Abstract: In accordance with some embodiments, a method is performed at an electronic device with a display device and one or more input devices. The method includes displaying, via the display device, a user interface that includes a new-password field. The method includes detecting, via the one or more input devices, a user input that corresponds to selection of the new-password field. In response to detecting the user input that corresponds to selection of the new-password field, the method includes displaying, on the display device, a representation of a new automatically-generated password in the new-password field and displaying, on the display device, an affordance to accept the new automatically-generated password and an affordance to decline to use the new automatically-generated password.

Abstract: Magnetic connector systems including a plug connector and a connector receptacle. In one example, the plug connector can include a magnetic target around a signal pin, where the signal pin is insulated from a plug enclosure by an insulating housing. The connector receptacle can include a magnet that is attracted to the magnetic target. The connector receptacle can contact the plug enclosure using one or more conductive springs. The one or more springs can deflect during an insertion of the plug enclosure. In another example, this deflection can act to expel moisture from the connector receptacle through drip holes in an enclosure for the connector receptacle.

Abstract: In an embodiment, a system includes a plurality of functional circuits, a power supply circuit, and a power management circuit. The power supply circuit may generate a shared power signal coupled to each of the functional circuits, and to generate a plurality of adjustable power signals. One adjustable power signal may be coupled to a particular functional circuit of the functional circuits. The power management circuit may a request to the power supply circuit to change a voltage level of the one particular adjustable power signal from a first voltage to a second voltage. The particular functional circuit may couple a respective power node for a sub-circuit of the particular functional circuit to either of the shared power signal or the particular adjustable power signal. The particular functional circuit may also be configured to maintain an operational voltage level on the power node.

Abstract: One or more cross-wafer capacitors are formed in an electronic component, circuit, or device that includes stacked wafers. One example of such a device is a stacked image sensor. The image sensor can include two or more wafers, with two wafers that are bonded to each other each including a conductive segment adjacent to, proximate, or abutting a bonding surface of the respective wafer. The conductive segments are positioned relative to each other such that each conductive element forms a plate of a capacitor. A cross-wafer capacitor is formed when the two wafers are attached to each other.

Abstract: An electronic device may be provided with a phased antenna array. The array may convey signals greater than 10 GHz and may be formed on a substrate having transmission line layers and antenna layers. An antenna in the array may have a radiating element that includes first, second, and third overlapping patch elements on the antenna layers. The antenna may be fed using a differential transmission line coupled to a differential feed on the first patch element. The differential transmission line may include first and second signal traces. A first via may couple the first signal trace to the first, second, and third patch elements. A second via may couple the second signal trace to the first, second, and third patch elements. The patch elements may introduce capacitances to the radiating element that help to compensate for inductances associated with the distance between the radiating element and the signal traces.

Abstract: Technology for a Next Generation NodeB (gNB) operable to encode downlink control information (DCI) for transmission to a user equipment (UE) is disclosed. The gNB can identify DCI for transmission from the gNB. The gNB can determine that a size of the DCI exceeds a defined threshold. The gNB can divide the DCI into one or more DCI segments. Each DCI segment can include header information to enable the one or more DCI segments to be assembled at the UE. The gNB can encode the one or more DCI segments of the DCI for transmission from the gNB to the UE.

Abstract: A mobile communication device includes a table component, a table selection component, a control information component, and a communication component. The table component is configured to maintain two or more tables each having entries for a plurality of available modulation schemes. The table selection component is configured to select a selected table from one of the default table and the secondary table based on one or more of RRC layer signaling and MAC layer signaling and further based based on a control information format for control information received from the eNB. The control information component is configured to receive control information indicating a modulation and coding scheme from the selected table, and the communication component is configured to receive and process a communication from the eNB based on the modulation and coding scheme from the selected table.

Abstract: Embodiments of protocol converters (PCs), and related techniques, are disclosed herein. In some embodiments, a PC may include reception logic to receive Extensible Markup Language (XML) data transmitted by an Application Function (AF), conversion logic to convert the XML data into a Diameter Protocol (DP) message, and provision logic to provide the DP message for transmission to a Policy and Charging Rules Function (PCRF). Other embodiments may be disclosed and/or claimed.

Abstract: An electronic device may include touch input components and associated haptic output components. The control circuitry may provide haptic output in response to touch input on the touch input components and may send wireless signals to the external electronic device based on the touch input. The haptic output components may provide local and global haptic output. Local haptic output may be used to guide a user to the location of the electronic device or to provide a button click sensation to the user in response to touch input. Global haptic output may be used to notify the user that the electronic device is aligned towards the external electronic device and is ready to receive user input to control or communicate with the external electronic device. Control circuitry may switch a haptic output component into an inactive mode to inform the user that a touch input component is inactive.

Abstract: Embodiments relate to a neural processor circuit that includes a kernel access circuit and multiple neural engine circuits. The kernel access circuit reads compressed kernel data from memory external to the neural processor circuit. Each neural engine circuit receives compressed kernel data from the kernel access circuit. Each neural engine circuit includes a kernel extract circuit and a kernel multiply-add (MAD) circuit. The kernel extract circuit extracts uncompressed kernel data from the compressed kernel data. The kernel MAD circuit receives the uncompressed kernel data from the kernel extract circuit and performs neural network operations on a portion of input data using the uncompressed kernel data.

Abstract: Touch sensitive mechanical keyboards and methods of configuring the depressibility of one or more keys of a keyboard are provided. A touch sensitive mechanical keyboard can accept touch events performed on the surface of the keys. Additionally, the keyboard can accept key depressions as textual input. The keyboard can be placed in a gesture operation mode, which can lock the keys to prevent a user from inadvertently depressing a key while attempting to perform a touch event on the surface of the keys. The keyboard can also be placed in a key press mode, which can allow depression of the keys by a user.

Abstract: In one embodiment, an integrated circuit may be designed using a library of clocked circuits that have programmable clock delays that may be inserted on the clock input to the clocked circuits. During the design process, timing paths which are challenging due to significant variations across operating states, process corners, and/or temperature may be met by using the clocked circuits with programmable delays and inserting a delay control circuit that programs the delays based on the current operating state, process corner used to manufacture the integrated circuit, and/or temperature. That is, different delays may be selected by the delay control circuit depending on inputs that identify the operating state, the process corner, and/or the temperature. Because the clock delay is intentionally skewed, the timing of the path may be different at different operating states, temperatures, or process corners and thus may meet timing by changing the clock skew during operation.