Patents Assigned to Asia Vital Component Co., Ltd.
  • Heat sink structure
    Patent number: 9851158
    Abstract: A heat sink structure and a manufacturing method thereof. The heat sink includes a main body having multiple main body connection sections and multiple radiating fins each having a connection section. The main body has a first end and a second end. The first and second ends define a longitudinal direction. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the connection sections of the radiating fins placed in the mold are high-speed thrust into the main body connection sections and moved in the longitudinal direction to the second end of the main body to tightly integrally connect with the main body.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: December 26, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Mold for molding a case of a mobile device and molding method for manufacturing a case of a mobile device
    Patent number: 9827607
    Abstract: A mold for molding a case of a mobile device includes a first, second, third, fourth and fifth main body, connection slide blocks, and first and second abutment slide blocks. The connection slide blocks and the second abutment slide blocks are inlaid in first and second slide channels of the first and second main bodies. The first abutment slide blocks are inlaid in channels of the connection slide blocks. The third, fourth and fifth main bodies are horizontally movable relative to the first and second main bodies. The first and second main bodies, the connection slide blocks and the first and second abutment slide blocks together define a male mold section and the third, fourth and fifth main bodies together define a female mold section. A metal thin sheet is placed on the male mold section and pressurized and molded by the female mold section to form the case.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: November 28, 2017
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Kuo-Sheng Lin, Fei-Fei Shi
  • Water cooling device with detachably assembled modularized units
    Patent number: 9823028
    Abstract: A water cooling device with detachably assembled modularized units includes at least one modularized pump unit and at least one modularized heat exchange unit. Different number of the modularized heat exchange unit can be detachably assembled to the modularized pump unit according to the number of heat sources to be cooled.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: November 21, 2017
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Rong-Xian Zhang, Jian-Wu Yin
  • Liquid-cooling device and system thereof
    Patent number: 9807906
    Abstract: A liquid-cooling device and a liquid-cooling system thereof. The liquid-cooling device includes a liquid reservoir case having a heat exchange chamber for a cooling liquid to pass through. An impeller and multiple radiating fins in adaptation to the impeller are disposed in the heat exchange chamber. The impeller serves to drive the cooling liquid to circularly flow through the radiating fins so as to efficiently dissipate heat generated by a heat generation component.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: October 31, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Rong-Xian Zhang, Jian-Wu Yin
  • Thin heat pipe structure and manufacturing method thereof
    Patent number: 9802240
    Abstract: A thin heat pipe structure and a manufacturing method thereof. The thin heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber and a working fluid. At least one first channel and at least one second channel are formed on an inner wall face of the chamber. The first and second channels extend to intersect each other. The mesh body is attached to the inner wall face of the chamber. The thin heat pipe structure is able to transfer heat in both axial direction and radial direction. By means of the manufacturing method, the heat pipe can be slimmed and the ratio of good products can be greatly increased.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: October 31, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Hsiu-Wei Yang
  • Heat sink structure and manufacturing method thereof
    Patent number: 9802280
    Abstract: A heat sink structure and a manufacturing method thereof. The heat sink includes a main body and multiple radiating fins each having a folded root section. The main body has multiple connection channels formed on a circumference of the main body. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the folded root sections of the radiating fins are relatively high-speed thrust into the connection channels of the main body to tightly integrally connect with the main body.
