Patents Assigned to Apaq Technology Co., Ltd.
  • Patent number: 9123468
    Abstract: The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: September 1, 2015
    Assignee: APAQ TECHNOLOGY CO., LTD.
    Inventors: Ching-Feng Lin, Ming-Tsung Chen, Shu-Yu Lin
  • Patent number: 9105398
    Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a plurality of stacked-type capacitors stacked on top of one another and electrically connected with each other, and each stacked-type capacitor has a positive portion and a negative portion. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion electrically connected to the positive portion and enclosed by the package body and a first lateral exposed portion connected to the first embedded portion. The second conductive terminal has a second lateral exposed portion, a second front exposed portion, a second rear exposed portion, and a second embedded portion electrically connected to the negative portion and enclosed by the package body.
    Type: Grant
    Filed: January 7, 2015
    Date of Patent: August 11, 2015
    Assignee: APAQ TECHNOLOGY CO., LTD.
    Inventors: Chi-Hao Chiu, Kun-Huang Chang
  • Publication number: 20150194262
    Abstract: A solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes at least one first conductive terminal and at least one second conductive terminal. The first conductive terminal includes a first core layer and a first enclosing layer. The first core layer has a first top exposed surface exposed from the first enclosing layer, and the first top exposed surface has a first top covering area covered by the package body. The second conductive terminal includes a second core layer and a second enclosing layer. The second core layer has a second top exposed surface exposed from the second enclosing layer, and the second top exposed surface has a second top covering area covered by the package body.
    Type: Application
    Filed: January 7, 2014
    Publication date: July 9, 2015
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: CHI-HAO CHIU, MING-TSUNG CHEN, KUN-HUANG CHANG
  • Publication number: 20140307365
    Abstract: A solid electrolytic capacitor package structure for decreasing equivalent series resistance (ESR), includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal having a through hole, and the stacked-type capacitors are electrically connected between the first and the second conductive terminals. The bottommost first stacked-type capacitor is positioned on the top surface of the second conductive terminal through conductive paste that has a first conductive portion disposed between the bottommost first stacked-type capacitors and the top surface of the second conductive terminal and a second conductive portion filling in the through groove to connect with the first conductive portion.
    Type: Application
    Filed: April 11, 2013
    Publication date: October 16, 2014
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: CHI-HAO CHIU, CHING-FENG LIN, KUN-HUANG CHANG, CHUN-CHIA HUANG
  • Publication number: 20140262459
    Abstract: A winding-type solid electrolytic capacitor package structure includes a substrate body, a winding capacitor, a package body and an electrode unit. The winding capacitor has a winding body, a positive conductive lead pin having a positive end surface, and a negative conductive lead pin having a negative end surface. The package body is disposed on the substrate body to enclose the winding body, and the package body has a first lateral surface substantially flushed with the positive end surface and a second lateral surface substantially flushed with the negative end surface. The electrode unit includes a positive electrode structure for covering the first lateral surface and electrically contacting the positive end surface and a negative electrode structure for covering the second lateral surface and electrically contacting the negative end surface.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: MING-TSUNG CHEN, CHING-FENG LIN
  • Publication number: 20140268503
    Abstract: A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: MING-TSUNG CHEN, CHING-FENG LIN
  • Publication number: 20140259580
    Abstract: The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: CHING-FENG LIN, MING-TSUNG CHEN, SHU-YU LIN
  • Publication number: 20140268500
    Abstract: A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface. The conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to the negative conductive lead pin. The positive conductive terminal has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body. The negative conductive terminal has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body. The first and the second exposed portions are extended along the outer surface of the package body.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: MING-TSUNG CHEN, CHING-FENG LIN
  • Publication number: 20140218842
    Abstract: The instant disclosure relates to a manufacturing method of capacitor cathode foil structure, comprising the following steps. The first step is providing a base foil, subsequently inserting the foil into a reactor. The next step is executing a heating process for heat the base foil to a temperature region of 400° C. to 1000° C. The next step is directing a carbon containing precursor gas into the reactor. The last step is executing a cooling process for cooling the base foil to a temperature below 100° C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement.
