniques for controlling the flow of replication material (e.g., epoxy) during the formation of replicated optical elements include providing a transparent substrate (220) onto which the optical elements are to be replicated. The substrate (220) includes a structured UV curable shield (202) adhering to its surface. The UV curable shield (202), in turn, has openings (203) that expose portions of the surface of the transparent substrate (220) for replication of the optical elements. During the replication process, excess replication material (124A) may flow onto the UV curable shield (202), which subsequently can be cured so as to facilitate the release and removal of the shield (202) along with the excess replication material (124A).

Abstract: The device (10) comprises a first member (1) and a second member (2) which are stacked upon each other in a direction vertical direction. The first and second members comprise a central portion (C1; C2) each, and the first member (1) comprises at least a first distancing element (4) abutting the second member (2). The device (10) comprises a gap zone (G) and a bonding material (3), wherein the gap zone is peripheral to the central portions (C1; C2), and in the gap zone (G), a gap (5) is present between the first and second members. A portion of the gap (5) is filled by the bonding material (3) bonding the first and second members to each other in a bonding zone (B) comprised in the gap zone. A height (h) of the gap (5) is defined by the first distancing element (4).

Abstract: An example system includes a first light source, a second light source, a photodetector, and an electronic control device. The electronic control device is operable to cause the first light source to emit first light within a range of wavelengths towards a subject, and measure, using the photodetector, the first light reflected from the subject. The electronic control device is also operable to cause the second light source to emit second light including a plurality of emission peaks within the range of wavelengths, and measure, using the photodetector, the second light. The electronic control device is also operable to determine spectral information regarding the subject based on the measured first light and the measured second light.

Abstract: An optical sensor. The optical sensor comprises a light source, first and second light sensors, and a controller. The light source has a field of illumination. The first and second light sensors have respective first and second fields of view. The intersection of the field of illumination and the first field of view forms a first overlap region. The intersection of the field of illumination and the second field of view forms a second overlap region. When a surface is within one or both of the first and second overlap region, the surface reflects light from the light source to the respective light sensor. The controller is configured to determine a first distance measurement to a surface within one or both of the first and second overlap regions based on the ratio of reflected light from the light source received by the first sensor and reflected light from the light source received by the second sensor. A similar ultrasonic sensor is also disclosed.

Abstract: A substantially planar light replication or re-transmission component having an incident light receiving surface and an opposed light emitting surface. The component comprises a substantially transparent planar substrate, one or more bipolar junction transistors provided on said substrate, the or each transistor comprising a collector region adjacent to said light receiving surface, an emitter region adjacent to said light emitting surface, and a base region between said collector region and said emitter region, and circuitry for biasing the bipolar transistors in use. The or each transistor is configured and biased in use so that said collector and base regions of the transistor operate as a photodiode whilst said base and emitter regions operate as a light emitting diode.

Abstract: A method of manufacturing an optical element, the method comprising: providing a substrate; providing a tool comprising, on a first side, a section defining a surface structure of the optical element; aligning the tool and the substrate with respect to each other and bringing the tool and a first side of the substrate together, with material between the tool and the substrate; positioning a transparent masking structure adjacent to the substrate onto which the material has adhered, the masking structure comprising a masking layer; emitting light through the masking structure to be incident on a portion of the material to cure said potion of the material, wherein the masking layer prevents light from being incident on a remaining portion of the material such that the remaining portion of the material is uncured; and removing the uncured remaining portion of the material.

Abstract: An optical sensor. The optical sensor comprises a substrate, a Fabry-Perot interferometer, and first and second photodetectors. The Fabry-Perot interferometer comprises a first mirror and a second mirror, and is mounted on the substrate such that light is transmitted through the interferometer to the substrate. The first and second photodetectors are configured to detect light transmitted through the etalon and the substrate. The first photodetector is sensitive to a first wavelength range, and the second photodetector is sensitive to a second wavelength range, and wherein the first and second wavelength ranges each correspond to a different mode of the interferometer.

Abstract: A method for use in manufacturing an optical emitter arrangement comprises holding an electrically conductive base member and two electrically conductive base elements in a predetermined spatial relationship, and providing two electrically conductive projections, wherein each projection extends in a direction away from a surface of a corresponding one of the base elements and wherein each projection terminates at a corresponding outer end. The method further comprises bringing a projecting portion of a surface profile of a mold tool into engagement with an area of a surface of the base member whilst bringing other portions of the surface profile of the mold tool into engagement with the outer ends of the projections so as to form a void that extends away from the surface of the base member around the projecting portion of the surface profile of the mold tool and that extends away from the surface of each of the base elements around each projection without extending over the outer end of each projection.

Abstract: A privacy film for a curved display screen. The privacy film has a curved cross section when no force is applied. The privacy film comprises alternating transparent layers and opaque layers, each extending across the privacy film, and each parallel to the other transparent and opaque layers when no force is applied. A method of manufacturing the film is also disclosed.

Abstract: Optical Device and Manufacturing Method An optical device (380) is disclosed, the device comprising a substrate (330), first electrically-conductive element (325) formed as a pattern on the substrate, a layer of material extending over at least a portion of the first electrically-conductive element and forming an optical element (370), and a second electrically-conductive element (355) extending through the layer of material and coupled to the first electrically-conductive element. Also disclosed is an associated method of manufacturing the optical device (380), and an apparatus (600) comprising at least one of the disclosed optical devices, a camera (605), and processing circuitry (615) communicably coupled to the at least one optical device and to the camera.

Abstract: A method of manufacturing a spacer (285) for spacing apart and electrically coupling first and second components of an optical device is disclosed. The method comprises a step of adhesively coupling a first substrate (250) to each of a plurality of spacer elements (205). The method comprises a step of adhesively coupling a second substrate (275) to each of the plurality of spacer elements, such that the plurality of spacer elements are disposed between opposing surfaces of the first and second substrates. At least one of the plurality of spacer elements comprises a conductive coating and/or is adhesively coupled to the first and second substrates with an electrically-conductive adhesive, such that an electrically-conductive path (290a-d) is formed for electrically coupling the first and second components of the optical device. Also disclosed is an optical device (500) comprising a spacer (285) manufactured according to the method.