Abstract: An immersion lithographic apparatus is described in which a two-phase flow is separated into liquid-rich and gas-rich flows by causing the liquid-rich flow to preferentially flow along a surface.

Abstract: A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. The thin film stack comprises an (optional) isolation layer, a metal layer forming an electrode, a sensor, a heater, a transistor or a logic device, and a top isolation layer.

Abstract: An immersion lithographic apparatus is disclosed that includes a fluid handling system configured to confine immersion liquid to a localized space between a final element of a projection system and a substrate and/or table and a gas supplying device configured to supply gas with a solubility in immersion liquid of greater than 5×10?3 mol/kg at 20° C. and 1 atm total pressure to an area adjacent the space.

Abstract: A substrate holder for use in a lithographic apparatus and configured to support a substrate, the substrate holder including: a main body having a main body surface; and a plurality of burls projecting from the main body surface; wherein each burl has a distal end configured to engage with the substrate; the distal ends of the burls substantially conform to a support plane whereby a substrate can be supported in a substantially flat state on the burls; a frictional force between the distal end of each burl and a substrate engaged therewith arises in a direction parallel to the support plane in the event of a relative movement of the substrate and substrate holder in the direction; and distal end surfaces of the burls are provided with a release structure configured so that the frictional force is less than would arise in the absence of the release structure.

Abstract: The present invention relates to a substrate support (1), comprising: •a support body (2) forming a support surface configured to support a substrate, wherein said support surface comprises a support surface part configured to support a substrate area of the substrate, •at least one actuator (6) arranged on the support body at a location aligned with the support surface part and configured to contract or extend in a direction substantially parallel to a main plane of the support surface,

Abstract: A porous member is used in a liquid removal system of an immersion lithographic projection apparatus to smooth uneven flows. A pressure differential across the porous member may be maintained at below the bubble point of the porous member so that a single-phase liquid flow is obtained. Alternatively, the porous member may be used to reduce unevenness in a two-phase flow.

Abstract: A method involving a radiation intensity distribution for a target measured using an optical component at a gap from the target, the method including: determining a value of a parameter of interest using the measured radiation intensity distribution and a mathematical model describing the target, the model including an effective medium approximation for roughness of a surface of the optical component or a part thereof.

Abstract: A sensor includes two shear-mode piezoelectric transducers, wherein each piezoelectric transducer has a bottom surface and a top surface, wherein the top surfaces of the piezoelectric transducers are rigidly connected to each other, and wherein the bottom surfaces of the piezoelectric transducers are configured to be attached to an object to be measured.

Abstract: A lithographic apparatus obtains a height map of a substrate and uses the height map when controlling imaging of the pattern to the substrate. The apparatus is arranged to disregard at least partially height anomalies when controlling the imaging. The height anomalies may be identified by processing the height map. For example, in some embodiments the height anomalies are identified using a shape recognition model. In some embodiments, a modified version of the height map is produced in which the height anomalies are at least partially removed, and the modified version of the height map is used in controlling the imaging. An anomaly map may be used together with the (unmodified) height map to control imaging.

Abstract: An inspection substrate for inspecting a component, e.g. a liquid confinement system, of an apparatus for processing production substrates, e.g. a lithographic apparatus, the inspection substrate comprising: a body having dimensions similar to a production substrate so that the inspection substrate is compatible with the apparatus; an illumination device, e.g. light emitting diodes, embedded in the body; a sensor, e.g. an imaging device or a pressure sensor, for generating inspection information relating to a parameter of a component of the apparatus proximate to the inspection substrate, the sensor embedded in the body; and a storage device embedded in the body, the storage device configured to store the inspection information, e.g. image data.

Abstract: Methods and systems for automatically generating robust metrology targets which can accommodate a variety of lithography processes and process perturbations. Individual steps of an overall lithography process are modeled into a single process sequence to simulate the physical substrate processing. That process sequence drives the creation of a three-dimensional device geometry as a whole, rather than “building” the device geometry element-by-element.

Abstract: The present invention provides a number of innovations in the area of computational process control (CPC). CPC offers unique diagnostic capability during chip manufacturing cycle by analyzing temporal drift of a lithography apparatus/ process, and provides a solution towards achieving performance stability of the lithography apparatus/process. Embodiments of the present invention enable optimized process windows and higher yields by keeping performance of a lithography apparatus and/or parameters of a lithography process substantially close to a pre-defined baseline condition. This is done by comparing the measured temporal drift to a baseline performance using a lithography process simulation model. Once in manufacturing, CPC optimizes a scanner for specific patterns or reticles by leveraging wafer metrology techniques and feedback loop, and monitors and controls, among other things, overlay and/or CD uniformity (CDU) performance over time to continuously maintain the system close to the baseline condition.