    Type: Application
    Filed: October 9, 2013
    Publication date: August 7, 2014
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: CHING-FENG LIN, MING-TSUNG CHEN, YI-YING WANG
  • Patent number: 8787002
    Abstract: A winding-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a winding-type capacitor having a first conductive pin and a second conductive pin. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first conductive pin and a second conductive terminal electrically connected to the second conductive pin. The first conductive terminal has a first embedded portion contacting the first conductive pin and enclosed by the package body and a first exposed portion connected to the first embedded portion and exposed from the package body. The second conductive terminal has a second embedded portion contacting the second conductive pin and enclosed by the package body and a second exposed portion connected to the second embedded portion and exposed from the package body.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: July 22, 2014
    Assignee: Apaq Technology Co., Ltd.
    Inventors: Ching-Feng Lin, Chi-Hao Chiu, Kun-Huang Chang
  • Patent number: 8755171
    Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of capacitors stacked on top of one another. The package unit includes a package body enclosing the capacitors. The package body has a top surface defining a package length, a package width and an effective package, and the package width is substantially between 85% and 95% of the package length. The conductive unit includes a first conductive terminal electrically connected to the positive portion of the capacitor and a second conductive terminal electrically connected to the negative portion of the capacitor. One part of the first conductive terminal and one part of the second conductive terminal are enclosed by the package body, and another part of the first conductive terminal and another part of the second conductive terminal are exposed from the package body.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: June 17, 2014
    Assignee: Apaq Technology Co., Ltd.
    Inventors: Ching-Feng Lin, Chi-Hao Chiu, Kun-Huang Chang
  • Publication number: 20140078647
    Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a plurality of stacked-type capacitors stacked on top of one another and electrically connected with each other, and each stacked-type capacitor has a positive portion and a negative portion. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion electrically connected to the positive portion and enclosed by the package body and a first lateral exposed portion connected to the first embedded portion. The second conductive terminal has a second lateral exposed portion, a second front exposed portion, a second rear exposed portion, and a second embedded portion electrically connected to the negative portion and enclosed by the package body.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: Chi-Hao CHIU, Kun-Huang CHANG, Chun-Hung LIN
  • Publication number: 20140071590
    Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of capacitors stacked on top of one another. The package unit includes a package body enclosing the capacitors. The package body has a top surface defining a package length, a package width and an effective package, and the package width is substantially between 85% and 95% of the package length. The conductive unit includes a first conductive terminal electrically connected to the positive portion of the capacitor and a second conductive terminal electrically connected to the negative portion of the capacitor. One part of the first conductive terminal and one part of the second conductive terminal are enclosed by the package body, and another part of the first conductive terminal and another part of the second conductive terminal are exposed from the package body.
    Type: Application
    Filed: September 13, 2012
    Publication date: March 13, 2014
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: Ching-Feng LIN, Chi-Hao CHIU, Kun-Huang CHANG
  • Publication number: 20140071589
    Abstract: A winding-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a winding-type capacitor having a first conductive pin and a second conductive pin. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first conductive pin and a second conductive terminal electrically connected to the second conductive pin. The first conductive terminal has a first embedded portion contacting the first conductive pin and enclosed by the package body and a first exposed portion connected to the first embedded portion and exposed from the package body. The second conductive terminal has a second embedded portion contacting the second conductive pin and enclosed by the package body and a second exposed portion connected to the second embedded portion and exposed from the package body.
    Type: Application
    Filed: September 12, 2012
    Publication date: March 13, 2014
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: CHING-FENG LIN, CHI-HAO CHIU, KUN-HUANG CHANG
  • Patent number: 8654511
    Abstract: A capacitance unit includes an anode portion, an insulating portion, a cathode portion and a colloid portion. The front end of the anode portion extends to from an anode terminal. The insulating portion surrounds the anode portion and covers a first partial surface of the anode portion. The cathode portion is disposed next to the insulating portion, and the cathode portion covers a second partial surface of the anode portion. The colloid portion is disposed next to the insulating portion, and the colloid portion surrounds the cathode portion and covers a partial surface of the cathode portion.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: February 18, 2014
    Assignee: Apaq Technology Co., Ltd.
