Abstract: An integrated heat dissipation device includes at least one first case, a second case and multiple third cases. The first and second cases respectively have a first case chamber and a second case chamber. Each third case has a third case chamber. Each third case is connected to the second case via a first heat pipe. The first case is connected to the corresponding third case via a second heat pipe passing through the second case. Accordingly, the working fluid in the third case chambers can flow through the respectively connected first and second heat pipes to the first and second case chambers to achieve the vapor-liquid circulation effect and dissipate the heat.

Abstract: A heat dissipation component includes: a first main body having a first chamber; a second main body having a second chamber; a third main body having a third chamber; a first tubular body having a first flow way, two ends of the first tubular body being respectively connected with the first and second main bodies; and a second tubular body having a second flow way. The second tubular body is passed through the second main body and the first flow way. Two ends of the second tubular body are respectively connected with the first and third main bodies. A working fluid is filled in the first, second and third chambers.

Abstract: A thermal module includes a housing having multiple independent compartments not in communication with each other. Each compartment communicates with an open end of at least one heat pipe. The open end communicates with a heat pipe chamber in the heat pipe, whereby the independent compartments communicate with the heat pipe chambers.

Abstract: A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are disposed in the receiving space. At least one first protrusion section protrudes from the first radiating fin assembly. A top end of the first protrusion section is formed with a first apex. Two sides of the first apex are formed with a first slope and a second slope. At least one second protrusion section protrudes from the second radiating fin assembly corresponding to the first protrusion section. A top end of the second protrusion section is formed with a second apex. Two sides of the second apex are formed with a third slope and a fourth slope. The second apex abuts against the first apex to define an open space between the first and second radiating fin assemblies.

Abstract: A heat dissipation unit of handheld electronic device is applied to and assembled with a handheld electronic device. The heat dissipation unit includes a main body having a heat absorption section and a heat dissipation section respectively disposed on two sides of the main body. The heat absorption section is made of ceramic material. The heat dissipation section is a heat dissipation conductor. The heat absorption section and the heat dissipation section are respectively correspondingly positioned in the handheld electronic device and outside the handheld electronic device. The heat generated inside the handheld electronic device can be quickly conducted from the ceramic-made heat absorption section to the heat dissipation section and then conducted from the heat dissipation section to outer side of the handheld electronic device. Accordingly, the lifetime of the handheld electronic device is prolonged and the efficiency of the handheld electronic device is enhanced.

Abstract: The present invention relates to a fan wheel structure comprising a cover body connected with a plurality of fan blades, a hub, and a plurality of fan blades. The cover body is disposed on a hub. The hub has a top surface and a receiving space defined on the top surface. Each of the fan blades has a joining end protruding into the receiving space. The cover body has a clamping side combined with the top surface of the hub and a plurality of joining grooves spaced around the cover body and individually combined with the corresponding joining ends of the fan blades to fix the fan blades.

Abstract: A heat pipe structure includes a main body. The main body has a first board body, a second board body, a capillary structure and a working fluid. The first and second board bodies are overlapped and mated with each other to hold the capillary structure. The capillary structure is formed with at least one passage. One of the first and second board bodies is formed with a protrusion section protruding toward the capillary structure. The protrusion section is attached to the capillary structure in adjacency to the passage. Accordingly, the heat pipe structure has an extremely thin thickness.

Abstract: A heat dissipation device includes a first and a second housing, at least one pipe, and a working fluid. The first and the second housing internally respectively defines a first and a second chamber, in which a first and a second wick structure is respectively formed, and has at least one first and second opening communicated with the first and the second chamber respectively. The pipe has a pipe body, and a first and second extended portion, which respectively has a first and a second open end, and a first and a second through opening, and is inserted into and connected to the first and the second chamber via the first and the second opening respectively. The pipe internally defines a pipe chamber, in which a pipe wick structure is formed. The working fluid is provided in the first and the second, and the pipe chamber.

Abstract: A water-cooling radiator unit and a water-cooling module using same are disclosed. The water-cooling radiator unit includes a main body divided into a first section, a second section and a transit zone, which are fluidly communicable with one another. The first section has a first flow passage system and an inlet formed thereon, the second section has a second flow passage system and an outlet formed thereon. The main body is internally filled with a cooling fluid, and the transit zone has a pump mounted therein. The water-cooling radiator unit can be fluidly connected to a water block via two tubes to form a water-cooling module. The pump drives the cooling fluid to circulate in the main body and between the water-cooling radiator unit and the water block, enabling the water-cooling module to provide upgraded heat-dissipation performance while the water block has a reduced volume.

Abstract: A heat dissipation unit is provided and includes a casing and a heat pipe. The casing has a casing chamber which contains therein a working fluid. Casing capillaries are disposed on an inner wall of the casing chamber. The heat pipe has an open end and a closed end. A heat pipe chamber is defined between the open end and the closed end and communicates with the casing chamber through the open end. Heat pipe capillaries are disposed on an inner wall of the heat pipe chamber and are in capillary connection with the casing capillaries through the open end of the heat pipe.

