Patents Assigned to Ansys, Inc.
  • Patent number: 11409932
    Abstract: Systems and methods are provided herein for estimating an output current of an input/output (I/O) driver given a set of voltages present at pins of the I/O driver. A set of voltages are received comprising voltages present at a power pin, a ground pin, at least three input pins, and at least three output pins of an I/O driver. Neural network models are applied to one or more voltages of the set of voltages to determine currents associated the I/O driver. A state space model is applied to one or more voltages of the set of voltages to determine another current of the I/O driver. An output current of the I/O driver is estimated based on the currents and the one or more values.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: August 9, 2022
    Assignee: Ansys, Inc.
    Inventor: Shan Wan
  • Patent number: 11403445
    Abstract: First FEA mesh model representing 3-D geometry of a carbon fiber reinforced composite (CFRC) product/part, pre-forming fiber orientation and desired reference fiber direction at a particular location on the product/part are received. First FEA mesh model contains finite elements associated with respective material properties for carbon fibers and binding matrix. Pre-forming fiber orientation includes number of fibers and relative angles amongst the fibers. Pre-forming 2-D shape of a workpiece used for manufacturing the product/part is obtained by conducting a one-step inverse numerical simulation that numerically expands the first to a second FEA mesh model based on numerically-calculated structural behaviors according to respective material properties. Pre-forming fiber orientation is superimposed on the second FEA mesh model with the desired reference fiber direction being preserved.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: August 2, 2022
    Assignee: ANSYS, Inc.
    Inventors: Xinhai Zhu, Houfu Fan, Li Zhang, Hao Chen, Jinglin Zheng
  • Patent number: 11386249
    Abstract: Systems and methods are provided for simulating propagation of cracks in an object in a physical system. Data indicative of the object in the physical system is received, where the object includes a plurality of cracks. Characteristics of each of the plurality of cracks are determined based on the data, and a weight value is calculated for each of the plurality of cracks based on the determined characteristics. A group of one or more processors is assigned to simulate behavior of each crack, where a number of processors assigned to each group is based on the calculated weight value associated with that crack. Simulation data is received from each of the groups of processors, and the simulation data is stored in a non-transitory computer-readable medium.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: July 12, 2022
    Assignee: Ansys, Inc.
    Inventors: Shanhu Li, Guoyu Lin, Jeffrey R. Beisheim, Rajanikanth Jayaseelan
  • Patent number: 11366947
    Abstract: Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. These systems and methods can use a neural network based predictor, that has been trained to determine a temperature rise across an entire IC. The training of the predictor can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC), each template associated with location parameters to position the template in the IC; performing thermal simulations for each respective template of the IC, each thermal simulation determining an output based on a power pattern of tiles of the respective template, the output indicating a change in temperature of a center tile of the respective template relative to a base temperature of the integrated circuit; and training a neural network.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: June 21, 2022
    Assignee: ANSYS, INC.
    Inventors: Norman Chang, Hsiming Pan, Jimin Wen, Deqi Zhu, Wenbo Xia, Akhilesh Kumar, Wen-Tze Chuang, En-Cih Yang, Karthik Srinivasan, Ying-Shiun Li
  • Patent number: 11361124
    Abstract: A power profile for an electronics design is implemented by accessing a unit descriptive of an electronic design comprising a first intellectual property (IP) block expressed in a simulation language and comprising a netlist. A total number (NT) of net weights are identified in the netlist, wherein each respective net weight is proportional to an effective load capacitance of an associated net. A total number (NP) of populated nets having associated toggle simulation data are identified in the netlist. A ratio (KS) equal to a sum of all NT net weights divided by a sum of all NP populated net weights is generated. A sample energy (ES) is generated based on the associated toggle simulation data of and net weights for each of the NP populated nets. And a block power profile is modelled based on an estimated block energy (EN) equal to KS multiplied by ES.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: June 14, 2022
    Assignee: Ansys, Inc.
    Inventor: Paul Traynar
  • Patent number: 11354483
    Abstract: Improved parasitic analysis of a design of an electrical circuit (e.g. a PCB coupled to an IC package) can use a first parasitic analysis to identify a first set of pins having excessive parasitic values (“hotspots” in the design) and then identify a second set of pins that do not have excessive parasitic values. The pins in the second set can be clustered (e.g. using a grid of cells) to reduce a model size for calculations in a second parasitic analysis, and the pins in the first set can be analyzed in the second parasitic analysis either individually or in clusters of similar pins with excessive parasitic values.
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: June 7, 2022
    Assignee: ANSYS, INC.
    Inventor: Prakash Vennam
  • Patent number: 11354475
    Abstract: Systems and methods are provided for simulating an integrated circuit system. A file representative of an integrated circuit layout is received, the integrated circuit layout including a plurality of cells and characteristics of power supply and ground paths to each cell. A vulnerable cell of the integrated circuit layout based on a vulnerability characteristic of the vulnerable cell. A power analysis of a portion of the integrated circuit layout is performed to determine a plurality of power and ground levels within a timing window for each of a plurality of cells including the vulnerable cell. A timing analysis of the vulnerable cell is performed, where the timing analysis receives a single power level and single ground level for the vulnerable cell and determines a slack level for the vulnerable cell. An at risk path is identified based on the vulnerable cell slack level, and a dynamic power/ground simulation of one or more cells in the at risk path is performed.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: June 7, 2022
    Assignee: Ansys, Inc.