Abstract: A sensor system configured to determine a position of a substrate having an edge. The sensor system includes a radiation source arranged to emit a radiation bundle, a reflective element, a detector device and a substrate table having a supporting surface for supporting the substrate. The supporting surface is at least partly along a plane. The radiation source and the detector device are arranged on a first side of the plane. The reflective element is arranged on a second side of the plane other than the first side. The reflective element is arranged to create a reflected bundle by reflecting the radiation bundle. The reflective element is arranged to illuminate the edge with the reflected bundle. The detector device is arranged to receive the reflected bundle.

Abstract: A method for monitoring a characteristic of illumination from a metrology apparatus, the method comprising: using the metrology apparatus to acquire a pupil image at different focus settings of the metrology apparatus; and calculating an asymmetry value for each acquired pupil image; wherein each pupil image is acquired on at least one edge of a target of a substrate.

Abstract: A method of defect validation for a device manufacturing process, the method including: obtaining a first image of a pattern processed into an area on a substrate using the device manufacturing process under a first condition; obtaining a metrology image from the area; aligning the metrology image and the first image; and determining from the first image and the metrology image whether the area contains a defect, based on one or more classification criteria.

Abstract: An overlay metrology target (T) is formed by a lithographic process. A first image (740(0)) of the target structure is obtained using with illuminating radiation having a first angular distribution, the first image being formed using radiation diffracted in a first direction (X) and radiation diffracted in a second direction (Y). A second image (740(R)) of the target structure using illuminating radiation having a second angular illumination distribution which the same as the first angular distribution, but rotated 90 degrees. The first image and the second image can be used together so as to discriminate between radiation diffracted in the first direction and radiation diffracted in the second direction by the same part of the target structure. This discrimination allows overlay and other asymmetry-related properties to be measured independently in X and Y, even in the presence of two-dimensional structures within the same part of the target structure.

Abstract: A measurement system for measuring a position and/or displacement of an object (40), the measurement system comprising a sensor (20) and a target (45), the sensor comprising an electromagnet (21); a driving circuit (24) configured to drive the electromagnet to generate an alternating magnetic field (AMF); a measuring circuit (25) configured to measure an electrical impedance parameter of the electromagnet; the target being located on a surface (41) of the object that faces the sensor, wherein the target comprises a graphene layer (46), and wherein, in use, when the alternating magnetic field interacts with the target, the alternating magnetic field changes (RMF), altering the electrical impedance parameter of the electromagnet.

Abstract: A first substrate (2002) has a calibration pattern applied to a first plurality of fields (2004) by a lithographic apparatus. Further substrates (2006, 2010) have calibration patterns applied to further pluralities of fields (2008, 2012). The different pluralities of fields have different sizes and/or shapes and/or positions. Calibration measurements are performed on the patterned substrates (2002, 2006, 2010) and used to obtain corrections for use in controlling the apparatus when applying product patterns to subsequent substrates. Measurement data representing the performance of the apparatus on fields of two or more different dimensions (2004, 2008, 2012) is gathered together in a database (2013) and used to synthesize the information needed to calibrate the apparatus for a new size. Calibration data is also obtained for different scan and step directions.

Abstract: A method of measuring a property of a substrate, the substrate having a plurality of targets formed thereon, the method comprising: measuring N targets of the plurality of targets using an optical measurement system, where N is an integer greater than 2 and each of said N targets is measured Wt times, where Wt is an integer greater than 2 so as to obtain N*Wt measurement values; and determining R property values using Q equations and the N*Wt measurement values, where R<Q?N*Wt; wherein the optical measurement system has at least one changeable setting and, for each of the N targets, measurement values are obtained using different setting values of at least one changeable setting.

Abstract: The invention relates to a dual stage lithographic apparatus, wherein two substrate stages are constructed and arranged for mutual cooperation in order to perform a joint scan movement. The joint scan movement brings the lithographic apparatus from a first configuration, wherein immersion liquid is confined between a first substrate held by the first stage of the stages and a projection system of the apparatus, to a second configuration, wherein the immersion liquid is confined between a second substrate held by the second stage of the two stages and the projection system, such that during the joint scan movement the liquid is essentially confined within the space with respect to the projection system.