Abstract: A combination structure of heat dissipation module includes a heat dissipation set and at least one heat pipe, which is extended through the heat dissipation set. The heat dissipation set includes a first, a second, and a third portion, which are located respectively corresponding to a heat-dissipation section, a curved section, and a heat-absorption section of the heat pipe. The second and the third portion of the heat dissipation set are respectively provided with a plurality of second and third slots, which are gradually extended according to a length of the curved section and a horizontal length of the heat-absorption section of the heat pipe, and the third portion internally defines a receiving opening communicable with the third slots, so as to effectively remove heat through using the curved section of the heat pipe.

Abstract: A method of manufacturing heat dissipation device includes the steps of providing at least one heat transfer unit; further providing at least one frame for connecting to the at least one heat transfer unit; and spot welding the heat transfer unit to the frame at a junction formed therebetween, so that the heat transfer unit is fixedly attached to the frame. With the above method, the steps for assembling the heat transfer unit to the frame are effectively reduced, and the material and production costs for applying adhesive agent or adhesive tape are also saved.

Abstract: A series fan with support frame includes a first fan, a second fan and a hollow support frame. The support frame has a first receiving space, a second receiving space, an inlet, an outlet and an inclined passage in communication between the first and second receiving spaces. The first and second receiving spaces are respectively positioned in the support frame in adjacency to the inlet and the outlet. The first and second fans are respectively correspondingly received in the first and second receiving to spaces. A first virtual central line of the first fan and a second virtual central line of the second fan intersect each other in the inclined passage.

Abstract: A manufacturing method of thermal module assembling structure includes a step of making a heat pipe received in a channel of a base seat tightly fitted and inserted in the channel by means of mechanical processing so as to integrally connect the base seat with the heat pipe. The manufacturing method of thermal module assembling structure is able to effectively enhance the connection strength between the base seat and the heat pipe.

Abstract: A method of removing ineffective portion of flat heat pipe is disclosed. The method includes the steps of providing a flat heat pipe; flattening out at least one wick-free flatten-out zone of the flat heat pipe and then sealing the flattened flatten-out zone by welding; and cutting off a cut-away section but reserving a remainder section of the flattened and sealed flatten-out zone, so that an ineffective portion is removed from the flat heat pipe. After being processed with the above method, the flat heat pipe can have effectively increased heat transfer efficiency and save a lot of space.

Abstract: A thermal module assembling structure includes a heat sink, at least one leaf spring, at least one holding member and a shaft rod. The heat sink has a base seat and multiple radiating fins disposed on the base seat. At least one perforation is formed on each of two opposite sides of the base seat. The heat sink is correspondingly assembled on the leaf spring. At least one engagement post is disposed on the leaf spring corresponding to the perforation. The holding member is slidably capped on the engagement post and has a first end and a second end. The second end is formed with a socket having an internal receiving space in which a raised section is formed. The engagement post is inlaid in the receiving space. The shaft rod passes through the heat sink. Two ends of the shaft rod are respectively connected with the engagement posts.

Abstract: An apparatus body heat dissipation device includes an apparatus case, at least one plate body and at least one drive member. The apparatus case has at least one first opening and at least one second opening and a receiving space. The plate body is disposed in the receiving space. The drive member serves to drive the plate body to move within the receiving space to produce an air convection effect between the interior of the apparatus case and the ambient surrounding air of the apparatus case so that the air convection in the limited space of the apparatus body can be effectively enhanced to greatly enhance the heat dissipation efficiency.

Abstract: An internal frame structure with heat insulation effect and an electronic apparatus with the internal frame structure. The internal frame includes a main body and a frame unit. A heat insulation layer is formed between the main body and the frame unit and positioned on at least two opposite sides of the main body. The heat insulation layer has a first side connected with the main body and a second side connected with the frame unit. The heat insulation layer serves to insulate the heat of the main body from being transferred to the frame unit.

Abstract: A circuit board and fan frame connection structure includes a fan frame, a circuit board and an adhesive member having multiple through holes. The fan frame includes a bottom board, a bearing cup disposed at the center of the bottom board and multiple perforations formed through the bottom board. The bottom board has an upper surface and a lower surface. The circuit board is adhered to the lower surface of the bottom board via the adhesive member. The electronic components arranged on the circuit board pass through the aligned through holes and perforations.

Abstract: A water-cooling radiator unit and a device thereof. The water-cooling radiator unit includes a main body, a working fluid, a first plate body, a second plate body and a pump. The main body is composed of a first sheet body, a second sheet body and a third sheet body stacked on and assembled with each other to form a flow way set, a conversion sink, a first sink and a second sink. The conversion sink and a partitioning section together divide the main body into a first portion and a second portion. A first flow guide passage and a second flow guide passage are formed on outer side of the conversion sink. The wall faces of the first flow guide passage and the conversion sink of the second portion and the second flow guide passage are respectively formed with multiple first, second and third orifices.