Abstract: A method of manufacturing a capacitor assembly package structure includes providing a capacitor unit and a conductive connection layer, in which the capacitor unit includes a plurality of capacitors, and each of the capacitors includes a positive portion and a negative portion electrically connected to the conductive connection layer; partially enclosing the capacitors by an insulative package body, in which the positive portion of each of the capacitors has a positive lateral surface exposed from a first lateral surface of the insulative package body; and then enclosing a first portion of the insulative package body and electrically connecting to the positive portion of each of the capacitors by a first electrode structure, and enclosing a second portion of the insulative package body and electrically connecting to the conductive connection layer by a second electrode structure.

Abstract: A capacitor element and a method for manufacturing the same are provided. The method for manufacturing the capacitor element includes steps of: providing a metal foil having an oxide layer formed on an outer surface of the metal foil; forming a surrounding barrier layer surroundingly on the oxide layer with the surrounding barrier layer surroundingly formed on an outer surface of the oxide layer; forming a priming layer onto the oxide layer; immersing the priming layer into a chemical synthesis solution for undergoing a chemical synthesis reaction; drying the priming layer so as to form a repaired layer on the priming layer; forming a conductive polymer layer on the repaired layer; and forming a conductive paste layer on the conductive polymer layer with the conductive paste layer including a silver paste layer.

Abstract: A winding capacitor package structure and a method of manufactured the same are provided. The winding capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a winding positive foil and a winding negative foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure includes a main casing for enclosing the filling body and a retaining body inwardly bent from a bottom side of the main casing. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be retained and limited inside the casing structure through the retaining body.

Abstract: A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a positive winding conductive foil and a negative winding conductive foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure has an inner rough surface. The bottom carrier frame is disposed on a bottom portion of the casing structure. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be limited inside the casing structure through friction force provided by the inner rough surface.

Abstract: A capacitor assembly package structure and a method of manufacturing the same are provided. The capacitor assembly package structure includes a capacitor unit, an insulative package body, a conductive connection layer and an electrode unit. The capacitor unit includes a plurality of capacitors, and each capacitor includes a positive portion and a negative portion. The insulative package body partially encloses the capacitors, and the positive portion has a positive lateral surface exposed from a first lateral surface of the insulative package body. The conductive connection layer is electrically connected to the negative portion. The electrode unit includes a first electrode structure and a second electrode structure. The first electrode structure encloses a first portion of the insulative package body and electrically connects to the positive portion, and the second electrode structure encloses a second portion of the insulative package body and electrically connects to the conductive connection layer.

Abstract: A stacked solid electrolytic capacitor is provided in the present disclosure. The stacked solid electrolytic capacitor includes a capacitive module, a conductive module and a packaging structure. The capacitive module includes capacitive units stacked up sequentially. The conductive module includes a positive terminal, a negative terminal and at least one anti-oxidizing layer. The positive terminal is electrically connected to one of the capacitive units. The negative terminal is electrically connected to the one of the capacitive units through a conductive paste layer. The at least one anti-oxidizing layer is arranged between the negative terminal and the conductive paste layer. The packaging structure surrounds the capacitive module and the conductive module. Therefore, it is difficult for an oxide layer forming between the negative terminal and the capacitive units, and the equivalent series resistance of the stacked solid electrolytic capacitor can be reduced.

Abstract: A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly and a conductive assembly. The winding assembly includes a winding conductive positive foil and a winding conductive negative foil. The package assembly fully encloses the winding assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The package assembly includes a casing structure, a filling body and a bottom enclosing structure. The casing structure has an accommodating space for receiving the winding assembly. The filling body is filled in the accommodating space for surrounding the winding assembly. The bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space. The bottom enclosing structure is surrounded by the casing structure and tightly connected to the filling body.

