Patents Assigned to Apaq Technology Co., Ltd.
  • Patent number: 8369066
    Abstract: A lamellar stacked solid electrolytic capacitor includes a plurality of capacitor units, a substrate unit and a package unit. Each capacitor unit is composed of a negative foil, an isolation paper with conductive polymer substance, a positive foil, an isolation paper with conductive polymer substance and a negative foil that are stacked onto each other in sequence, the positive foils of the capacitor units are electrically connected to each other, the negative foils of the capacitor units are electrically connected to each other, and the positive foils and the negative foils are insulated from each other. The substrate unit has a positive guiding substrate electrically connected to the positive foils of the capacitor units and a negative guiding substrate electrically connected to the negative foils of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: February 5, 2013
    Assignee: Apaq Technology Co., Ltd.
    Inventors: Ching-Feng Lin, Yui-Hsin Fran, Chi-Hao Chiu, Ming-Tsung Chen, Cheng-Wei Lai, Chun-Chia Huang
  • Publication number: 20130010404
    Abstract: A capacitance unit includes an anode portion, an insulating portion, a cathode portion and a colloid portion. The front end of the anode portion extends to from an anode terminal. The insulating portion surrounds the anode portion and covers a first partial surface of the anode portion. The cathode portion is disposed next to the insulating portion, and the cathode portion covers a second partial surface of the anode portion. The colloid portion is disposed next to the insulating portion, and the colloid portion surrounds the cathode portion and covers a partial surface of the cathode portion.
    Type: Application
    Filed: July 7, 2011
    Publication date: January 10, 2013
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: CHI-HAO CHIU, CHING-FENG LIN, KUN-HUANG CHANG
  • Publication number: 20130010402
    Abstract: A manufacturing method of solid capacitors includes the following steps. First step is forming a plurality of separated adhesive layer on an insulating substrate. Next step is disposing valve-metal wires on the adhesive layers. Next step is forming a conductive layer on the adhesive layer and the valve-metal wires. Next step is forming a dielectric structure on the exposed surface of the valve-metal wires and the conductive layer. Next step is forming a hydrophobic layer and a conductive unit. Next step is separating the formed structures as individual capacitors. Next step is packaging the formed structures and forming terminals connected to the formed structures.
    Type: Application
    Filed: July 5, 2011
    Publication date: January 10, 2013
    Applicants: APAQ TECHNOLOGY CO., LTD., INPAQ TECHNOLOGY CO., LTD.
    Inventors: WEI-CHIH LEE, MING-TSUNG CHEN
  • Publication number: 20120300369
    Abstract: A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.
    Type: Application
    Filed: May 25, 2011
    Publication date: November 29, 2012
    Applicants: APAQ TECHNOLOGY CO., LTD., INPAQ TECHNOLOGY CO., LTD.
    Inventors: WEI-CHIH LEE, Ming-Tsung Chen
  • Patent number: 8310814
    Abstract: A stacked capacitor with positive multi-pin structure includes a plurality of capacitor units, a substrate unit and a package unit. Each capacitor unit has a positive electrode that has a positive pin extended outwards therefrom. The positive pins of the capacitor units are divided into a plurality of positive pin units that are separated from each other, and the positive pins of each positive pin unit are electrically stacked onto each other. Each capacitor unit has a negative electrode, and the negative electrodes of the capacitor units are electrically stacked onto each other. The substrate unit has a positive guiding substrate electrically connected to the positive pins of the capacitor units and a negative guiding substrate electrically connected to the negative electrodes of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: November 13, 2012
    Assignee: Apaq Technology Co., Ltd.
