Abstract: Methods, machine readable media and systems for near-field electromagnetic simulation for side-channel emission analysis of an integrated circuit (IC) are described. In one embodiment, a method can include the following operations: simulating EM field strengths for a plurality of grid partitions of a circuit area of the IC based on a cryptographic work load applied to a model of the IC; identifying one or more of the grid partitions as a security sensitive region for the IC based on the EM field strengths, wherein one or more grid partitions outside of the security sensitive region are identified as non-security sensitive regions for the IC; and simulating EM fields for the IC to perform the EM side-channel emission analysis, wherein contributions of the EM fields from the non-security sensitive regions for the EM side-channel emission analysis are based on a linear superposition of wire currents in the non-security sensitive regions of the IC.

Abstract: Provided is an improved method, system, and computer program product to implement simulation for photonic devices. A composite, multi-domain simulation model is disclosed, with connected domain-specific representations that allow the use of the most relevant simulator technology for a given domain. The model has external connection points either expressed as actual ports or virtual ones, embodied by simulator API calls in the model.

Abstract: Techniques are provided for the transfer of data (e.g. electromagnetic losses and temperature for an electro-thermal simulation) between domains (e.g. 2D regions, 3D regions) with dissimilar topologies, e.g. to represent a physical object. Meshes from 2D and 3D regions of respective simulation models involved in the data transfer are projected onto and through one another. For profile preserving (e.g., temperature, convection coefficients, mesh displacements, etc.) and conservative (e.g., force, mass, or thermal energy, etc.) data transfers, shape functions and area/volume fractions are used in mapping weight generation, respectively. These weights are later used to generate field values on the mesh of the target simulation model, using data from the mesh of the source simulation model. Related apparatus, systems, techniques and articles are also described.

Abstract: A method and apparatus for extending, customizing and validating a simulation-based digital twin model is described. In an exemplary embodiment, the device transmits a model to a client, where the model is a simulation-based digital twin model. In addition, the device receives a customization to the model, the where the customization adds a functionality to the model. Furthermore, the device deploys the model in a model platform, where the model is used in a simulation with the model platform and the model is coupled with the model platform.

Abstract: Methods and systems for performing timing analysis during the design of a circuit are described. In one embodiment, a simulation system can generate an effective resistance value (or an impedance value based on the effective resistance value) for an instance and use the effective resistance value in a simulation to determine a minimum timing delay for the instance when only the instance switches during such simulations.

Abstract: Methods and apparatuses that generate a simulation object for a physical system are described. The simulation object includes a trained computing structure to determine future output data of the physical system in real time. The computing structure is trained with a plurality of input units and one or more output units. The plurality of input units include regular input units to receive input data and output data of the physical system. The output units include one or more regular output units to predict a dynamic rate of change of the input data over a period of time. The input data and output data of the physical system are obtained for training the computing structure. The input data represent a dynamic input excitation to the physical system over the period of time. And the output data represents a dynamic output response of the physical system to the dynamic input excitation over the period of time.

Abstract: Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. The methods can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC); performing a thermal simulation for each respective template of the IC based on a sequence of power patterns of tiles of the respective template; and training a neural network with a plurality of training data collected via thermal simulations performed for the templates of the IC. These systems and methods can use a machine learning predictor, that has been trained to determine a transient temperature rise across an entire IC, and then append the determined transient temperature rise to a system level thermal profile of the IC.

Abstract: A system and method of modeling flow of a vasculature in near real-time, is described. A vessel segment of the vasculature is modeled by a reduced order model, and a remainder of the vasculature is modeled by a 0D model. The reduced order model is generated using boundary conditions generated by a 0D model of the entire vasculature. Moreover, the reduced order model of the vessel segment and the 0D model of the remainder of the vasculature can be coupled to simulate flow that can be compared to actual flow measurements to personalize the 0D model of the remainder of the vasculature for a patient. Accordingly, a physician can update parameters of the personalized vascular system model to predict the effects of treatment protocols, including exercise or therapeutic substances, on the patient. Other embodiments are also described and claimed.

Abstract: A method in one embodiment creates a model of an authentic IC for use in comparisons with counterfeit ICs. The model can be created by determining a first or initial set of points of interest (POIs) on the simulated physical (e.g., gate level) layout and simulating side channel leakage from each POI and then expanding the size of the POI and repeating the simulation and comparing successive simulation results (between successive sizes of POIs for a given POI) to determine if a solution for the size of the POI has converged. The final POIs are then processed in a simulation that can use multiple payloads (e.g., cryptographic data) over the entire set of final POIs, and the resulting data set can be used to create the model.

Abstract: Systems and methods are provided. A physical measurement of the core loss increase associated with a physical deformation of a material of the device is obtained. A data structure describing a model of the device is accessed. A first edge of the model of the device associated with a physical deformation of the device is identified. A finite element mesh is generated to include a single layer mesh comprising a plurality of mesh elements associated with the first edge of the finite element mesh. A core loss value is assigned to each of the plurality of mesh elements. Each of the core loss values representative of the physical measurement of the core loss increase of the material as a result of the physical deformation of the material. An electromagnetic model is generated by performing a finite element analysis based on the finite element mesh and the single layer mesh.