Abstract: A winding type capacitor assembly with enhanced structural strength and a manufacturing method thereof are provided. The winding type capacitor assembly includes a positive conductive foil, a negative conductive foil, and at least one isolation element. The isolation element is disposed between the positive conductive foil and the negative conductive foil. A conductive polymer dispersed sol and an electrolyte filler are disposed between the positive conductive foil, the negative conductive foil, and the isolation element. The electrolyte filler is at least one selected from one of a conductive composition synthesized by a chemical polymerization method and a resin-blended conductive particle. The winding type capacitor assembly has enhanced structural strength through the use of the electrolyte filler.

Abstract: A capacitor element and a method of manufacturing the same are provided. The method includes steps of: providing a metal foil having an oxide layer formed on an outer surface of the metal foil; forming a surrounding barrier layer onto the oxide layer so as to divide the outer surface of the oxide layer into a first part outer surface and a second part outer surface separated from each other; forming a base layer onto the oxide layer so as to partially encapsulate the oxide layer; cleaning the base layer by a cleaning solution and then drying the base layer; forming a conductive polymer layer onto the base layer; and forming a conductive paste layer onto the conductive polymer layer.

Abstract: A capacitor assembly structure and a method of manufacturing the same are provided. The capacitor assembly structure includes a capacitor unit, an insulative package body, a plurality of positive composite material layers, a conductive connection layer and an electrode unit. The capacitor unit includes a plurality of capacitors each having a positive portion and a negative portion. The insulative package body partially covers the capacitors. A lateral side of the positive portion is exposed from a first lateral surface of the insulative package body. Each positive composite material layer is disposed on the first lateral surface and the lateral side so as to electrically connect to the positive portion. The conductive connection layer is electrically connected to the negative portion. The electrode unit includes a first electrode structure electrically contacting the positive composite material layer and a second electrode structure electrically contacting the conductive connection layer.

Abstract: A method for forming the polymer composite material onto the capacitor element is provided. The method includes a preparing step, a resting step, an immersing step, and a polymerization step. The preparing step includes forming a homogeneous reaction solution containing 3,4-ethylenedioxythiophene, an emulsifier, polystyrene sulfonic acid or salts thereof, an oxidant, and a solvent. The resting step includes resting the homogeneous reaction solution to generate microparticles so that a nonhomogeneous reaction solution containing the microparticles is formed. The immersing step includes immersing the capacitor element into the nonhomogeneous reaction solution so that the nonhomogeneous reaction solution is coated onto the capacitor element and a reaction layer is formed on the capacitor element.

Abstract: A low leakage electrolytic capacitor includes a winding-type capacitor element, a hybrid electrically conductive medium and a package body. The winding-type capacitor element includes an anode foil, a cathode foil, and a separator interposed between the anode foil and the cathode foil. The hybrid electrically conductive medium is impregnated in the winding-type capacitor element and includes an electrically conductive polymer, an auxiliary polymer, an ion liquid, and a carbon filler. The package body encloses the winding-type capacitor element and the hybrid electrically conductive medium.

Abstract: The present invention provides a device for manufacturing a multi-layer stacked structure and a method for manufacturing a thin film capacitor. The method includes providing a carrier substrate, forming a plurality of first material layers and a plurality of second layers that are alternately stacked on top of one another to form a multi-layer stacked structure, and then forming two terminal electrode structures for respectively enclosing two opposite side portions of the multi-layer stacked structure. One of the first material layer and the second material layer has a plurality of conductive particles randomly distributed therein. The conductive particles are heated to form a spherical structure or a sphere-like structure with low melting point and high surface energy at a temperature that is smaller than the degradation temperature of polymers. Therefore, the dielectric constant of the multi-layer stacked structure and the thin film capacitor can be increased.

Abstract: The instant invention provides a capacitor package structure having a functional coating and the method for manufacturing the same. The method includes coating a silane coupling agent with a general formula of Y(CH2)nSiX3 on a capacitor element for forming the functional coating, in which X can be a same or different substituents and is selected from the group consisting of chloride, methoxy group, ethoxy group, methoxyethoxy group and acetoxy group, Y is a vinyl group, an amino group, an epoxy group, a methacryloyloxy group, a thiol group, a uramino group or an isobutyl group; and coating a conductive dispersion on the functional coating for enabling a polymer composite material in the functional coating to be connected to the surface of the capacitor element through the silane coupling agent.

