Patents Assigned to Asia Vital Component Co., Ltd.
  • Fan impeller structure of cooling fan
    Patent number: 10273971
    Abstract: A fan impeller structure of cooling fan includes a blade assembly and a hub. The blade assembly has multiple blades and an annular cover body. The annular cover body is integrally formed on the rear ends of the blades by injection molding to enclose and connect with the rear ends of the blades. Alternatively, the annular cover body is fused and integrally connected with the rear ends of the blades by means of laser welding. The blade assembly and the hub are integrally connected with each other to form the fan impeller structure.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: April 30, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Liang-Hua Xu, Te-Chung Wang
  • Series fan structure
    Patent number: 10267339
    Abstract: A series fan structure includes a series fan assembly and an assembling member. The series fan assembly has a first fan and a second fan. The first and second fans are correspondingly serially connected with each other. The first fan has a first fan frame defining a first receiving space. The second fan has a second fan frame defining a second receiving space. The assembling member is disposed between the first and second fan frames. The assembling member is formed with multiple straight-through perforations in communication with the first and second receiving spaces. The series fan structure improves the vibration and noise problem of the conventional series fan structure and is able to increase airflow volume.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: April 23, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sung-Wei Sun, Feng Liu, Ze-Hua Tan, Jing-Ping Huang
  • Fan structure with non-circular circumference
    Patent number: 10260508
    Abstract: A fan structure with non-circular circumference includes a frame, a first hub, a second hub, a transmission belt member, a first assembling member and a second assembling member. A first and a second base are provided in and protruded from a bottom of the frame. The first and the second hub are respectively mounted on the first and the second base, and a stator unit is provided between the first hub and the first base. The transmission belt member is fitted around side walls of the first and second hubs, and has a plurality of blades spaced on an outer surface thereof. The first and the second assembling member are correspondingly assembled to the tops of the first and the second hub. With the above arrangements, the fan structure can operate with largely reduced vibration and noise and can be manufactured at reduced material and production costs.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: April 16, 2019
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Bor-Haw Chang, Yu-Tzu Chen, Chung-Shu Wang
  • Water cooling heat dissipation structure
    Patent number: 10251306
    Abstract: A water cooling heat dissipation structure includes a first and a second plate, a water cooling heat dissipation body, which is composed of a plurality of stacked heat dissipation members. The first plate, the heat dissipation members, and the second plate are in sequence stacked up into one and another to integrally form the water cooling heat dissipation structure by heat treatment. The water cooling heat dissipation body has a top side attached to one side of the first plate and a bottom side thereof attached to the second plate, so as to secure two sides of a flow passage of the water cooling heat dissipation body. A first and a second connecting portion is respectively provided on two sides of the first plate or the water cooling heat dissipation body, and the first and the second connecting portion is communicable with the flow passage.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: April 2, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Heat dissipation device
    Patent number: 10247488
    Abstract: A heat dissipation device includes a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate, so as to have reduced manufacturing costs and provide uniform temperature effect.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: April 2, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Camera module
    Patent number: 10237475
    Abstract: A camera module includes a first and a second photographing member, and a circuit substrate. The circuit substrate has a first lateral side and an opposite second lateral side, and a plurality of circuits. The first and the second photographing member is provided on the first and the second lateral side of the circuit substrate respectively and electrically connected to the circuit substrate. With these arrangements, the camera module can have overall reduced volume and is able to photographing a 360-degree panoramic image and lower the manufacturing cost.
