Abstract: A system for inspecting and reviewing a sample, the system may include a chamber that is arranged to receive the sample and to maintain vacuum within the chamber during at least a scan period; an inspection unit; a review unit; and a mechanical stage for moving the sample, according to a scan pattern and during the scan period, in relation to the inspection unit and the review unit while a spatial relationship between the inspection unit and the review unit remains unchanged; wherein the inspection unit is arranged to detect, during the scan period, multiple suspected defects of the sample; and wherein the review unit is arranged to (a) receive, during the scan period, information about the multiple suspected defects; and (b) locate, during the scan period and in response to the information about the multiple suspected defects, at least one actual defect.

Abstract: A charged particle beam apparatus includes a charged particle source configured to generate charged particles, an electrode configured to accelerate the charged particles to form a charged particle beam, a bender unit configured to adjust a path of the charged particle beam, and an objective lens configured to focus the charged particle beam onto a spot on a sample. The charged particle beam passes through a bore of the objective lens as the charged particle beam propagates from the charged particle source to the sample. The apparatus also includes a light source configured to generate a light beam, and a mirror disposed within the bender unit and arranged to direct the light beam to the spot on the sample.

Abstract: A method, computerized system and computer program product for examining an object using a processor operatively connected to a memory, the method comprising: accommodating in the memory data indicative of a plurality of alignment targets, each alignment target associated with a target location on an object; accommodating in the memory a plurality of locations to be captured; and selecting by the processor an alignment target subset of the plurality of alignment targets, such that each of the plurality of locations is associated with and is within a determined distance from a single alignment target from the alignment target subset, the distance determined in accordance with a provided field of view, and wherein the alignment target subset comprises fewer targets than locations to be reviewed, the alignment target being usable for aligning the object relative to an examination tool for capturing the locations associated with the single alignment target.

Abstract: A system and a method for evaluating a lithography mask, the system may include: (a) electron optics for directing primary electrons towards a pellicle that is positioned between the electron optics and the lithography mask; wherein the primary electrons exhibit an energy level that allows the primary electrons to pass through the pellicle and to impinge on the lithographic mask; (b) at least one detector for detecting detected emitted electrons and for generating detection signals; wherein detected emitted electrons are generated as a result of an impingement of the primary electrons on the lithographic mask; and (c) a processor for processing the detection signals to provide information about the lithography mask.

Abstract: A method and a system for imaging an object, the system may include electron optics that may be configured to scan a first area of the object with at least one electron beam; wherein the electron optics may include a first electrode; and light optics that may be configured to illuminate at least one target of (a) the first electrode and (b) the object, thereby causing an emission of electrons between the first electrode and the object.

Abstract: There are provided system and method of performing metrology operations related to a specimen.

Abstract: A method of operating a charged particle beam system, the method comprises extracting a particle beam from a source; performing a first accelerating of the particles of the beam; forming a plurality of particle beamlets from the beam after the performing of the first accelerating; performing a second accelerating of the particles of the beamlets; performing a first decelerating of the particles of the beamlets after the performing of the second accelerating; deflecting the beamlets in a direction oriented transverse to a direction of propagation of the particles of the beamlets after the performing of the first decelerating; performing a second decelerating of the particles of the beamlets after the deflecting of the beamlets; and allowing the particles of the beamlets to be incident on an object surface after the performing of the second decelerating.

Abstract: Inspection apparatus includes an imaging module, which is configured to capture images of defects at different, respective locations on a sample. A processor is coupled to process the images so as to automatically assign respective classifications to the defects, and to autonomously control the imaging module to continue capturing the images responsively to the assigned classifications.

Abstract: Disclosed herein are a system and method for imaging low electron yield regions with a charged beam imager. In certain embodiments, a system may include a processor, wherein the processor comprise an image waveform finder, a synthetic image generator and an output image generator; wherein the processor is configured to (i) receive or generate multiple images of a region of the object; wherein the region has an electron yield that is below an electron yield threshold; (ii) process the multiple images to generate multiple synthetic images, and (iii) generate an output image of the region in response to the multiple synthetic images.

Abstract: A computer program product, a computerized method for configuring an inspection system and an inspection system. The inspection system may include an image acquisition module that comprises illumination optics and collection optics, a controller; and a processor. The image acquisition module may be arranged to acquire a group of first images of an object segment. Different first images of the group of first images are acquired while the inspection system is configured with different polarization configurations that belong to a first group of polarization configurations.

Abstract: A method for evaluating a specimen includes positioning a detector in an inserted position in which a first distance between a tip of the detector and a plane extending along a surface of the specimen is less than a distance between the plane and a tip of charged particle beam optics. While maintaining the detector at the inserted position, the surface of the specimen is scanned by a primary beam that exits from the tip of the charged particle beam optics. The detector detects x-ray photons and/or charged particles emitted or reflected from the specimen as a result of scanning the specimen with the primary beam. After completion of the scanning, the detector is positioned at a retracted position in which a second distance between the tip of the detector and the plane exceeds a distance between the tip of the charged particle beam optics and the plane.

