Patents Assigned to Applied Materials
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Patent number: 11638374Abstract: Apparatuses and methods to provide a patterned substrate are described. A plurality of patterned and spaced first lines and carbon material lines and formed on the substrate surface by selectively depositing and etching films extending in a first direction and films extending in a second direction that crosses the first direction to pattern the underlying structures.Type: GrantFiled: April 14, 2022Date of Patent: April 25, 2023Assignee: Applied Materials, Inc.Inventors: Tejinder Singh, Takehito Koshizawa, Abhijit Basu Mallick, Pramit Manna, Nancy Fung, Eswaranand Venkatasubramanian, Ho-yung David Hwang, Samuel E. Gottheim
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Patent number: 11633833Abstract: A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.Type: GrantFiled: May 28, 2020Date of Patent: April 25, 2023Assignee: Applied Materials, Inc.Inventors: Haosheng Wu, Jianshe Tang, Hari Soundararajan, Shou-Sung Chang, Paul D. Butterfield, Hui Chen, Chih Chung Chou, Alexander John Fisher
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Patent number: 11637043Abstract: Methods, systems, and non-transitory computer readable medium are described for generating assessment maps for corrective action. A method includes receiving a first vector map including a first set of vectors each indicating a distortion of a particular location of a plurality of locations on a substrate. The method further includes generating a second vector map including a second set of vectors by rotating a position of each vector in the first set of vectors. The method further includes generating a third vector map including a third set of vectors based on vectors in the second set of vectors and corresponding vectors in the first set of vectors. The method further includes generating a fourth vector map by subtracting each vector of the third set of vectors from a corresponding vector in the first set of vectors. The fourth vector map indicates a planar component of the first vector map.Type: GrantFiled: November 3, 2020Date of Patent: April 25, 2023Assignee: Applied Materials, Inc.Inventors: Wenjiao Wang, Joshua Maher, Xinhai Han, Deenesh Padhi, Tza-Jing Gung
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Patent number: 11638376Abstract: Electronic devices and methods of forming electronic devices using a reduced number of hardmask materials and reusing lithography reticles are described. Patterned substrates are formed using a combination of etch selective hardmask materials and reusing reticles to provide a pattern of repeating trapezoidal and rhomboidal openings.Type: GrantFiled: March 4, 2022Date of Patent: April 25, 2023Assignee: Applied Materials, Inc.Inventor: Russell Chin Yee Teo
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Patent number: 11634830Abstract: Exemplary methods of electroplating include contacting a patterned substrate with a plating bath in an electroplating chamber, where the pattern substrate includes at least one opening having a bottom surface and one or more sidewall surfaces. The methods may further include forming a nanotwin-containing metal material in the at least one opening. The metal material may be formed by two or more cycles that include delivering a forward current from a power supply through the plating bath of the electroplating chamber for a first period of time, plating a first amount of the metal on the bottom surface of the opening on the patterned substrate and a second amount of the metal on the sidewall surfaces of the opening, and delivering a reverse current from the power supply through the plating bath of the electroplating chamber to remove some of the metal plated in the opening on the patterned substrate.Type: GrantFiled: August 25, 2021Date of Patent: April 25, 2023Assignee: Applied Materials, Inc.Inventors: Jing Xu, John L. Klocke, Marvin L. Bernt, Eric J. Bergman, Kwan Wook Roh
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Publication number: 20230122902Abstract: Exemplary reflective display components are described. These reflective display components may include a microwell layer having a first and a second quantum dot well that each include a plurality of nanoparticles configured to emit a color of light. The microwell layer further has a third well. The reflective display components further include an electrowetting layer positioned above the microwell layer, where the electrowetting layer is operable to independently adjust an intensity of light emitted from the first and second quantum dot wells and the third well in the microwell layer.Type: ApplicationFiled: May 23, 2022Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: Robert Anthony Nordsell, Arvinder M. Chadha
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Publication number: 20230124414Abstract: Exemplary semiconductor structures may include a silicon-containing substrate. The structures may include a layer of a metal nitride overlying the silicon-containing substrate. The layer of the metal nitride may include a plurality of features. The structures may include a gallium nitride structure overlying the layer of the metal nitride.Type: ApplicationFiled: March 16, 2022Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: Michel Khoury, Ria Someshwar