    Inventors: Chi-Hao Chiu, Yui-Hsin Fran, Ching-Feng Lin, Chun-Chia Huang
  • Patent number: 8305734
    Abstract: An insulating encapsulation structure is applied to a chip type solid electrolytic capacitor that includes an aluminum metallic body having an aluminum core layer. An upper oxide film and a lower oxide film respectively having fine holes on their surfaces are respectively formed on the top and the bottom of the aluminum core layer. On side surfaces of the metallic body is a plurality of cut burrs. The upper oxide film and the lower oxide film of the metallic body are respectively separated by a separating layer to form an anode and a cathode. The insulating encapsulation structure includes an insulating cover layer enclosing an outer surface of the metallic body to cover the cut burrs. Thereby, the required chemical conversion process is reduced along with current leakage, the overall manufacturing cost is lowered, and the mechanical strength for the edge of the metallic body is reinforced.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: November 6, 2012
    Assignee: Apaq Technology Co., Ltd.
    Inventors: Chi-Hao Chiu, Ming-Tsung Chen, Chiao-Yinms Yang
  • Patent number: 8305735
    Abstract: A stacked solid electrolytic capacitor with positive multi-pin structure includes a plurality of capacitor units, a substrate unit and a package unit. The positive electrode of each capacitor unit has a positive pin extended outwards therefrom. The positive pins are divided into a plurality of positive pin units that are separated from each other and electrically stacked onto each other. The negative electrode of each capacitor unit has a negative pin extended outwards therefrom. The negative pins are divided into a plurality of negative pin units. The negative pin units are separated from each other and the negative pins of each negative pin unit are electrically stacked onto each other. The substrate unit has a positive guiding substrate electrically connected to the positive pins and a negative guiding substrate electrically connected to the negative pins. The package unit covers the capacitor units and one part of the substrate unit.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: November 6, 2012
    Assignee: Apaq Technology Co., Ltd.
    Inventors: Yui-Shin Fran, Ching-Feng Lin, Chi-Hao Chiu, Chun-Chia Huang, Wen-Yen Huang
  • Publication number: 20120099247
    Abstract: A solid electrolytic capacitor with a protective structure, which includes stacked capacitor elements electrically connected to the positive and negative terminal. A packaging material such as synthetic resin is used to encapsulate the capacitor elements, the positive terminal, and the negative terminal. Before packaging, a protective layer is formed by a colloid material, which covers the main body of the capacitor that includes the capacitor elements, the positive terminal, and the negative terminal. The protective layer provides a better seal and relieves the external pressure exerting on the capacitor during the packaging process. The protection prevents structural damage to the capacitor's main body while reducing the risk of short-circuits and excessive current leakage.
    Type: Application
    Filed: October 20, 2010
    Publication date: April 26, 2012
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: CHING-FENG LIN, CHI-HAO CHIU, WEN-YEN HUANG, CHUN-CHIA HUANG
  • Patent number: 8164883
    Abstract: A stacked solid electrolytic capacitor and a method for manufacturing the same are disclosed. The stacked solid electrolytic capacitor includes two capacitor sets, a positive electrode conducting device, a negative electrode conducting device, and a package unit. Each capacitor set includes at least one capacitor unit. The front side of the positive electrode portion of the capacitor set extends to form a positive electrode pin. The positive electrode conducting device has at least one first positive electrode conducting lead frame and at least one second positive electrode conducting lead frame. The first positive electrode conducting lead frame is electrically connected with the second positive electrode conducting lead frame. The negative electrode conducting device has at least one negative electrode conducting lead frame, and is electrically connected with the negative electrode of the two capacitor sets by using metal conductive material.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: April 24, 2012
    Assignee: Apaq Technology Co., Ltd.
    Inventors: Chi-Hao Chiu, Ching-Feng Lin, Chun-Chia Huang, Chien-Ting Liu
  • Publication number: 20120092810
    Abstract: An insulating encapsulation structure is applied to a chip type solid electrolytic capacitor that includes an aluminum metallic body having an aluminum core layer. An upper oxide film and a lower oxide film respectively having fine holes on their surfaces are respectively formed on the top and the bottom of the aluminum core layer. On side surfaces of the metallic body is a plurality of cut burrs. The upper oxide film and the lower oxide film of the metallic body are respectively separated by a separating layer to form an anode and a cathode. The insulating encapsulation structure includes an insulating cover layer enclosing an outer surface of the metallic body to cover the cut burrs. Thereby, the required chemical conversion process is reduced along with current leakage, the overall manufacturing cost is lowered, and the mechanical strength for the edge of the metallic body is reinforced.