    Inventors: Chi-Hao Chiu, Ching-Feng Lin, Kun-Huang Chang
  • Publication number: 20130258555
    Abstract: The present invention relates to a capacitor unit, which includes an anode portion, a cathode portion, and an insulating portion. The insulating portion is provided for in a form of a headband to partially cover the surface of the anode portion to divide the anode and the cathode portions. The cathode portion partially covers the anode portion and is located behind the insulating portion. The cathode portion has at least one conductive layer which is made of a conductive polymer having copper, copper alloy, or a mixture thereof.
    Type: Application
    Filed: April 2, 2012
    Publication date: October 3, 2013
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: CHI-HAO CHIU, CHING-FENG LIN, KUN-HUANG CHANG, CHIEN-WEI LIN
  • Patent number: 8518127
    Abstract: A manufacturing method of solid capacitors includes the following steps. First step is forming a plurality of separated adhesive layer on an insulating substrate. Next step is disposing valve-metal wires on the adhesive layers. Next step is forming a conductive layer on the adhesive layer and the valve-metal wires. Next step is forming a dielectric structure on the exposed surface of the valve-metal wires and the conductive layer. Next step is forming a hydrophobic layer and a conductive unit. Next step is separating the formed structures as individual capacitors. Next step is packaging the formed structures and forming terminals connected to the formed structures.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: August 27, 2013
    Assignees: INPAQ Technology Co., Ltd., APAQ Technology Co., Ltd.
    Inventors: Wei-Chih Lee, Ming-Tsung Chen
  • Patent number: 8422200
    Abstract: A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: April 16, 2013
    Assignees: Inpaq Technology Co., Ltd., Apaq Technology Co., Ltd.
    Inventors: Wei-Chih Lee, Ming-Tsung Chen
  • Patent number: 8390991
    Abstract: A stacked solid state solid electrolytic capacitor includes a plurality of capacitor units, a substrate unit and a package unit. The substrate unit includes a positive guiding substrate and a negative guiding substrate. The positive guiding substrate has a positive exposed end integrally extended therefrom along a first predetermined direction. The negative guiding substrate has a first negative exposed end integrally extended therefrom along a second predetermined direction, a second negative exposed end integrally extended therefrom along a third predetermined direction, and a third negative exposed end integrally extended therefrom along a fourth predetermined direction. The first, the second, the third and the fourth predetermined directions are different. The capacitor units are stacked on top of one another and disposed on the negative guiding substrate. The package unit encloses the capacitor units, one part of the positive and one part of the negative guiding substrate.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: March 5, 2013
    Assignee: Apaq Technology Co., Ltd.
    Inventors: Chi-Hao Chiu, Yui-Shin Fran, Ching-Feng Lin, Chun-Chia Huang, Chun-Hung Lin, Wen-Yen Huang
  • Patent number: 8373972
    Abstract: A solid electrolytic capacitor with a protective structure, which includes stacked capacitor elements electrically connected to the positive and negative terminal. A packaging material such as synthetic resin is used to encapsulate the capacitor elements, the positive terminal, and the negative terminal. Before packaging, a protective layer is formed by a colloid material, which covers the main body of the capacitor that includes the capacitor elements, the positive terminal, and the negative terminal. The protective layer provides a better seal and relieves the external pressure exerting on the capacitor during the packaging process. The protection prevents structural damage to the capacitor's main body while reducing the risk of short-circuits and excessive current leakage.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: February 12, 2013
    Assignee: Apaq Technology Co., Ltd.
    Inventors: Ching-Feng Lin, Chi-Hao Chiu, Wen-Yen Huang, Chun-Chia Huang