    Type: Grant
    Filed: August 14, 2014
    Date of Patent: October 31, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Centrifugal fan impeller structure
    Patent number: 9777743
    Abstract: A centrifugal fan impeller structure includes a hub and a blade body set. The hub has an extension section. The blade body set has multiple blade bodies. The blade bodies outward extend from the extension section of the hub. Each two adjacent blade bodies define therebetween a flow way, an air outlet and an air inlet. The air outlet and the air inlet are respectively positioned at two ends of the flow way in communication with the flow way. The air outlets are arranged at unequal intervals so as to greatly reduce noise in operation.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: October 3, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chih-Wei Yang, Sheng-Pei Lee
  • Centrifugal fan impeller structure
    Patent number: 9777742
    Abstract: A centrifugal fan impeller structure includes a hub having multiple blades. The blades extend from a circumference of the hub in a direction away from the hub. Each two adjacent blades define therebetween a flow way, an air outlet and an air inlet. The air outlet and the air inlet are respectively positioned at two ends of the flow way in communication with the flow way. The air outlets are arranged at unequal intervals so as to greatly reduce noise in operation.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: October 3, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chih-Wei Yang, Sheng-Pei Lee
  • Water-cooling device with stator and rotor pumping unit
    Patent number: 9772142
    Abstract: A water-cooling device includes a main body having a pump chamber and a heat exchange chamber, which are partitioned from each other by a water room partitioning board. The water room partitioning board has a communication section for communicating the pump chamber with the heat exchange chamber. A pump unit is disposed in the pump chamber. A heat transfer unit is disposed in the heat exchange chamber. A cooling fluid is filled up in the pump chamber and the heat exchange chamber. The water-cooling device has greatly enhanced heat dissipation performance. Moreover, the water-cooling device is free from the problem of overheating of the stator assembly in operation.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: September 26, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Bor-Bin Tsai
  • Thermal module
    Patent number: 9772143
    Abstract: A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: September 26, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Hsiu-Wei Yang
  • Heat pipe structure
    Patent number: 9746249
    Abstract: A heat pipe structure includes a first tubular body and a second tubular body. The first tubular body has a first receiving space. A first working fluid is contained in the first receiving space. The second tubular body is disposed in the first receiving space. The second tubular body has a second receiving space. A second working fluid is contained in the second receiving space. The solidification temperature of the first working fluid is different from the solidification temperature of the second working fluid so that the heat pipe structure can be activated at low temperature to keep operating at normal temperature to enhance the performance. Moreover, the assembly applicability is enhanced to lower the assembling cost.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: August 29, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Sung-Wei Lee
  • Writing device with input unit
    Patent number: 9738114
    Abstract: A writing device with input unit includes a case and an input unit receiving in the case. The input unit includes a flexible main body, a sensing electrode layer and a protection layer. The flexible main body has a first face and a second face. The sensing electrode layer has a first sensing electrode and a second sensing electrode disposed on the second face of the flexible main body. The protection layer is correspondingly disposed on the second face of the flexible main body to cover the sensing electrode layer. The writing device with input unit has small volume and is lightweight so that a user can conveniently carry, store and use the writing device with input unit.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: August 22, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Ching-Hang Shen, Fu-Kuei Chang
  • Fan hub balancing structure
    Patent number: 9739288
    Abstract: A fan hub balancing structure includes a hub main body. The hub main body has a top section, a circumferential section extending from the circumference of the top section and a lip section. The lip section is connected with the lower end of the circumferential section. The lip section has at least one residual weight section on the lip section. After the residual weight section is removed from the lip section, a balancing section is formed on the lip section. The balancing structure is able to provide a balancing effect for the hub main body and facilitate the processing of the hub main body.
    Type: Grant
    Filed: October 9, 2014
    Date of Patent: August 22, 2017
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Chun-Hao Huang, Chun-Liang Ho
  • Centrifugal fan
    Patent number: 9702367
    Abstract: A centrifugal fan includes a fan frame and a fan impeller received in the fan frame. The fan frame has at least one air inlet and at least one air outlet respectively formed on two sides of the fan frame. The fan impeller has a hub, an extension section outward extending from the hub and multiple blades disposed on the extension section. Each blade has a front end and a rear end. The rear ends of the blades are annularly arranged to together define a virtual geometrical configuration. A flow guide space is defined between the virtual geometrical configuration and the hub. A chord length is defined between the front and rear ends of the blade. The flow guide space has a width larger than or equal to the chord length so as to thin the centrifugal fan and enhance the performance thereof.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: July 11, 2017
    Assignee: Asia Vital Components Co., ltd.