Abstract: A specification of a honeycomb based crash barrier including a cell is received in a computer system. The cell contains trapped air. A model representing the honeycomb based crash barrier is generated. The trapped air in the cell is represented as a compressible element, which is characterized by a force-deflection relationship between an air pressure in the cell and a crush-distance of a compression of the cell. Physical behaviors of the honeycomb based crash barrier are simulated using the model. The physical behaviors include numerical behaviors of the trapped air based on the force-deflection relationship.

Abstract: Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. These systems and methods can use a neural network based predictor, that has been trained to determine a temperature rise across an entire IC. The training of the predictor can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC), each template associated with location parameters to position the template in the IC; performing thermal simulations for each respective template of the IC, each thermal simulation determining an output based on a power pattern of tiles of the respective template, the output indicating a change in temperature of a center tile of the respective template relative to a base temperature of the integrated circuit; and training a neural network.

Abstract: A chip package system comprising N multiple processor cores can be tested by receiving a data file characterizing the chip package system. Thereafter, simulation testing is conducted for each core for each of Mi . . . j states using the data file such that each core is active in each state while all other cores are inactive. Each simulation test results in a simulation. The simulations are then combined to result in a composite test covering MN*j combinations. Related apparatus, systems, techniques and articles are also described.

Abstract: A computer-implemented method for meshing a model of a physical electro-magnetic assembly is disclosed. The method includes separating the base mesh of the model into two domains and freezing the boundary between these domains. Each domain is then sent for mesh refinement by separate computer processors. Each computer processor generates a refined mesh of the respective domain without communication between processors. Two-way boundary mesh mapping is then performed, resulting in a global conformal mesh. Surface recovery and identity assignment are then performed by separate computer processors in parallel for each domain, without communication between processors. Related apparatus, systems, techniques, methods and articles are also described.

Abstract: Systems and methods for deriving material coefficient values from physical measurements of physical objects are described. These physical measurements can provide material test data.

Abstract: A specification for a semi-conductor chip is received. The specification specifies a set of photomasks associated with a metal layer of the semi-conductor chip. Multiple portions of an area of the metal layer are identified. A respective image is generated for each portion of the area based on the photomasks. A respective drawn density of metal wires for each portion of the area is calculated. A trained machine learning model is invoked to predict a respective silicon density of metal wires for each respective portion of the area based on an image and a drawn density for the respective portion of the area. A silicon density for the area of the metal layer is calculated based on a combination of predicted silicon densities for the multiple portions of the area. The combination is based on an average value of the predicted silicon densities for the multiple portions of the area.

Abstract: Systems and methods for simulating a circuit board design include receiving a printed circuit board design comprising an electronic component and a dielectric board, generating a first finite element model of the dielectric board independent of the electronic component, and generating a second finite element model for the electronic component. The method further includes combining the first finite element model with the second finite element model to obtain a final finite element model for the printed circuit board design.

Abstract: Methods for modeling contact pairs in a model of a physical object include generating a contact pair including a contact surface and a target surface, where the contact pair further includes contact elements of the contact surface and the target surface, splitting the contact pair into contact sub-pairs along splitting boundaries, augmenting each contact sub-pair with contact elements from adjacent contact sub-pairs at the splitting boundaries, distributing the augmented contact sub-pairs to a plurality of parallel processors for finite element solutions of the contact sub-pairs, receiving the finite element solutions of the contact sub-pairs from the plurality of parallel processors, and combining the finite element solutions of the contact sub-pairs into finite element solutions of the contact pair.

Abstract: Computer-implemented systems and methods are described herein for determining mechanical properties of an electronic assembly. An input specification for a model of the electronic assembly is received, wherein the input specification includes a compressible body and a surrounding component in the electronic assembly. A geometric interference between the compressible body and the surrounding component is identified. A displacement is generated for the compressible body to account for the geometric interference. A non-linear contact is then generated between the displaced compressible body and the surrounding component. The model is updated with the displacement and the non-linear contact. Then, a resulting force equilibrium is determined within the electronic assembly based on the updated model, wherein the resulting force equilibrium is determined by removing the displacement from the updated model.

Abstract: Data characterizing an assembly/structure containing a first stage and a second stage are received in a computer system. The first stage can contain a first cyclic symmetry and the second stage can contain a second cyclic symmetry. The first cyclic symmetry and the second cyclic symmetry are different from each other. Each stage may be a 360-degree stage. The received data includes a first mesh representing the first stage and a second mesh representing the second stage. Multiple simulation results are obtained using corresponding models in respective dynamic analyses of the assembly. Each model includes a set of constraints for coupling the first mesh and the second mesh. The set of constraints is associated with a group of distinct linked harmonic indices. Physical behaviors of the assembly are then calculated using one or more sets of the simulation results. Constraints are in forms of constraint equations.