    Type: Application
    Filed: October 19, 2010
    Publication date: April 19, 2012
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: CHI-HAO CHIU, MING-TSUNG CHEN, CHIAO-YINMS YANG
  • Publication number: 20110216475
    Abstract: A stacked solid-state electrolytic capacitor with multi-directional product lead frame structure includes a plurality of capacitor units, a substrate unit and a package unit. The capacitor units are stacked onto each other. Each capacitor unit has a positive electrode and a negative electrode, the positive electrode of each capacitor unit has a positive pin extended outwards, the positive pins are electrically stacked onto each other, and the negative electrodes are electrically stacked onto each other. The substrate unit has at least one positive guiding substrate electrically connected to the positive pins of the capacitor units and a plurality of negative guiding substrates electrically connected to the negative electrodes of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit in order to expose an end of the at least one positive guiding substrate and an end of each negative guiding substrate.
    Type: Application
    Filed: July 9, 2010
    Publication date: September 8, 2011
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: Chi-Hao Chiu, Yui-Shin Fran, Ching-Feng Lin, Chun-Chia Huang, Chun-Hung Lin, Wen-Yen Huang
  • Publication number: 20110007451
    Abstract: A stacked solid electrolytic capacitor with positive multi-pin structure includes a plurality of capacitor units, a substrate unit and a package unit. The positive electrode of each capacitor unit has a positive pin extended outwards therefrom. The positive pins are divided into a plurality of positive pin units that are separated from each other and electrically stacked onto each other. The negative electrode of each capacitor unit has a negative pin extended outwards therefrom. The negative pins are divided into a plurality of negative pin units. The negative pin units are separated from each other and the negative pins of each negative pin unit are electrically stacked onto each other. The substrate unit has a positive guiding substrate electrically connected to the positive pins and a negative guiding substrate electrically connected to the negative pins. The package unit covers the capacitor units and one part of the substrate unit.
    Type: Application
    Filed: November 30, 2009
    Publication date: January 13, 2011
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: Yui-Shin Fran, Ching-Feng Lin, Chi-Hao Chiu, Chun-Chia Huang, Wen-Yen Huang
  • Publication number: 20110007452
    Abstract: A lamellar stacked solid electrolytic capacitor includes a plurality of capacitor units, a substrate unit and a package unit. Each capacitor unit is composed of a negative foil, an isolation paper with conductive polymer substance, a positive foil, an isolation paper with conductive polymer substance and a negative foil that are stacked onto each other in sequence, the positive foils of the capacitor units are electrically connected to each other, the negative foils of the capacitor units are electrically connected to each other, and the positive foils and the negative foils are insulated from each other. The substrate unit has a positive guiding substrate electrically connected to the positive foils of the capacitor units and a negative guiding substrate electrically connected to the negative foils of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit.
    Type: Application
    Filed: February 26, 2010
    Publication date: January 13, 2011
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: Ching-Feng Lin, Yui-Hsin Fran, Chi-Hao Chiu, Ming-Tsung Chen, Cheng-Wei Lai, Chun-Chia Huang
  • Publication number: 20100271747
    Abstract: A capacitor that has the features of heat dissipation and energy conservation comprises a capacitor core, an aluminum shell surrounding the capacitor core, the aluminum shell is covered with rubber that completely covers the top of the capacitor core, then with the use of an extruding machine, the upper orifice of the aluminum shell is extruded and sealed up around the rubber completely; the outer surface of the aluminum is formed with an aluminum oxidized insulating layer after the aluminum shell is processed through an aluminum metal surface transformation treatment, since the aluminum shell is not covered with plastic film (or sleeve), heat dissipation is enhanced; in addition, since plastic film or sleeve is not used, no pollution is occurred, and hence more friendly to the environment; furthermore, since heat generation is low, energy is conserved.
    Type: Application
    Filed: November 5, 2009
    Publication date: October 28, 2010
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: Ching Feng Lin, Ming Tsung Chen