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Publication number: 20230119010Abstract: Embodiments herein are directed to a linear accelerator assembly for an ion implanter, wherein the linear accelerator includes a jacketed resonator coil. In some embodiments, a linear accelerator assembly may include a first fluid conduit and a coil resonator coupled to the first fluid conduit, wherein the coil resonator is operable to receive a first fluid via the first fluid conduit, wherein the coil resonator comprises a first coil conduit adjacent a second coil conduit, and wherein a first fluid channel defined by the first coil conduit is operable to receive the first fluid.Type: ApplicationFiled: October 20, 2021Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: Robert B. Vopat, Charles T. Carlson
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Publication number: 20230119618Abstract: A semiconductor manufacturing process and semiconductor device having an airgap to isolate bottom implant portions of a substrate from upper source and drain device structure to reduce bottom current leakage and parasitic capacitance with an improved scalability on n-to-p spacing scaling. The disclosed device can be implanted to fabricate nanosheet FET and other such semiconductor device. The airgap is formed by etching into the substrate, below a trench in a vertical and horizontal direction. The trench is then filled with dielectric and upper device structure formed on either side of the dielectric filler trench.Type: ApplicationFiled: October 15, 2021Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: Armin Saeedi Vahdat, John Hautala, Johannes M. van Meer
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Publication number: 20230124246Abstract: Exemplary substrate processing systems may include a lid plate. The systems may include a gas splitter seated on the lid plate. The gas splitter may include a top surface and side surfaces. The gas splitter may define a first and second gas inlets, with each gas inlet extending through one side surface. The gas splitter may define first and second gas outlets extending through the top surface. The gas splitter may define first and second gas lumens that extend between and fluidly couple each gas inlet with corresponding gas outlets. The gas splitter may define mixing channels that include a mixing outlet extending through a side surface and a mixing inlet extending through the top surface. The systems may include output manifolds seated on the lid plate. The systems may include output weldments that fluidly couple each mixing outlet with a respective one of the output manifolds.Type: ApplicationFiled: October 19, 2021Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: Arun Chakravarthy Chakravarthy, Vinay K. Prabhakar, Dharma Ratnam Srichurnam, Hossein Rezvantalab
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Publication number: 20230120769Abstract: Embodiments herein are directed to a linear accelerator assembly for an ion implanter. In some embodiments, a LINAC may include a coil resonator and a plurality of drift tubes coupled to the coil resonator by a set of flexible leads.Type: ApplicationFiled: October 15, 2021Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: David T. Blahnik, Charles T. Carlson, Robert B. Vopat, Frank Sinclair, Paul J. Murphy, Krag R. Senior
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Publication number: 20230124509Abstract: An extraction assembly may include an extraction plate for placement along a side of a plasma chamber, and having an extraction aperture, elongated along a first direction, and having an aperture height, extending along a second direction, perpendicular to the first direction. The extraction plate defines an inner surface along the extraction aperture, lying in a first plane. A beam blocker is disposed over the extraction aperture, and has an outer surface, disposed in a second plane, different than the first plane. As such, the beam blocker overlaps with the extraction plate along a first edge of the extraction aperture by a first overlap distance, and overlaps with the extraction plate along a second edge of the extraction aperture by a second overlap distance, so as to define a first extraction slit, along the first edge, and a second extraction slit along the second edge.Type: ApplicationFiled: October 17, 2021Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: Costel Biloiu, Jay R. Wallace, Solomon Belangedi Basame, Kevin R. Anglin, Tyler Rockwell
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Publication number: 20230123038Abstract: Embodiments of the disclosure include methods of forming a film comprising conformally depositing a first film on a substrate; treating the first film with a first plasma to form a second film; treating the second film with a second plasma to form a third film; and selectively removing the first film, a portion of the second film, and the third film.Type: ApplicationFiled: October 18, 2021Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventor: Joseph AuBuchon
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Publication number: 20230120710Abstract: Exemplary processing chambers may include a body having sidewalls and a bottom plate. The bottom plate may define an exhaust opening and a gas inlet. The chambers may include a faceplate seated atop the body. The chambers may include a purge ring seated atop the bottom plate. The purge ring may include a ring body having an outer edge and an inner edge defining an open interior. The ring body may have a surface disposed against the bottom plate. The ring body may define an opening aligned with the exhaust opening. The surface may define a fluid port aligned and coupled with the gas inlet. The surface may define arcuate grooves extending into the fluid port. The arcuate grooves may be parallel with the inner and outer edges. The surface may define radial grooves extending from the open interior to an arcuate groove.Type: ApplicationFiled: October 15, 2021Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: Zaoyuan Ge, Yin Xiong, Sungwon Ha, Abdul Aziz Khaja, Amit Bansal, Prasath Poomani, Ajit Laxman Kulkarni, Sarah Michelle Bobek, Badri N. Ramamurthi