    Type: Grant
    Filed: January 15, 2017
    Date of Patent: March 19, 2019
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Wei-Chuan Wang, Jing-Xia Pei, Huan Deng
  • Bearing structure with close fit
    Patent number: 10215231
    Abstract: The present invention relates to a bearing structure with a close fit, which comprises a fan frame having a base and a shaft sleeve disposed vertically. The shaft sleeve has a receiving space in which a bearing set is disposed. At least one external ring is sleeved around the outer perimeter of the shaft sleeve and is disposed corresponding to the bearing set. Therefore, by means of the external ring, the close fit between the shaft sleeve and the bearing set is improved, which increases the assembly precision.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: February 26, 2019
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Chu-Hsien Chou
  • Heat dissipation device
    Patent number: 10215499
    Abstract: A heat dissipation device includes a covering member, a heat pipe, and a heat dissipation unit. The covering member has a hollow C-shaped fitting portion, in which the heat pipe is fitted to tightly connect to the covering member. At least one first heat transfer portion is outwardly extended from a periphery of the C-shaped fitting portion of the covering member. The heat dissipation unit has a plurality of parallelly spaced heat radiation fins, each of which has a through hole formed thereon, and at least one first locating slot is outwardly extended from the through hole. When the C-shaped fitting portion and the first heat transfer portion are respectively extended through the through holes and the first locating slots, the covering member is connected to the heat dissipation unit. With the first heat transfer portion, the heat dissipation device can have enhanced heat transfer and dissipation effect.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: February 26, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Chih-Peng Chen, Huang-Pin Shen
  • Water-cooling radiator structure
    Patent number: 10219408
    Abstract: A water-cooling radiator structure includes at least one first and at least one second sealing element and a first water-cooling radiator main body formed by a plurality of stacked first radiator elements. The second sealing element, the first radiator elements and the first sealing element are sequentially stacked and then integrally connected together through heat treating. The first and the second sealing element have one side connected to an upper and a lower side, respectively, of the first water-cooling radiator main body to seal a top and a bottom, respectively, of at least one first flow passage defined on the first water-cooling radiator main body. At least one first and second coupling section are optionally provided on the first sealing element or at two opposite ends of the first flow passage; and the first and the second coupling section are fluidly communicable with the first flow passage.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: February 26, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Thermal module assembling structure
    Patent number: 10190830
    Abstract: A thermal module assembling structure includes a base seat and a heat pipe. The base seat is formed with a channel and at least one hole recessed and formed on one side of the base seat in adjacency to the channel. The channel has at least one protrusion section corresponding to the hole. One end of the heat pipe is received in the channel. The heat pipe has at least one insertion recess. The protrusion section is tightly fitted and inserted in the corresponding insertion recess of the heat pipe.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: January 29, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Foldable water-cooling device
    Patent number: 10185351
    Abstract: A bendable water-cooling device includes: a pump unit having a pump case and a driver. The pump case has a pump chamber, a first inlet and a first outlet. The pump case is formed with a first pivotal connection section on the same side as the first outlet; a heat exchange unit having a liquid reservoir case and a heat dissipation member, the liquid reservoir case having a heat exchange chamber, a second inlet and a second outlet, the liquid reservoir case being formed with a second pivotal connection section on the same side as the second inlet; and a pivot unit having a first mating section and a second mating section respectively pivotally connected with the first and second pivotal connection sections. The pump unit and the heat exchange unit are bendable around the pivot unit from a horizontal position to an upper and lower overlapping position.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: January 22, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Jianwu Yin, Rongxian Zhang
  • Series fan inclination structure
    Patent number: 10184477
    Abstract: A series fan inclination structure includes an inclined frame body assembly, a first rotor assembly and a second rotor assembly. The inclined frame body assembly has a receiving space. The receiving space includes a first space, a second space and a flow guide passage. A first base seat is obliquely disposed in the first space. A second base seat is obliquely disposed in the second space. The flow guide passage is formed between the first and second base seats in communication with the first and second spaces. The first and second rotor assemblies are correspondingly rotatably disposed on the first and second base seats. The series fan inclination structure is able to greatly reduce the vibration and lower the noise caused by the interaction of the dipole.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: January 22, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Bor-Haw Chang, Yu-Tzu Chen, Chung-Shu Wang
  • Fan salt-fog-resistant structure and fan frame thereof
    Patent number: 10180145
    Abstract: A fan salt-fog-resistant structure and a fan frame thereof. The fan salt-fog-resistant structure includes a base seat having a bearing cup and at least one flow guide body. Multiple connection bodies outward extend from the base seat. The flow guide body is disposed at a junction between the base seat and the connection bodies. The fan frame includes a main body having a first open side and a second open side and a flow passage defined therebetween. One end of the connection body is connected with the second open side. When airflow entraining moisture and salt fog flows through the junction between the base seat and the connection bodies, the flow guide body serves to guide the airflow and prevent the airflow from forming eddy, whereby the salt fog entrained by the airflow will not crystallize to form sediments at the junction between the base seat and the connection bodies.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: January 15, 2019