    Inventors: Joao Moreno Geada, Nicholas Lee Rethman, Ankur Gupta
  • Patent number: 11321216
    Abstract: A computer-implemented method for rich logging of simulation results is disclosed. The method includes running a simulation of a physical process, generating log file entries with contextual attributes about a state of the simulation, storing the log file entries in a database, receiving a query to the database from a client browser referencing a contextual attribute, generating a message from the database in response to the query, and displaying a message in a rich text document on the client browser. Related apparatus, systems, techniques, methods and articles are also described.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: May 3, 2022
    Assignee: Ansys, Inc.
    Inventors: Jean-Daniel Beley, Stephane Garreau
  • Patent number: 11321513
    Abstract: Techniques for computer aided design and engineering of integrated circuits can use group identifiers of correlated signals and time delay values when using vectorless dynamic voltage drop (DVD) simulations and when using other types of simulations or analyses of a circuit design. A method in one embodiment can include the operations of: receiving a design representing an electrical circuit that includes a plurality of pins, the plurality of pins including one or more input nodes or one or more output nodes in the electrical circuit; identifying, in the design, one or more groups of pins that are correlated such that, within each identified group, all of the pins in the identified groups switch between voltage states in a correlated way; assigning, for each pin in each identified group, an identifier for the identified group and a time delay value based on the pin's delay from an initial point in the identified group's logic chain to the pin.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: May 3, 2022
    Assignee: ANSYS, INC.
    Inventors: Joao Geada, Emrah Acar, Altan Odabasi, Scott Johnson
  • Patent number: 11314305
    Abstract: Methods and systems are described that improve simulations which use thermal models to test dynamic thermal mitigation of devices, such as smartphones. These methods and systems can use a thermal Reduced Order Model (ROM) that is trained through machine learning to provide efficient systems that can significantly reduce the time and computational resources required to build a simulation of a device's thermal behavior. The thermal model can be used in different usage scenarios with different power management and thermal management controls to test the device's thermal behavior.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: April 26, 2022
    Assignee: ANSYS, INC.
    Inventors: Aniket Abhay Kulkarni, Shitalkumar Joshi
  • Patent number: 11313949
    Abstract: A method for building a coherent radar cross-section (RCS) model database for real-time dynamic simulation of range-Doppler radars is disclosed. The database may be used with radar sensors that employ different waveforms. A pre-processing operation before the dynamic simulation performs fast Fourier Transforms (FFTs) to interpolate the target frequency responses from the database to match the frequency samplings of the radar used in the dynamic simulation. The method determines the frequency responses of the targets to a reference chirp in a coherent processing interval (CPI) and the radial velocities of the targets relative to the radar at the time of the reference chirp. The method extrapolates, using FFTs, the frequency responses of the targets to the reference chirp across the velocity dimension based on the relative radial velocities to determine the frequency responses of the targets to the other chirps across the CPI, reducing the computational burden for the simulation.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: April 26, 2022
    Assignee: ANSYS, INC.
    Inventor: Robert A. Kipp
  • Patent number: 11302075
    Abstract: Data is received that encapsulates a model of a solid object. The model includes a set of boundary surfaces that are approximately parallel to a medial surface of the solid object. Thereafter, a tetrahedral mesh is generated to represent an interior of the solid object with tetrahedral elements having nodes located on the boundary surfaces. Cuttings are generated for each tetrahedral element based on the nodes. These generated cuttings are used to construct a representation of the medial surface of the solid object. Related apparatus, systems, techniques and articles are also described.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: April 12, 2022
    Assignee: Ansys, Inc.
    Inventors: Luigi Giaccari, Vaibhav Kurade, Hanzhou Zhang, Young Kyu Lee
  • Patent number: 11301608
    Abstract: Methods, machine readable media and systems for simulating the leakage of sensitive data in an integrated circuit, such as cryptographic data or keys, are described. In one embodiment, a method can include the following operations: performing a first dynamic voltage drop (DVD) simulation on a plurality of locations, distributed across an integrated circuit (IC), based on a physical model that specifies physical layout of components on the IC, the IC storing sensitive data in locations of the layout; performing an IC level side channel correlation analysis between each of the locations and the sensitive data based on the results of the first DVD simulation; and selecting, based upon the IC level side channel correlation analysis, a subset of the locations for further simulations to simulate leakage of the sensitive data. Other methods, media and systems are disclosed.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: April 12, 2022
    Assignee: ANSYS, INC.
    Inventors: Lang Lin, Dinesh Kumar Selvakumaran, Norman Chang, Calvin Chow, Deqi Zhu
  • Patent number: 11288339
    Abstract: Systems and methods are provided for generating a state space model of a physical system. Embodiments of a computer-implemented system may include a physical system data structure that includes frequency-domain response data that is indicative of a response of one or more components of a physical system to a stimulus, and a state space model generation engine that is configured generate a state space model based on the frequency-domain response data, where the state space model is usable to simulate a time-domain response of the one or more components of the physical system.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: March 29, 2022
    Assignee: Ansys, Inc.
