Abstract: A method in one embodiment creates a model of an authentic IC for use in comparisons with counterfeit ICs. The model can be created by determining a first or initial set of points of interest (POIs) on the simulated physical (e.g., gate level) layout and simulating side channel leakage from each POI and then expanding the size of the POI and repeating the simulation and comparing successive simulation results (between successive sizes of POIs for a given POI) to determine if a solution for the size of the POI has converged. The final POIs are then processed in a simulation that can use multiple payloads (e.g., cryptographic data) over the entire set of final POIs, and the resulting data set can be used to create the model.

Abstract: Systems and methods are provided. A physical measurement of the core loss increase associated with a physical deformation of a material of the device is obtained. A data structure describing a model of the device is accessed. A first edge of the model of the device associated with a physical deformation of the device is identified. A finite element mesh is generated to include a single layer mesh comprising a plurality of mesh elements associated with the first edge of the finite element mesh. A core loss value is assigned to each of the plurality of mesh elements. Each of the core loss values representative of the physical measurement of the core loss increase of the material as a result of the physical deformation of the material. An electromagnetic model is generated by performing a finite element analysis based on the finite element mesh and the single layer mesh.

Abstract: A specification of a honeycomb based crash barrier including a cell is received in a computer system. The cell contains trapped air. A model representing the honeycomb based crash barrier is generated. The trapped air in the cell is represented as a compressible element, which is characterized by a force-deflection relationship between an air pressure in the cell and a crush-distance of a compression of the cell. Physical behaviors of the honeycomb based crash barrier are simulated using the model. The physical behaviors include numerical behaviors of the trapped air based on the force-deflection relationship.

Abstract: Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. These systems and methods can use a neural network based predictor, that has been trained to determine a temperature rise across an entire IC. The training of the predictor can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC), each template associated with location parameters to position the template in the IC; performing thermal simulations for each respective template of the IC, each thermal simulation determining an output based on a power pattern of tiles of the respective template, the output indicating a change in temperature of a center tile of the respective template relative to a base temperature of the integrated circuit; and training a neural network.

Abstract: A chip package system comprising N multiple processor cores can be tested by receiving a data file characterizing the chip package system. Thereafter, simulation testing is conducted for each core for each of Mi . . . j states using the data file such that each core is active in each state while all other cores are inactive. Each simulation test results in a simulation. The simulations are then combined to result in a composite test covering MN*j combinations. Related apparatus, systems, techniques and articles are also described.

Abstract: Systems and methods for deriving material coefficient values from physical measurements of physical objects are described. These physical measurements can provide material test data.

Abstract: A computer-implemented method for meshing a model of a physical electro-magnetic assembly is disclosed. The method includes separating the base mesh of the model into two domains and freezing the boundary between these domains. Each domain is then sent for mesh refinement by separate computer processors. Each computer processor generates a refined mesh of the respective domain without communication between processors. Two-way boundary mesh mapping is then performed, resulting in a global conformal mesh. Surface recovery and identity assignment are then performed by separate computer processors in parallel for each domain, without communication between processors. Related apparatus, systems, techniques, methods and articles are also described.

Abstract: A specification for a semi-conductor chip is received. The specification specifies a set of photomasks associated with a metal layer of the semi-conductor chip. Multiple portions of an area of the metal layer are identified. A respective image is generated for each portion of the area based on the photomasks. A respective drawn density of metal wires for each portion of the area is calculated. A trained machine learning model is invoked to predict a respective silicon density of metal wires for each respective portion of the area based on an image and a drawn density for the respective portion of the area. A silicon density for the area of the metal layer is calculated based on a combination of predicted silicon densities for the multiple portions of the area. The combination is based on an average value of the predicted silicon densities for the multiple portions of the area.

Abstract: Methods for modeling contact pairs in a model of a physical object include generating a contact pair including a contact surface and a target surface, where the contact pair further includes contact elements of the contact surface and the target surface, splitting the contact pair into contact sub-pairs along splitting boundaries, augmenting each contact sub-pair with contact elements from adjacent contact sub-pairs at the splitting boundaries, distributing the augmented contact sub-pairs to a plurality of parallel processors for finite element solutions of the contact sub-pairs, receiving the finite element solutions of the contact sub-pairs from the plurality of parallel processors, and combining the finite element solutions of the contact sub-pairs into finite element solutions of the contact pair.

Abstract: Systems and methods for simulating a circuit board design include receiving a printed circuit board design comprising an electronic component and a dielectric board, generating a first finite element model of the dielectric board independent of the electronic component, and generating a second finite element model for the electronic component. The method further includes combining the first finite element model with the second finite element model to obtain a final finite element model for the printed circuit board design.

