Abstract: Apparatus and methods are disclosed, such as those involving a high frequency transmitter. One such apparatus includes a pre-amplifier configured to receive an input signal via an input node; and a capacitor block electrically coupled between the pre-amplifier and an output node from which an output signal is transmitted. The capacitor block is configured to provide charge to the output node or pull charge from the output node while the output signal transitions. The apparatus further includes a switch electrically coupled between the output node and a voltage reference, wherein the switch is turned on or off at least partly in response to a signal from the pre-amplifier. This configuration effectively reduces rise and fall time of the output signal for high-frequency transmission.

Abstract: A MEMS package includes a substrate having an L-shaped cross-section. The substrate includes a vertical portion having a front surface and a back surface, and a horizontal portion protruding from a lower part of the front surface of the vertical portion, wherein the front surface of the vertical portion includes a mounting region. A MEMS die is mounted on the mounting region such that the MEMS die is oriented substantially parallel to the front surface; a lid attached to the front surface of the substrate while covering the MEMS die; and a plurality of leads formed on a bottom surface of the substrate. The leads can extend substantially parallel to one another, and substantially perpendicular to the front surface. The MEMS die can be oriented substantially perpendicular to a PCB substrate on which the package is mounted.

Abstract: A method for dividing a frequency includes the steps of receiving a first signal having a first frequency as a clock input to a first digital counter and outputting a second signal as a clock input to a second digital counter having a higher counting capacity than the first counter. The output occurs when the first counter reaches a first number of count cycles. The method also includes generating a third signal having a high cycle and a low cycle, which are determined at least as a function of the first number of count cycles. Depending on a desired division ratio, the high and low cycles may also be a function of a second number of count cycles associated with the second counter. The third signal has a frequency lower than the first frequency.

Abstract: An apparatus for use with automatic testing equipment for testing infrared sensors on integrated circuits is provided. The apparatus includes an infrared source, a heat mass, and an electronic frequency modulator. The infrared source is modulated according to a predetermined test frequency such that the infrared source emits an infrared test signal representative of a test temperature and corresponding to the temperature of the heat mass and the predetermined test frequency. A signal processor, electrically coupled to an integrated circuit having an infrared sensor, receives a sensed signal from the infrared sensor in response to the infrared test signal and uses the sensed signal according to the predetermined test frequency to determine a measured temperature.

Abstract: A MEMS sensor includes a substrate and a MEMS structure coupled to the substrate. The MEMS structure has a mass movable with respect to the substrate. The MEMS sensor also includes a reference structure positioned radially outward from the MEMS structure. The reference structure is used to provide a reference to offset any environmental changes that may affect the MEMS sensor in order to increase the accuracy of its measurement.

Abstract: A method of bonding wafers with an aluminum-germanium bond includes forming an aluminum layer on a first wafer, and a germanium layer on a second wafer, and implanting the germanium layer with non-germanium atoms prior to forming a eutectic bond at the aluminum-germanium interface. The wafers are aligned to a desired orientation and the two layers are held in contact with one another. The aluminum-germanium interface is heated to a temperature that allows the interface of the layers to melt, thus forming a bond. A portions of the germanium layer may be removed from the second wafer to allow infrared radiation to pass through the second wafer to facilitate wafer alignment.

Abstract: Transistors having improved breakdown voltages and methods of forming the same are provided herein. In one embodiment, a method of forming a transistor comprises the steps of: forming a drain and a source by doping a semiconductor with a first dopant type to form a first type of semiconductor, the drain and source being separated from one another, wherein the drain comprises a first drain region of a first dopant concentration adjacent a second drain region, such that at least a portion of the second drain region is positioned between the first drain region and the source, and further comprising forming an intermediate region by doping the semiconductor so as to form a second type of semiconductor intermediate the drain and source, the intermediate region spaced apart from the second drain region.

Abstract: Lighting system embodiments are provided to energize and calibrate strings of light-emitting diodes. These embodiments are particularly useful for calibration of strings of light-emitting diodes that are arranged to provide backlighting of liquid crystal displays. The systems are structured around the use of a single comparator that is multiplexed to facilitate calibration of a plurality of current sources. The systems can be adapted for use in displays in which different techniques (e.g., “analog dimming” and “pulse-width modulation”) are used to vary the brightness of the display. The systems remove the need for special structures (e.g., fuse arrays, special test equipment, and interfaces).

Abstract: A computed tomography detector module can include a detector element, a frame, and a converter element. The detector element can be configured to detect electromagnetic radiation at a detection plane and output one or more analog detection signals. The frame can connect to the detector element and include a shield portion, parallel to the detection plane, configured to at least partially block X-rays. The converter element can include a substrate having connector and component substrate portions, the connector substrate portion thicker in a direction perpendicular to the detection plane than the component substrate portion and configured to extend through an aperture of the frame, the component substrate portion having at least one substrate surface parallel to the detection plane with one or more electrical components attached thereto.