    Inventor: Amit Hochman
  • Patent number: 11288421
    Abstract: Computationally efficient methods of determining a transient supply current in a circuit are disclosed. The methods include offline simulation of circuit models to obtain time series of signal currents which are used in a dynamic simulation to calculate equivalent capacitances for a cell model of the circuit. The equivalent capacitances may be used in the simulation to compute estimates of noise current in a power distribution network.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: March 29, 2022
    Assignee: Ansys, Inc.
    Inventors: Deqi Zhu, Chao Jiao, Yu Lu, Xiaoqin Liu
  • Patent number: 11282274
    Abstract: Computer-implemented systems and methods for generating a mesh and conformally connecting the mesh to an existing mesh are provided. The existing mesh is displayed via a graphical user interface (GUI) of a computer-aided design modeling system using a processing system. A polyhedral mesh is generated in an empty space adjacent to the existing mesh using the processing system. The generating of the polyhedral mesh includes (i) defining the empty space as a first surface mesh comprising triangles, quadrilaterals, polygonals, or a mixture thereof, (ii) generating a dual of the first surface mesh to form a second surface mesh, the empty space being enclosed by the second surface mesh, and (iii) filling a gap region between the first and second surface meshes with the polyhedral mesh and conformally connecting the polyhedral mesh to the existing mesh using the processing system.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: March 22, 2022
    Assignee: Ansys, Inc.
    Inventors: Wenyan Wang, Shuli Yang, Jan Ivan Vilhem Frykestig
  • Patent number: 11269478
    Abstract: An improved help system for a user interface of a computer program uses a mask with one or more cutouts to focus a user's attention to the cutout portion(s) and uses the mask to display dynamically positioned help information, such as roll over hints, in the available space on the mask. An intelligent placement algorithm is used to control placement of the help information to avoid overlaps among the help information displayed on the mask. The portions of the user interface (UI) under the mask not selectable while under the one or more masks and the other portions of the UI are selectable while in the one or more cutouts. The roll over hints can be similar to coach marks that include arrows that point from the help information on the mask to an associated UI command in a cutout.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: March 8, 2022
    Assignee: ANSYS, INC.
    Inventors: Gregory Mark Alldredge, Frank E. DeSimone, Sanjaykumar Ranganayakulu, May Salim Hourani
  • Patent number: 11256239
    Abstract: Methods and systems are disclosed for simulating a fabrication process based on real time sensor measurements obtained during the process. In one embodiment, a first simulation of the process computes a set of predicted physical responses based on a first set of assumed boundary conditions, and then, during the fabrication process sensor measurements are obtained and used to compute a second set of boundary conditions. A second simulation, based on the second set of boundary conditions, can then be performed to compute an updated set of predicted physical responses that can be compared to the previously computed set of physical responses. The difference(s) can be used to determine line, surface or volumetric response distribution from point, line or surface boundary conditions respectively, whether and how to modify the fabrication process (or other processes) and how to take additive and other manufacturing process decisions real-time using simulation. Other examples are also described.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: February 22, 2022
    Assignee: ANSYS, INC.
    Inventors: Deepankar Pal, Madhu Keshavamurthy
  • Patent number: 11250195
    Abstract: Machine assisted system and method for performing dynamic thermal management (DTM) analysis are described. In one embodiment, the method can include receiving a power profile associated with IP blocks in an integrated circuit (IC) system modeled by a Krylov reduced order model (ROM). The power profile can represent power consumption of each of the blocks based on a predefined operating scenario. The method can additionally include evaluating the temperature of each of the blocks of the IC system for the current time step based on the power profile and the Krylov ROM. The method can further include calculating new power values based on the current temperature field of each of the blocks of the IC system, wherein the power profile can be updated with the new power value for the temperature of each of the blocks of the IC system for the next time step.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: February 15, 2022
    Assignee: ANSYS, INC.
    Inventors: Myunghoon Lee, Vamsi Krishna Yaddanapudi, Aniket Abhay Kulkarni
  • Publication number: 20220027540
    Abstract: A structure model representing a physical object, a fluid model representing a fluid domain, and a set of particles representing a fluid-structure interaction (FSI) interface between the fluid model and the structure model are received in a computer system. Fluid behaviors of the fluid domain are simulated using the fluid model. Respective friction and pressure forces are calculated at the set of particles of the FSI interface. Each particle's friction and pressure forces are calculated from the simulated fluid behaviors and each particle's location in the fluid model. Structural behaviors of the physical object are simulated using the structure model in response to the friction and pressure forces at the set of particles on the FSI interface. The simulated structural behaviors update each particle's location. The updated location is used in the subsequent calculations of the friction and pressure forces.
    Type: Application
    Filed: October 11, 2021
    Publication date: January 27, 2022
    Applicant: ANSYS, Inc.
    Inventors: Facundo DEL PIN, Chi-Hsien WANG