Abstract: Data characterizing an assembly/structure containing a first stage and a second stage are received in a computer system. The first stage can contain a first cyclic symmetry and the second stage can contain a second cyclic symmetry. The first cyclic symmetry and the second cyclic symmetry are different from each other. Each stage may be a 360-degree stage. The received data includes a first mesh representing the first stage and a second mesh representing the second stage. Multiple simulation results are obtained using corresponding models in respective dynamic analyses of the assembly. Each model includes a set of constraints for coupling the first mesh and the second mesh. The set of constraints is associated with a group of distinct linked harmonic indices. Physical behaviors of the assembly are then calculated using one or more sets of the simulation results. Constraints are in forms of constraint equations.

Abstract: Computer-implemented systems and methods are described herein for determining mechanical properties of an electronic assembly. An input specification for a model of the electronic assembly is received, wherein the input specification includes a compressible body and a surrounding component in the electronic assembly. A geometric interference between the compressible body and the surrounding component is identified. A displacement is generated for the compressible body to account for the geometric interference. A non-linear contact is then generated between the displaced compressible body and the surrounding component. The model is updated with the displacement and the non-linear contact. Then, a resulting force equilibrium is determined within the electronic assembly based on the updated model, wherein the resulting force equilibrium is determined by removing the displacement from the updated model.

Abstract: A system for simulating operation of a battery pack comprising a plurality of battery modules includes an electrical model configured to simulate electrical behavior of a respective battery module and a thermal model configured to simulate thermal behavior of the respective battery module. The electrical model provides outputs coupled as inputs to the thermal model, and the thermal model provides outputs coupled as inputs to the electrical model. A coolant model is configured to couple with the thermal model, the coolant model to simulate cooling of the respective battery module based on a temperature and a heat transfer coefficient associated with the respective battery module.

Abstract: Systems and methods are provided herein for a layered volume mesh of a physical object in an additive manufacturing process. A surface mesh representing the physical object is sliced and layered into a plurality of virtual layer planes. The surface mesh includes a plurality of nodes. Volume meshing of the modified surface mesh is performed to generate the layered volume mesh.

Abstract: Extraction of capacitance values from a design of an electrical circuit can use a set of trained neural networks to generate extracted capacitance values from the circuit using a representation of the Green's function.

Abstract: A global computer aided engineering (CAE) model representing an electronic product that contains solder joints and an individual detailed solder joint model are received. The solder joint model can include a solder ball, one or more metal pads, a portion of printed circuit board, and a portion of semiconductor chip component. The global CAE model includes locations of the solder joints to be evaluated in a drop test simulation. The solder joint model is replicated at each location to create a local CAE model via a geometric relationship between the global CAE model and the local CAE model. Simulated physical behaviors of the product under a design condition are obtained in a co-simulation using the global CAE model in a first time scale and the local CAE model in a second time scale. Simulated physical behaviors are periodically synchronized based on kinematic and force constraints.

Abstract: Analysis of power supply noise in simulations of a design of a circuit can use per instance dynamic voltage drops (DVD) in timing analyses so that the simulated DVD values on a per victim cell basis can accurately guide the timing analysis on each victim instead of a global DVD for all victims during the timing analysis. In one embodiment, a method can: determine, during a power analysis simulation, a representation of an energy lost, during each switching window at each output of each victim cell, at one or more power supply rails of each of the victim cells in the set of victim cells due to aggressors in the design; and provide the representation of the energy lost separately for each victim cell to a timing analysis system. The representation can be a rectangle having a width defined by a switching window of a victim's output.

Abstract: A computer aided design can be decomposed into multiple domains or regions in a domain decomposition method, and then one or more finite element method boundary conditions at an interface between the domains can be imprinted on the faces of the domains at the interface, and then mesh generation can be performed independently on the domains. Thus, nonconformal domain decomposition can use the imprinting of the boundary conditions to improve the results of the independent mesh generation.

Abstract: An embodiment of a method can create a directed acyclic graph (DAG) from a programmer specified set of computation units to solve, in a computer program, physics based simulations of physical systems, and the DAG can be used to analyze and debug the computer program. In this method, the computer program can be created by automatically determining dependency relationships in the set of computation units and automatically schedule their execution. The method can also automatically allocate memory for the computation units.

Abstract: In one embodiment, a wizard can automate a setup of a welding simulation by requiring the input of data (e.g. in data entry fields labelled as required) that is used to automatically set up a welding simulation. The wizard can be part of a general purpose mechanical simulation software package, and the wizard can receive inputs from CAD software that specifies the geometrical shapes of bodies of the assembly to be welded and the filling material itself and physical properties of bodies to be welded (e.g. sizes of bodies, number of bodies, physical arrangement and geometries of bodies, melting temperatures, etc.), in addition to the material physical properties and the wizard can provide outputs to the mechanical simulation software package to provide boundary conditions for use in the mechanical simulation software that can use finite element analysis methods in simulations.