    Inventor: Chun-Ming Wu
  • Heat dissipation device and manufacturing method thereof
    Patent number: 9700930
    Abstract: A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a main body and at least one fixing hole. The main body has a first board body and a second board body corresponding to the first board body. The first and second board bodies are mated with each other to define a chamber. A working fluid and multiple support pillars are disposed in the chamber. At least one capillary structure is disposed on a surface of the chamber. The fixing hole is formed on the main body in a position where any support pillar is positioned. The fixing hole passes through the first and second board bodies and the support pillar. According to the above arrangement, the airtightness of the chamber of the main body can be ensured. Also, the heat spreader can be tightly connected with other components.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: July 11, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Hsiu-Wei Yang
  • Latch device for heat dissipation unit
    Patent number: 9699884
    Abstract: A latch device for heat dissipation unit is applied to and mounted on a motherboard in tight contact with at least one heat source. The latch device includes a heat sink, a first elastic abutment member having a first protrusion block and a second elastic abutment member having a second protrusion block. A first latch member and a second latch member are disposed on two opposite sides of the heat sink. The first and second latch members are freely latchable with the corresponding first and second protrusion blocks or unlatchable from the corresponding first and second protrusion blocks. Accordingly, along with the latching or unlatching, the first and second elastic abutment members are elastically deformed into abutment against or out of abutment with the other face of the heat sink. Therefore, the heat sink can be easily and securely fixed on or detached from the motherboard.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: July 4, 2017
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Sheng-Huang Lin
  • Water-cooling device with waterproof stator and rotor pumping unit
    Patent number: 9689627
    Abstract: A water-cooling module includes a main body. The main body has a receiving space and a water room partitioning board. The receiving space is partitioned by the water room partitioning board into a pump chamber and a heat exchange chamber. The pump chamber and the heat exchange chamber communicate with each other through at least one communication section. A pump unit is disposed in the pump chamber. A heat transfer unit is disposed in the heat exchange chamber. A cooling fluid is filled up in the main body to circulate within the pump chamber and the heat exchange chamber. The pump unit is entirely immersed in the cooling fluid so that the operation efficiency of the pump unit is enhanced and the main body is thinned. Moreover, the problem of overheating of the pump unit in operation is solved.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: June 27, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Bor-Bin Tsai
  • Heat insulation structure for hand-held device and hand-held device with same
    Patent number: 9690341
    Abstract: A heat insulation structure for hand-held device includes a holding body disposed in a hand-held device. The holding body has a frame and internally defines a receiving space, in which a holding section is provided. A heat insulation space is formed between the frame and the holding section. The frame and the holding section are connected to each other via at least one connecting member. With the heat insulation space formed between the frame and the holding section, the heat insulation structure for hand-held device provides effective heat dissipation effect to prevent a hand-held device from burning a user's hand due to heat produced by electronic elements in the had-held device.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: June 27, 2017
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Ching-Hang Shen
  • Supporting structure for vapor chamber
    Patent number: 9664458
    Abstract: A supporting structure for vapor chamber includes a first and a second plate member, a supporting member, and a working fluid. The first and the second plate member together define a chamber between them. The supporting member is located in the chamber, and has at least one base portion and a plurality of supporting portions, such that a plurality of passages is formed on the supporting member. The working fluid is filled in the chamber to flow through the passages. With these arrangements, the supporting structure for vapor chamber can overcome the problems of deformation caused by thermal expansion or pressure and uncontrollable bottom flatness as found in the prior art and can be manufactured at reduced labor and time cost while provides upgraded heat transfer efficiency.
    Type: Grant
    Filed: December 25, 2014
    Date of Patent: May 30, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Sheng-Huang Lin
  • Series fan structure with multistage frame body
    Patent number: 9651051
    Abstract: A series fan structure with multistage frame body includes a first main body, a second main body, a first frame and a second frame. The first main body has a first fan frame having a first opening and a second opening. The second main body is correspondingly serially connected to the first main body. The second main body has a second fan frame having a third opening and a fourth opening. The third opening corresponds to the second opening. The first frame is correspondingly serially connected to one side of the first fan frame with the first opening. The first frame and the first fan frame together define a first flow passage. The second frame is correspondingly serially connected to one side of the second fan frame with the fourth opening. The second frame and the second fan frame together define a second flow passage.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: May 16, 2017
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Bor-Haw Chang, Ta-Cheng Lee