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Bor-Haw Chang
  • Camera module with integrated chip-on-board image sensing chip
    Patent number: 10171715
    Abstract: A camera module includes a circuit board, a camera device and an image processing chip. An image sensation chip of the camera device is directly integrated with the circuit board by means of chip-on-board (COB) manufacturing process to minify the total volume of the camera module, whereby the camera module can be disposed in a narrow space.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: January 1, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Wei-Chuan Wang, Xin-Lian Cheng, Ting-Yu Lin, Chun-Mei Zhang, Chin-Lian Yeh
  • Fan rotor mechanism
    Patent number: 10138895
    Abstract: A fan rotor mechanism includes a fan impeller, a case and an adhesive body. The fan impeller has a hub and multiple fan blades. The hub has a first top section and a first peripheral section together defining a receiving space for receiving the case. The case has a receptacle for receiving therein at least one magnetic component. The case and the magnetic component define therebetween a filling gap. The case is formed with at least one perforation in communication with the filling gap. The adhesive body is filled up in the filling gap. By means of the structural design of the fan rotor mechanism, the fan rotor mechanism is applicable to various magnetic components with different sizes. Therefore, is unnecessary to manufacture different sizes of molds for different sizes of cases so that the fan rotor mechanism has high universality and is manufactured at lower cost.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: November 27, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Min-Sheng Cheng, Te-Chung Wang
  • Knockdown heat dissipation unit
    Patent number: 10132571
    Abstract: A knockdown heat dissipation unit includes at least one combination body and multiple heat pipes. The combination body has two opposite connection sections. The heat pipes are respectively connected with the connection sections of the combination body to form a large area of thermal contact face. According to the structural design of the knockdown heat dissipation unit, the number of the heat pipes can be increased or reduced according to the heat dissipation requirement of a user. Also, the number of the heat pipes can be flexibly adjusted according to the size of a heat source to enhance the heat dissipation effect.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: November 20, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Ming-Han Yu, Chung-Hua Liao, Wen-Jui Chuang
  • Thermal Module
    Patent number: 10123459
    Abstract: A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are assembled and disposed in the receiving space. At least one protrusion section protrudes from one side of the first radiating fin assembly. The protrusion section is formed with a first slope and a second slope. The second radiating fin assembly is assembled with the first radiating fin assembly. At least one notch is formed on one side of the second radiating fin assembly corresponding to the protrusion section. The notch is formed with a third slope and a fourth slope. The third slope is in contact with the first slope. A gap is defined between the fourth and second slopes. An open space is defined between the first and second radiating fin assemblies in communication with the gap.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: November 6, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Wen-Ji Lan
  • Heat dissipation device
    Patent number: 10119766
    Abstract: A heat dissipation device includes a housing and a heat pipe. The heat pipe has an open end, which is inserted into an opening on a top side of the housing, such that a heat pipe chamber of the heat pipe is communicated with a housing chamber of the housing and an extended portion extended from the open end of the heat pipe is pressed against a bottom side of the housing, as well as a heat pipe wick structure of the heat pipe is connected to a housing wick structure of the housing, so as to increase heat transfer effect.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: November 6, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Yu-Min Lin, Wen-Ji Lan
  • Manufacturing method of vapor chamber
    Patent number: 10112272
    Abstract: A manufacturing method of vapor chamber includes steps of: providing a first board body and a second board body; using mechanical processing to form a hooked section structure on one face of the first board body; using mechanical processing to form a hook section structure on one face of the second board body; and correspondingly mating the first and second board bodies with each other to make the hook section and the hooked section contact and hook and connect with each other and sealing the periphery of the first and second board bodies and vacuuming the first and second board bodies and filling therein a working fluid. According to the manufacturing method, the vapor chamber is manufactured without any additional support structure, but is still free from the problem of thermal expansion. Also, the vapor chamber can be thinned and lightweight.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: October 30, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Hsiu-Wei Yang, Fu-Kuei Chang
  • Heat dissipation structure for mobile device
    Patent number: 10114430
    Abstract: A heat dissipation structure for mobile device includes an element holding member, which has a holding portion and a cooling chip set on the holding portion. The holding portion has a first side and an opposite second side; and the cooling chip has a cold surface and an opposite hot surface. The cooling chip is set on the holding portion with the cold surface and the hot surface being flush with the first and the second side of the holding portion, respectively. The heat dissipation structure can be mounted in a mobile device to quickly cool heat-producing electronic elements in the mobile device, so that any produced heat is guided away from the mobile device without accumulating therein.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: October 30, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Ching-Hang Shen