Abstract: A system that may include a chamber, a motorized system, a chuck, a controller, multiple temperature sensors and a cooling module; wherein the chuck is configured to support an object that is positioned within the chamber; wherein the motorized system is configured to move the chuck in relation to the chamber; wherein the multiple temperature sensors are configured to sense multiple temperatures of at least one point within the chamber; wherein the cooling module is configured to cool a unit of the motorized system; and wherein the controller is configured to control the cooling module in response to the multiple temperatures.

Abstract: A method for scanning an object, the method may include moving an object by a first mechanical stage that follows a first scan pattern; introducing multiple movements, by a second mechanical stage, between the object and the first mechanical stage while the first mechanical stage follows the first scan pattern; and obtaining, by optics, images of multiple suspected defects while the first mechanical stage follows the first scan pattern; wherein a weight of the first mechanical stage exceeds a weight of the second mechanical stage.

Abstract: A charged particle beam specimen inspection system is described. The system includes an emitter for emitting at least one charged particle beam, a specimen support table configured for supporting the specimen, an objective lens for focusing the at least one charged particle beam, a charge control electrode provided between the objective lens and the specimen support table, wherein the charge control electrode has at least one aperture opening for the at least one charged particle beam, and a flood gun configured to emit further charged particles for charging of the specimen, wherein the charge control electrode has a flood gun aperture opening.

Abstract: According to an embodiment of the invention, there is provided a system, comprising: a first chamber; a second chamber; a chuck; a movement system; wherein the first chamber comprises: a first element that has a first surface; a first chamber housing that comprises a second surface; wherein the first surface and the second surface come into proximity with each other at a first interface; a supporting element for supporting the chuck when the chuck is positioned within the first chamber; and a first dynamic seal formed at the first interface and is arranged to seal the first chamber from the movement system; wherein the second chamber comprises: a second chamber housing; a movement system that is arranged to introduce movement between (a) the first chamber housing and (b) the first element and the chuck; and a movement control element for mechanically coupling the first element to the movement system.

Abstract: An inspection system that may include an illumination module that may be configured to scan a sample during multiple scan iterations; wherein during each scan iteration the illumination module scans each beam of a plurality of spaced apart beams along a scan line; a mechanical stage that may be configured to move the sample during the multiple scan iterations; a detection module; and a processor; wherein when the inspection system operates in an interlaced mode, the mechanical stage may be configured to move at a first speed thereby preventing a substantial overlap between scan lines obtained during the multiple scan iterations; wherein when the inspection system operates in a non-interlaced mode: the mechanical stage may be configured to move at a second speed that differs from the first speed thereby introducing an overlap between scan lines of different beams that may be obtained during different scan iterations; the detection module may be configured to generate detection signals in response to a detectio

Abstract: A system for design based inspection of a lithographic mask of a first layer of an article, the system may include a decision module and a memory module; wherein the memory module is configured to store (a) first layer information about an outcome of an illumination of the lithographic mask during a lithographic process, (b) design information related to an irrelevant area to be removed from the first layer of the article after a manufacturing of the first layer of the article; and wherein the decision module is configured to process the first layer information to detect lithographic mask defects and to reduce a significance of a lithographic mask defect that is positioned within the irrelevant area.

Abstract: A method and a system for moving a substrate, the system includes a chamber, a chuck, a movement system that is positioned outside the chamber, a controller, an intermediate element, at least one sealing element that is configured to form a dynamic seal between the intermediate element and the chamber housing. The movement system is configured to repeat, for each region of the substrate out of a plurality of regions of the substrate, the steps of: rotating the chuck to position a given portion of the region of the substrate within a field of view that is related to an opening of the chamber housing; and moving the chuck relation to the opening to position additional portions of the region of the substrate within the field of view that is related to the opening.

Abstract: A method for classifying defects of a wafer, the method is executed by a computerized system, the method may include obtaining defect candidate information about a group of defect candidates, wherein the defect candidate information comprises values of attributes per each defect candidate of the group; selecting, by a processor of the computerized system, a selected sub-group of defect candidates in response to values of attributes of defect candidates that belong to at least the selected sub-group; classifying defect candidates of the selected sub-group to provide selected sub-group classification results; repeating, until fulfilling a stop condition: selecting an additional selected sub-group of defect candidates in response to (a) values of attributes of defect candidates that belong to at least the additional selected sub-group; and (b) classification results obtained from classifying at least one other selected sub-group; and classifying defect candidates of the additional selected sub-group to provide a

Abstract: A method for defect classification includes storing definitions of defect classes in terms of a classification rules in a multi-dimensional feature space. Inspection data associated with defects detected in one or more samples under inspection is received. A plurality of first classification results is generated by applying an automatic classifier to the inspection data based on the definitions, the plurality of first classification results comprising a class label and a corresponding confidence level for a defect. Upon determining that a confidence level for a defect is below a predetermined confidence threshold, a plurality of second classification results are generated by applying at least one inspection modality to the defect. A report is generated comprising a distribution of the defects among the defect classes by combining the plurality of first classification results and the plurality of second classification results.