Abstract: A displacement measurement system configured to provide measurement of the relative displacement of two components in six degrees of freedom with improved consistency and without requiring excessive space.

Abstract: An imprinting method is disclosed that, in embodiment, includes contacting first and second spaced target regions of an imprintable medium on a substrate with first and second templates respectively to form respective first and second imprints in the medium and separating the first and second templates from the imprinted medium.

Abstract: An optical sensor apparatus for use in an extreme ultraviolet lithographic system is disclosed. The apparatus includes an optical sensor comprising a sensor surface and a removal mechanism configured to remove debris from the sensor surface. Accordingly, dose and/or contamination measurements may be carried out conveniently for the lithographic system.

Abstract: In an immersion lithographic apparatus, bubble formation in immersion liquid is reduced or prevented by reducing a gap size or area on a substrate table and/or covering the gap.

Abstract: The X, Y and Rz positions of a mask stage are measured using two optical encoder-reading heads measuring displacements of respective grid gratings mounted on the mask stage. The grid gratings are preferably provided on cut-away portions of the mask table so as to be coplanar with the pattern on the mask itself. Measurements of the table position in the other degrees of freedom can be measured with capacitive or optical height sensors.

Abstract: The invention relates to a method for measuring the relative position of a first and a second alignment mark on a substrate. The first alignment mark comprises a periodic structure having a first portion with a first periodicity (PE1) and an adjacent second portion with a second periodicity (PE2). The second alignment mark (11) comprises a periodic structure having a first portion with the second periodicity (PE2) and an adjacent second portion with the first periodicity (PE1). The first and second alignment marks are arranged such that the first portions are substantially located one over the other and the second portions are substantially located one over the other. The method further comprises generating a Moiré pattern from the alignment marks and determining the relative positions of the first and second alignment marks based on the periodicity of the Moiré pattern.

Abstract: A lithographic apparatus has a patterning support holding a patterning device. At least one position sensor measures a position of the patterning device relative to the patterning support, and generates a measuring signal. A positioning device controls a position of the patterning support on the basis of the measuring signal input to the positioning device. In a corresponding device manufacturing method a patterning support is provided. A patterning device is held on the patterning support. The patterning support is moved along a line of movement. A position of the patterning device relative to the patterning support is measured, and a position of the patterning support is controlled on the basis of the measurement of the position of the patterning device relative to the patterning support. Thus, the controlling of the position of the patterning support compensates for a slip of the patterning device relative to the patterning support.

Abstract: A porous member is used in a liquid removal system of an immersion lithographic projection apparatus to smooth uneven flows. A pressure differential across the porous member may be maintained at below the bubble point of the porous member so that a single-phase liquid flow is obtained. Alternatively, the porous member may be used to reduce unevenness in a two-phase flow.

Abstract: Measurement of a profile of a scatterometry object on top of one or more product layers on a substrate is disclosed. To prevent an unknown parameters of one or more product layers having an effect on the measurement of the object profile, the thickness of the one or more product layers is measured prior to measuring the profile of the scatterometry object on the layer(s). In an embodiment, each of a plurality of product layers is measured as it is exposed so that only the degree of freedom of the most recently exposed product layer is unknown at each measurement step. When each of a plurality of product layers has been measured, and a scatterometry object is placed at the top of the layers, only the degrees of freedom of that scatterometry object should be unknown and only the profile of the object should need to be measured.

Abstract: A lithographic apparatus includes a radiation system constructed to provide a beam of radiation from radiation emitted by a radiation source. The radiation system includes a contaminant trap configured to trap material emanating from the radiation source. The contaminant trap includes a contaminant engaging surface arranged in the path of the radiation beam that receives the material emanating from the radiation source during propagation of the radiation beam in the radiation system. The radiation system also includes a liquid tin cooling system constructed to cooling the contaminant trap with liquid tin. The apparatus includes an illumination system configured to condition the radiation beam, a support constructed to support a patterning device configured to impart the radiation beam with a pattern in its cross-section, a substrate table constructed to hold a substrate, and a projection system configured to project the patterned radiation beam onto a target portion of the substrate.

