Abstract: A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.

Abstract: Techniques for fabricating low-loss magnetic vias within a magnetic core are provided. According to some embodiments, vias with small, well-defined sizes may be fabricated without reliance on precise alignment of layers. According to some embodiments, a magnetic core including a low-loss magnetic via can be wrapped around conductive coils of an inductor. The low-loss magnetic vias can improve performance of an inductive component by improving the quality factor relative to higher loss magnetic vias.

Abstract: Optically isolated micromachined (MEMS) switches and related methods are described. The optically isolated MEMS switches described herein may be used to provide isolation between electronic devices. For example, the optically isolated MEMS switches of the types described herein can enable the use of separate grounds between the receiving electronic device and the control circuitry. Isolation of high-voltage signals and high-voltage power supplies can be achieved by using an optical isolator and a MEMS switch, where the optical isolator controls the state of the MEMS switch. In some embodiments, utilizing optical isolators to provide high voltages, the need for electric high-voltage sources such as high-voltage power supplies and charge pumps may be removed, thus removing the cause of potential damage to the receiving electronic device. In one example, the optical isolator and the MEMS switch may be co-packaged on the same substrate.

Abstract: Aspects of this disclosure relate to detecting and recording information associated with electrical overstress (EOS) events, such as electrostatic discharge (ESD) events. For example, in one embodiment, an apparatus includes an electrical overstress protection device, a detection circuit configured to detect an occurrence of the EOS event, and a memory configured to store information indicative of the EOS event.

Abstract: Aspects of this disclosure relate to an antenna array system and method of calibration using one or more probes disposed equidistant between antenna elements. In certain embodiments, calibration is performed between a probe and antenna elements, between a plurality of antenna elements, and/or between antenna elements on different antenna arrays.

Abstract: Provided herein are semiconductor dies including multiple controllers for operating over an extended temperature range. In certain embodiments, a semiconductor die includes multiple circuit modules, a temperature sensor that generates a detected temperature signal, an interface that communicates with an external host, a primary controller coupled to the interface and operable to control the circuit modules, and a secondary controller coupled to the interface. In response to the detected temperature signal indicating that the temperature of the semiconductor die exceeds a threshold temperature, the primary controller enables the secondary controller, which in turn disables the primary controller and at least a portion of the plurality of circuit modules to reduce heat dissipation.

Abstract: Apparatus and methods for timing offset compensation of frequency synthesizers are provided herein. In certain embodiments, an electronic system includes a frequency synthesizer, such as a fractional-N phase-locked loop (PLL), which generates an output clock signal based on timing of a reference clock signal. Additionally, the electronic system includes an integer PLL configured to compensate for a timing offset, such as a phase offset and/or frequency offset, of the frequency synthesizer based on timing of the output clock signal.

Abstract: A magnetic device may include a magnetic structure, a device structure, and an associated circuit. The magnetic structure may include a patterned layer of material having a predetermined magnetic property. The patterned layer may be configured to, e.g., provide a magnetic field, sense a magnetic field, channel or concentrate magnetic flux, shield a component from a magnetic field, or provide magnetically actuated motion, etc. The device structure may be another structure of the device that is physically connected to or arranged relative to the magnetic structure to, e.g., structurally support, enable operation of, or otherwise incorporate the magnetic structure into the magnetic device, etc. The associated circuit may be electrically connected to the magnetic structure to receive, provide, condition or process of signals of the magnetic device.

Abstract: A variable output data rate converter circuit preferably meets performance requirements while keeping the circuit complexity low. In some embodiments, the converter circuit may include an oversampling sigma delta modulator circuit to quantize an analog input signal at an oversampled rate, and output an sigma delta modulated signal, a transposed polynomial decimator circuit to decimate the sigma delta modulated signal, and output a first decimated signal, and an integer decimator circuit to decimate the first decimated signal by an integer factor and output a second decimated signal having a desired output data rate. The transposed polynomial decimator circuit has a transposed polynomial filter circuit and a digital phase locked loop circuit, which tracks a ratio between a sampling rate of the first decimated signal and the oversampled rate, and outputs an intersample position parameter to the transposed polynomial filter circuit.

Abstract: Isolators having a back-to-back configuration for providing electrical isolation between two circuits are described, in which multiple isolators formed on a single, monolithic substrate are connected in series to achieve a higher amount of electrical isolation for a single substrate than for isolators formed on separate substrates connected in series. Discrete dielectric regions positioned between isolator components forming an isolator provide electrical isolation between the isolator components as well as between the isolators formed on the substrate. The back-to-back isolator may provide one or more communication channels for transfer of information and/or power between different circuits.

