Abstract: The invention is directed to a protection circuit for protecting IC chips against ESD. An ESD protection circuit for an integrated circuit chip may comprise an isolated NMOS transistor, which may comprise an isolation region isolating a backgate from a substrate, and a first and second doped regions and a gate formed on the backgate. The ESD protection circuit may further comprise a first terminal to connect the isolation region to a first electrical node, and a second terminal to connect the second doped region to a second electrical node. The first electrical node may have a higher voltage level than the second electrical node, and the gate and backgate may be coupled to the second terminal.

Abstract: A clock system includes a digital phase/frequency detector (DPFD), a buffer, a digitally-controlled oscillator (DCO) including a sigma-delta modulator (SDM), an adder, a first frequency divider. The DPFD may have a first input for a reference input clock, a second input for a feedback signal, the DPFD generating an output representing a difference between the reference input clock and the feedback signal. The buffer may be coupled to the DPFD for accumulating the difference signal over time. The sigma-delta modulator (SDM) may have a control input coupled to the buffer. The adder may have inputs coupled to the (SDM) and a source of an integer control word. The first frequency divider may have an input for a clock signal and a control input coupled to the adder, the DCO generating an output clock signal having an average frequency representing a frequency of the input clock signal divided by (N+F/M), wherein N is determined by the integer control word and F/M is determined by an output of the SDM.

Abstract: A voltage regulator receives an unregulated DC input voltage supply and provides a regulated DC output voltage. A primary pass element and an external resistor are located in a primary current path through which a load current flows from the input terminal to the output terminal. The voltage regulator includes two control circuits that control the impedances of two pass elements. Power dissipation can be improved and the dropout voltage can be reduced by maintaining the voltage on an internal node of the voltage regulator.

Abstract: The invention provides a systematic error correction network coupled to a converter. The converter may display a systematic non-linearity error, and the systematic error correction network shapes a correction transform function that acts like counter distortion function for the non-linearity error. The systematic error correction network then scales the correction transform function according to a reference variable, where the magnitude of non-linearity error is related to the reference variable. The scaled correction transform function is then applied to the converter path in order to generate a corrected analog output signal.

Abstract: An input stage for an instrumentation system may include a resistor coupled between an input terminal and a summing node, and an amplifier arranged to maintain the voltage at the summing node. In anther embodiment, an instrumentation input system may include an input stage to receive a signal to be measured, and a variable gain amplifier having an input coupled to an output of the input stage, wherein the variable gain amplifier comprises two or more gain stages. A variable gain amplifier may include an attenuator having an input and a series of tap points and a series of low-inertia switches to steer outputs from the attenuator to an output terminal.

Abstract: Apparatuses and methods for electronic circuit protection are disclosed. In one embodiment, an apparatus comprises an internal circuit electrically connected between a first node and a second node, and a protection circuit electrically connected between the first node and the second node and configured to protect the internal circuit from transient electrical events. The protection circuit comprises a bipolar transistor having an emitter connected to the first node, a base connected to a third node, and a collector connected to a fourth node. The protection circuit further comprises a first diode electrically connected between the third node and the fourth node, and a second diode electrically connected between the second node and the fourth node. The first diode is an avalanche breakdown diode having an avalanche breakdown voltage lower than or about equal to a breakdown voltage associated with the base and the collector of the bipolar transistor.

Abstract: Apparatus and methods for electronic circuit protection are disclosed. In one embodiment, an apparatus comprises a substrate includes an n-well and a p-well adjacent the n-well. An n-type active area and a p-type active area are disposed in the n-well. The p-type active area, the n-well, and the p-well are configured to operate as an emitter, a base, and a collector of an PNP bipolar transistor, respectively, and the p-type active area surrounds at least a portion of the n-type active area so as to aid in recombining carriers injected into the n-well from the p-well before the carriers reach the n-type active area. The n-well and the p-well are configured to operate as a breakdown diode, and a punch-through breakdown voltage between the n-well and the p-well is lower than or equal to about a breakdown voltage between the p-type active area and the n-well.

Abstract: Apparatuses are disclosed, such as those involving integrated circuit packaging. In one embodiment, a chip package includes: an encapsulation having a top surface and a bottom surface facing away from the top surface. The package further includes a leadframe including a plurality of leads. Each of the leads includes an exposed portion exposed through one of edges of the bottom surface of the encapsulation. The exposed portion has a length. At least one of exposed portions positioned along one of the edges of the bottom surface of the encapsulation has a length different from other exposed portions along the edge. The package can also include a dummy pad exposed through a corner of the bottom surface. The configuration can enhance solder joint reliability of the package when the package is attached to a printed circuit board.

Abstract: An amplifier system with digital adaptive power boost includes a charge pump for providing a power supply to an amplifier. The charge pump may switch between a fixed input DC voltage and a boosted value for a certain period of time in response to an increase in an input signal to the amplifier. The charge pump may use a switching transistor which is switched on only when the input signal to the amplifier exceeds a threshold. The amplifier system may be used for envelope tracking, especially for envelope tracking of low duty cycle signals, e.g., xDSL or vDSL.