Abstract: An embodiment of the invention provides a method to clean a surface. The method includes at least partly liberating contaminants from the surface with a contaminant liberating device, and capturing the contaminants that have been at least partly liberated with a contaminant removal device, the contaminant removal device generating at least one optical trap to trap the contaminants that have been at least partly liberated. Embodiments of the invention also provide a device manufacturing method, a method to clean a surface of an optical element, a cleaning assembly and cleaning apparatus, and a lithographic apparatus.

Abstract: A device manufacturing method is disclosed. The method includes patterning a beam of radiation, projecting the patterned beam of radiation onto a plurality of outer target portions of a substrate in a sequence in which each subsequent outer target portion is spaced-apart from a preceding outer target portion, and subsequent to projecting the patterned beam of radiation on the plurality of outer target portions, projecting the patterned beam of radiation onto an inner target portion of the substrate.

Abstract: Each pixel of a spatial light modulator comprises a movable mirror, a light sensitive element and control circuitry to drive an actuator set the movable mirror to a state determined by a signal received by the light sensitive element.

Abstract: A lithographic apparatus configured to project a patterned beam of radiation onto a target portion of a substrate is disclosed. The apparatus includes a first radiation dose detector and a second radiation dose detector, each detector comprising a secondary electron emission surface configured to receive a radiation flux and to emit secondary electrons due to the receipt of the radiation flux, the first radiation dose detector located upstream with respect to the second radiation dose detector viewed with respect to a direction of radiation transmission, and a meter, connected to each detector, to detect a current or voltage resulting from the secondary electron emission from the respective electron emission surface.

Abstract: A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.

Abstract: A control system to control a position parameter of a stage in a lithographic apparatus includes a stage controller to control a position parameter of the stage in at least a first direction. The control system includes a disturbance torque estimator to estimate a disturbance torque on the stage, the disturbance torque about an axis extending in a second direction, the second direction being substantially perpendicular to the first direction. The control system includes a correction signal calculator, the correction signal calculator provided with the estimated disturbance torque and a signal representative of a position of the stage in a third direction, the third direction being substantially perpendicular to the first and second directions. The correction signal calculator determines a feedforward correction signal to correct a position error of the stage in the first direction due to the disturbance torque, the feedforward correction signal to be fed to the stage.

Abstract: To detect whether a substrate is in a focal plane of a scatterometer, a cross-sectional area of radiation above a certain intensity value is detected both in front of and behind a back focal plane of the optical system of the scatterometer. The detection positions in front of and behind the back focal plane should desirably be equidistant from the back focal plane along the path of the radiation redirected from the substrate so that a simple comparison may determine whether the substrate is in the focal plane of the scatterometer.

Abstract: The invention includes a lithographic system having a first source for generating radiation with a first wavelength and an alignment system with a second source for generating radiation with a second wavelength. The second wavelength is larger than the first wavelength. A marker structure is provided having a first layer and a second layer. The second layer is present either directly or indirectly on top of said first layer. The first layer has a first periodic structure and the second layer has a second periodic structure. At least one of the periodic structures has a plurality of features in at least one direction with a dimension smaller than 400 nm. Additionally, a combination of the first and second periodic structure forms a diffractive structure arranged to be illuminated by radiation with the second wavelength.

Abstract: In a scatterometry apparatus having an illumination aperture stop, a field stop is provided at an intermediate image to control a spot size on a substrate. The field stop may be apodized, e.g., having a transmissivity in the form of a trapezium or a Gaussian shape.

Abstract: A metrology tool is arranged to measure a parameter of a substrate that has been provided with a pattern in a lithographic apparatus. The metrology tool includes a base frame, a substrate table, a sensor, a displacement system, a balance mass, and a bearing. The substrate table is constructed and arranged to hold the substrate. The sensor is constructed and arranged to measure a parameter of the substrate. The displacement system is configured to displace the substrate table or the sensor with respect to the other in a first direction. The bearing is configured to movably support the first balance mass so as to be substantially free to translate in a direction opposite of the first direction in order to counteract a displacement of the substrate table or sensor in the first direction.