Abstract: Apparatus and methods provide predistortion for a phased array. Radio frequency (RF) sample signals from phased array elements are provided along return paths and are combined by a hardware RF combiner. Phase shifters are adjusted such that the RF sample signals are phase-aligned when combined. Adaptive adjustment of predistortion for the amplifiers of the phased array can be based on a signal derived from the combined RF sample signals.

Abstract: Aspects of this disclosure relate to a receiver for a light detection and ranging system. The receiver includes a transimpedance amplifier that is operable in a linear mode for a range of power of light received by the receiver. The receiver can provide information about amplitude of the light outside of the range of power of the light for which the transimpedance amplifier operates in the linear mode. This information can be useful, for example, in identifying an object from which light received by the receiver was reflected.

Abstract: Power isolators with multiple selectable feedback modes are described. The power isolators may transfer a power signal from a primary side to a second side. A feedback signal may be provided from the secondary side to the primary side to control generation of the power signal on the primary side. In this manner, the power signal provided to the secondary side may be maintained within desired levels. The feedback signal may be generated by feedback circuitry configurable to operate in different modes, such that the feedback signal may be of differing types depending on which feedback mode is implemented.

Abstract: A wireless sensor node is described. The wireless sensor node may include a wake-up circuitry configured to awaken the sensor when a request is received. The sensor may be placed in a sleep mode, thus saving battery usage until a wake-up signal requesting use of the sensor is received. Powering of the wake-up circuitry may be supplied through energy captured using an energy harvester. In one example, the energy for powering the wake-up circuitry is extracted from the same signal used for awakening the sensor. The wireless sensor mode may operate in a passive mode, in which the energy for powering the wake-up circuitry is harvested, or in a power supply-assisted mode, in which some of the power is provided by a power supply. High quality factors filters may be used to increase the signal-to-noise ratio of the wake-up signals, thus improving the node's ability to recognize activation requests.

Abstract: Amplifier systems for measuring a wide range of current are provided herein. In certain embodiments, an amplifier system includes a controllable sensing circuit, a first amplifier including an output configured to drive a device under test (DUT) through the controllable sensing circuit, and a second amplifier including an input coupled to the controllable sensing circuit and operable to generate a measurement signal indicating an amount of measured current of the DUT. The amplifier system further includes a control circuit operable to control a configuration or mode of the controllable sensing circuit suitable for a particular type of DUT.

Abstract: A calibration apparatus for calibrating a magnetic sensor configured to generate an output signal indicative of magnetic field strength when a bias signal is applied to it is disclosed. The apparatus includes a test magnetic field generator (MFG) to generate magnetic fields of known magnitude, and further includes a processor to control the MFG to generate a known magnetic field, control the sensor to generate a test output signal when the MFG generates the known magnetic field and a known bias signal is applied to the sensor, and determine how to change the bias signal based on a deviation of the measured test output signal from an expected output signal. Using a test MFG that produces known magnetic fields when known bias signals are applied to sensors allows evaluating and compensating for changes in sensitivity of the sensors by accordingly changing bias signals applied to the sensors.

Abstract: Optically isolated micromachined (MEMS) switches and related methods are described. The optically isolated MEMS switches described herein may be used to provide isolation between electronic devices. For example, the optically isolated MEMS switches of the types described herein can enable the use of separate grounds between the receiving electronic device and the control circuitry. Isolation of high-voltage signals and high-voltage power supplies can be achieved by using an optical isolator and a MEMS switch, where the optical isolator controls the state of the MEMS switch. In some embodiments, utilizing optical isolators to provide high voltages, the need for electric high-voltage sources such as high-voltage power supplies and charge pumps may be removed, thus removing the cause of potential damage to the receiving electronic device. In one example, the optical isolator and the MEMS switch may be co-packaged on the same substrate.

Abstract: A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.

Abstract: A wireless sensor node is described. The wireless sensor node may include a wake-up circuitry configured to awaken the sensor when a request is received. The sensor may be placed in a sleep mode, thus saving battery usage until a wake-up signal requesting use of the sensor is received. Powering of the wake-up circuitry may be supplied through energy captured using an energy harvester. In one example, the energy for powering the wake-up circuitry is extracted from the same signal used for awakening the sensor. The wireless sensor mode may operate in a passive mode, in which the energy for powering the wake-up circuitry is harvested, or in a power supply-assisted mode, in which some of the power is provided by a power supply. High quality factors filters may be used to increase the signal-to-noise ratio of the wake-up signals, thus improving the node's ability to recognize activation requests.

Abstract: Disclosed herein are systems and techniques for content protection over synchronous data networks. For example, a method of communicating content protected data may include providing link synchronization information over a link of a synchronous bus, and providing content protected data over the link of the synchronous bus. The content protected data may be protected in accordance with the High-Bandwidth Digital Content Protection (HDCP) specification or the Digital Transmission Content Protection (DTCP) specification, for example.