Abstract: A packaged microchip has a base, at least one spacer coupled to the base, and first and second microchips mounted to the at least one spacer. The at least one spacer is configured to substantially prevent leakage current between the first and second microchips.

Abstract: Apparatus and methods are disclosed, such as those involving a junction field effect transistor for voltage protection. One such apparatus includes a protection circuit including an input, an output, and a JFET. The JFET has a source electrically coupled to the input, and a drain electrically coupled to the output, wherein the JFET has a pinch-off voltage (Vp) of greater than 2 V in magnitude. The apparatus further includes an internal circuit having an input configured to receive a signal from the output of the protection circuit. The protection circuit provides protection over the internal circuit from overvoltage and/or undervoltage conditions while having a reduced size compared to a JFET having a Vp of smaller than 2 V in magnitude.

Abstract: A phase locked loop (PLL) based frequency sweep generator and methods for performing a frequency sweep are disclosed. In one implementation, the frequency sweep generator includes a circuit configured to generate a signal having a saw-tooth wave frequency ramp. The saw-tooth wave frequency ramp includes a rising portion and a resetting portion. The resetting portion has a shorter duration than the rising portion and includes a plurality of steps for decrementing the frequency of the signal.

Abstract: In an embodiment of the invention, a differential input signal is coupled to a plurality of transconductance blocks. In some embodiments, each of the transconductance blocks divide an input transconductance among a plurality of signal paths to a plurality of outputs in each transconductance block. In an embodiment, the input transconductance may be divided based a ratio of transistor areas in the plurality of signal paths, though other embodiments may divide the transconductance differently. In some embodiments, transconductance block outputs of a plurality of transconductance blocks may be cross-coupled to provide a gain path for a differential signal than is greater than that of a common mode signal.

Abstract: A first output count is compared with first and second stored count values for generating an output event at a first node if the first Output count corresponds to the first or second stored count values.

Abstract: A microphone system has a base coupled with first and second microphone apparatuses. The first microphone apparatus is capable of producing a first output signal having a noise component, while the second microphone apparatus is capable of producing a second output signal. The system also has combining logic operatively coupled with the first microphone apparatus and the second microphone apparatus. The combining logic uses the second output signal to remove at least a portion of the noise component from the first output signal.

Abstract: A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various polysilicon microphone structures are formed above a front side of the top silicon layer by depositing at least one oxide layer, forming the structures, and then removing a portion of the oxide underlying the structures from a back side of the top silicon layer through trenches formed through the top silicon layer. The trenches allow sound waves to reach the diaphragm from the back side of the top silicon layer. In an SOI wafer, a cavity is formed through a bottom silicon layer and an intermediate oxide layer to expose the trenches for both removing the oxide and allowing the sound waves to reach the diaphragm. An inertial sensor may be formed on the same wafer, with various inertial sensor structures formed at substantially the same time and using substantially the same processes as corresponding microphone structures.

Abstract: A switching circuit for switchably connecting an input node and an output node. The switching circuit comprises a switch operable to switchably connect the input node to the output node in response to a switching signal. A sensor is provided for sensing the voltage between the input and output nodes and providing a sense signal in response thereto. A driver coupled to the sensor adjusts the switching signal in response to the sense signal.

Abstract: An input bias current cancellation circuit includes reference transistors placed in series and a current summation network. The current summation network can be configured to sum the base currents of the reference transistors to produce a summed current. A current mirror can be provided to attenuate the summed current to produce input bias cancellation currents. The input bias cancellation currents can be provided to the base inputs of an input bipolar differential pair, thereby reducing input current noise.

Abstract: A single integrator sensorless current mode control scheme for a switching power converter requires an amplifier circuit which produces an first current that varies with the difference Verror between a reference voltage and a voltage that varies proportionally with Vout, a circuit which produces a second current that varies with the voltage VL across the output inductor, a single integrating element connected to receive the first and second currents such that it integrates both Verror and VL, and a comparator which receives the integrated output at its first input and a substantially fixed voltage at its second input and produces an output that toggles when the voltage at its first input increases above and falls below the substantially fixed voltage. The comparator output is used to control the operation of the power converter's switching circuit and thereby regulate the output voltage.

Abstract: A MEMS microphone has a backplate and a movable diaphragm that together form a variable capacitance. The backplate has a backplate surface and, in a corresponding manner, the diaphragm has a diaphragm surface that faces the backplate surface. At least one of the backplate surface and the diaphragm surface has at least a portion with a Hurst exponent that is less than or equal to about 0.5.