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Publication number: 20230117345Abstract: An optical inspection system that may include an illumination optics configured to generate an illumination light beam and to illuminate a sample with the illumination light beam; at least one collection optics configured to collect light from the sample; at least one detector configured to detect at least one detected light beam outputted from the at least one collection optics; multiple polarizers that are configured to (a) set a polarization of the illumination light beam by selectively introducing, under a control of the control unit, at least one illumination optics polarization change, and (b) set a polarization of the at least one detected light beam by selectively introducing, under a control of the control unit, at least one collection optics polarization change. The multiple polarizers may include one or more illumination half-wave plates, one or more quarter-wave plates, and one or more inhomogeneous polarizers.Type: ApplicationFiled: October 20, 2021Publication date: April 20, 2023Applicant: Applied Materials Israel Ltd.Inventors: Elad Eizner, Amir Shoham
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Publication number: 20230117013Abstract: Exemplary semiconductor structures may include a silicon-containing substrate. The structures may include a layer of a metal nitride overlying the silicon-containing substrate. The structures may include a gallium nitride structure overlying the layer of the metal nitride. The structures may include an oxygen-containing layer disposed between the layer of the metal nitride and the gallium nitride structure.Type: ApplicationFiled: October 21, 2021Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: Michel Khoury, Ria Someshwar
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Publication number: 20230124350Abstract: An exciter for a high frequency resonator. The exciter may include an exciter coil inner portion, extending along an exciter axis, an exciter coil loop, disposed at a distal end of the exciter coil inner portion. The exciter may also include a drive mechanism, including at least a rotation component to rotate the exciter coil loop around the exciter axis.Type: ApplicationFiled: October 20, 2021Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: Costel Biloiu, David T. Blahnik, Wai-Ming Tam, Charles T. Carlson, Frank Sinclair
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Publication number: 20230121211Abstract: Embodiments of the present disclosure generally relate to metasurface devices and methods of forming metasurfaces. The metasurface devices include a plurality of device structures. Each of the device structures are formed from multiple layers, at least one of which is an impedance matching layer. The impedance matching layer may be formed as either an inner impedance matching layer between the substrate and the device layer or as a separate outer impedance matching layer on top of the device layer. The refractive indices of the impedance matching layers are chosen to be between the refractive index of the mediums on either side of the impedance matching layer.Type: ApplicationFiled: September 28, 2022Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: Jianji YANG, David SELL, Samarth BHARGAVA, Guannan CHEN
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Patent number: 11628478Abstract: A method of cleaning for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto a component in the polishing system while the component is spaced away from a polishing pad of the polishing system to clean the component, and moving the component into contact with the polishing pad.Type: GrantFiled: May 28, 2020Date of Patent: April 18, 2023Assignee: Applied Materials, Inc.Inventors: Haosheng Wu, Jianshe Tang, Hari Soundararajan, Shou-Sung Chang, Hui Chen, Chih Chung Chou, Alexander John Fisher, Paul D. Butterfield
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Patent number: 11630251Abstract: A method of forming patterned features on a substrate is provided. The method includes positioning a plurality of masks arranged in a mask layout over a substrate. The substrate is positioned in a first plane and the plurality of masks are positioned in a second plane, the plurality of masks in the mask layout have edges that each extend parallel to the first plane and parallel or perpendicular to an alignment feature on the substrate, the substrate includes a plurality of areas configured to be patterned by energy directed through the masks arranged in the mask layout. The method further includes directing energy towards the plurality of areas through the plurality of masks arranged in the mask layout over the substrate to form a plurality of patterned features in each of the plurality of areas.Type: GrantFiled: January 7, 2022Date of Patent: April 18, 2023Assignee: Applied Materials, Inc.Inventors: Yongan Xu, Rutger Meyer Timmerman Thijssen, Jinrui Guo, Ludovic Godet