Abstract: Apparatuses and methods for providing transient electrical event protection are disclosed. In one embodiment, an apparatus comprises a detection and timing circuit, a current amplification circuit, and a clamping circuit. The detection and timing circuit is configured to detect a presence or absence of a transient electrical event at a first node, and to generate a first current for a first duration upon detection of the transient electrical event. The current amplification circuit is configured to receive the first current from the detection and timing circuit and to amplify the first current to generate a second current. The clamping circuit is electrically connected between the first node and a second node and receives the second current for activation. The clamping circuit is configured to activate a low impedance path between the first and second nodes in response to the second current, and to otherwise deactivate the low impedance path.

Abstract: The invention is a novel scheme of calibrating a voltage-mode digital to analog converter using a current-mode digital to analog converter. A DAC system is comprised of a voltage-mode DAC with an R-2R architecture structure and includes a ROM lookup table where calibration codes associated with each of a plurality of input codes are stored. A reference current is scaled with the calibration codes to output a calibration current that induces adjustments in an output voltage to counteract non-linearities that may be induced by resistor mismatch.

Abstract: A signal amplifier including a transformer with a primary winding and a secondary winding, an oscillator circuit driven by an input signal establishing in the primary winding an oscillating signal amplified by the secondary, and a rectifier circuit responsive to the secondary winding configured to convert the amplified oscillating signal to an amplified version of the input signal.

Abstract: The invention is directed to an amplifier including an absolute value circuit. The absolute value circuit may be driven by differential potentials and may include a first pair of transistors modulating a tail current of the amplifier when a differential input voltage goes high, and a second pair of transistors modulating the tail current of the amplifier when a differential input voltage goes low.

Abstract: A solid state relay includes: an oscillator circuit responsive to a control signal for generating an a.c. signal; an isolation transformer having a primary winding which forms a part of the tank circuit of the oscillator circuit and a secondary winding; a rectifier responsive to the a.c. signal from the oscillator circuit for providing a d.c. drive signal; and a switch circuit responsive to the drive signal to open and close the relay.

Abstract: A method of forming a capped die forms a cap wafer having a top side and a bottom side. The bottom side is formed with 1) a plurality of device cavities having a first depth, and 2) a plurality of second cavities that each have a greater depth than the first depth. At least some of the plurality of second cavities each generally circumscribe at least one of the device cavities. The method then secures the cap wafer to a device wafer in a manner that causes a plurality of the device cavities each to circumscribe at least one of circuitry and structure on the device wafer. Next, the method removes at least a portion of the top side of the cap wafer to expose the second cavities. This forms a plurality of caps that each protect the noted circuitry and structure.

Abstract: A MEMS microphone is capable of operating with less-than-one-volt bias voltage. An exemplary MEMS microphone can operate directly from a power rail (i.e., directly from VDD), i.e., without a DC-to-DC step-up voltage converter or other high bias voltage generator. The MEMS microphone has high mechanical and electrical sensitivity due, at least in part, to having high-compliance, i.e. low stiffness, springs and a relatively small gap between its diaphragm and its parallel conductive plate. In some embodiments, a diode-based voltage reference or a bandgap voltage reference supplies the bias voltage.

Abstract: Film frame assemblies and apparatus for testing and singulating integrated circuit packages, as well as associated methods for forming a film frame assembly, and testing and singulating integrated circuit packages are disclosed. A plurality of leads on a lead frame are cut to form singulated integrated circuit packages. Apparatus and methods are disclosed for mechanically aligning a set of electrical contacts attached to a contactor body with a plurality of leads on a singulated integrated circuit package.

Abstract: A system and method for reducing noise in resolver-to-digital converters (RDC) using a cascaded tracking loop filter. In some embodiments, one or more tracking loop filters may be implemented in a cascade to attenuate carrier harmonic frequencies in the digitized output of an RDC. Where a plurality of tracking loop filters are implemented, the output of one tracking loop filter may be input into a successive tracking loop filter.

Abstract: Apparatuses and methods for protecting electronic circuits are disclosed. In one embodiment, an apparatus for providing protection from transient signals comprises an integrated circuit, a pad on a surface of the integrated circuit, and a configurable protection circuit within the integrated circuit. The configurable protection circuit is electrically connected to the pad. The configurable protection circuit comprises a plurality of subcircuits arranged in a cascade, and selection of one or more of the plurality of the subcircuits for operation determines at least one of a holding voltage or a trigger voltage of the configurable protection circuit.

Abstract: Apparatuses and methods for electronic circuit protection are disclosed. In one embodiment, an apparatus comprises a well having an emitter and a collector region. The well has a doping of a first type, and the emitter and collector regions have a doping of a second type. The emitter region, well, and collector region are configured to operate as an emitter, base, and collector for a first transistor, respectively. The collector region is spaced away from the emitter region to define a spacing. A first spacer and a second spacer are positioned adjacent the well between the emitter and the collector. A conductive plate is positioned adjacent the well and between the first spacer and the second spacer, and a doping adjacent the first spacer, the second spacer, and the plate consists essentially of the first type.