Abstract: The present disclosure provides a lithium battery and a cathode foil thereof. The cathode foil includes a base material layer, a first material layer formed on the base material layer, and a second material layer including a plurality of particle structure groups disposed inside the first material layer. Each of the particle structure groups includes a plurality of particle structures connected with each other. One of the first material layer and the second material layer is formed by a pure silicon material without impurities, and another one of the first material layer and the second material layer is formed by a pure carbon material without impurities. Therefore, the structural strength and the ion transmission efficiency of the lithium battery with the cathode foil can be increased in virtue of the particle structures that are connected with each other.

Abstract: The instant disclosure provides a polymer composite material, the method for manufacturing the polymer composite material, a capacitor package structure using the polymer composite material and the method for manufacturing the capacitor package structure. The polymer composite material is used for the cathode of a capacitor, wherein the polymer composite material includes poly(3,4-ethylenedioxythiophene), polystyrene sulfonate and a nanomaterial. Polystyrene sulfonate is connected between the nanomaterial and poly(3,4-ethylenedioxythiophene), and polystyrene sulfonate is bonded to the poly(3,4-ethylenedioxythiophene) through a polymerization process. The content of the nanomaterial ranges from 0.01-1.5 wt. % based on the weight of the polymer composite material.

Abstract: The present disclosure provides a capacitor package structure and an anti-oxidation electrode foil thereof. The anti-oxidation electrode foil includes a base material structure, a first conductive material structure, and a first carbonaceous material structure. The base material structure has a top surface and a bottom surface. The first conductive material structure is disposed on the top surface of the base material structure. The first carbonaceous material structure is disposed on the first conductive material structure. One portion of the first conductive material structure is a first oxygenated metal compound for contacting the first carbonaceous material structure. The first oxygen-containing metal compound layer is disposed between the other portion of the first conductive material structure and the first carbonaceous material structure so as to prevent oxygen from contacting the other portion of the first conductive material structure.

Abstract: The instant disclosure provides a thin film capacitor and a method of manufacturing the same. The method includes the following steps: placing a carrier substrate on a processing machine including at least one processing unit, and the at least one processing unit having a metal-layer forming module and an insulation-layer forming module that are arranged along a planar production line; forming a plurality of metal layers by the metal-layer forming module of the at least one processing unit, forming a plurality of insulation layers by the insulation-layer forming module of the at least one processing unit, and the metal layers and the insulation layers being alternately stacked on the carrier substrate to form a multilayer stacked structure; and then forming two terminal electrode structures to respectively enclose two opposite side end portions of the multilayer stacked structure.

Abstract: The instant disclosure provides a capacitor package structure including a capacitor unit, a first enclosing layer and a second enclosing layer. The capacitor unit includes a capacitor, a first conductive pin and a second conductive pin. The first enclosing layer encloses the entire capacitor, a part of the first conductive pin and a part of the second conductive pin. The second enclosing layer encloses the entire first enclosing layer, a part of the first conductive pin and a part of the second conductive pin. One of the first enclosing layer and the second enclosing layer is a package gel formed by a package material, and another one of the first enclosing layer and the second enclosing layer is a moisture and air resistant film formed by a moisture and air resistant material.

Abstract: The instant disclosure provides a color-changeable capacitor package structure and a color-changeable capacitor casing structure thereof, and a circuit board assembly. The color-changeable capacitor casing structure includes a metal casing, a first covering layer and a second covering layer. The metal casing has an outer surface and an inner surface, and the metal casing has a receiving space for receiving a capacitor. The first covering layer is formed on the outer surface of the metal casing, the second covering layer is formed on the first covering layer, and one of the first covering layer and the second covering layer is a thermochromic layer for showing a color that is changeable according to temperature variation.