Patents Assigned to Atotech Deutschland GmbH
  • ELECTROPLATING BATH AND METHOD FOR PRODUCING DARK CHROMIUM LAYERS
    Publication number: 20140042033
    Abstract: The invention relates to methods and plating baths for electrodepositing a dark chromium layer on a workpiece. The trivalent chromium electroplating baths comprise sulphur compounds and the methods for electrodepositing a dark chromium layer employ these trivalent chromium electroplating baths. The dark chromium deposits and workpieces carrying dark chromium deposits are suited for application for decorative purposes.
    Type: Application
    Filed: April 27, 2012
    Publication date: February 13, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Klaus-Dieter Schulz, Philipp Wachter, Philip Hartmann
  • Pyrophosphate-based bath for plating of tin alloy layers
    Patent number: 8647491
    Abstract: An aqueous cyanide-free electrolyte bath for plating of tin alloy layers on substrate surfaces comprising (i) a tin ion source and a source for another alloy element, characterized in that it further contains (ii) N-methyl pyrrolidone is described.
    Type: Grant
    Filed: February 5, 2009
    Date of Patent: February 11, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Philip Hartmann, Lars Kohlmann, Heiko Brunner, Klaus-Dieter Schulz
  • Method for control of stabilizer additives in electroless metal and metal alloy plating electrolytes
    Patent number: 8648601
    Abstract: The present invention describes a method for the measurement of the stabilizer additive concentration in electroless metal and metal alloy plating electrolytes comprising a voltammetric measurement. Said method comprises the steps a. conditioning of the working electrode, b. interaction of intermediates on the working electrode, c. measurement of the Faradaic current and d. determining the Faradaic current.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: February 11, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Constanze Donner, Guenther Bauer, Therese Stern, Kay Wurdinger, Lutz Brandt, Frank Bruening
  • PROCESS FOR ETCHING A RECESSED STRUCTURE FILLED WITH TIN OR A TIN ALLOY
    Publication number: 20140000650
    Abstract: The invention discloses a process for planarization of recessed structures filled with tin or a tin alloy which avoids the formation of dimples. Such structures can serve as solder deposits for stable and reliable solder joints in electronic devices.
    Type: Application
    Filed: February 9, 2012
    Publication date: January 2, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Neal Wood, Dirk Tews
  • ZINC-IRON ALLOY LAYER MATERIAL
    Publication number: 20130316190
    Abstract: The invention discloses a zinc-iron alloy layer material having a body centred cubic crystal structure of the ?-phase, a (330) texture and an iron content of 12 to 20 wt.-% deposited from an alkaline aqueous plating bath. The zinc alloy layer material provides a high corrosion protection to metallic substrates, has a high hardness and a bright appearance.
    Type: Application
    Filed: January 30, 2012
    Publication date: November 28, 2013
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Lukas Bedrnik, Frantisek Haas, Nadine Lang, Roland Vogel
  • AUTOCATALYTIC PLATING BATH COMPOSITION FOR DEPOSITION OF TIN AND TIN ALLOYS
    Publication number: 20130309404
    Abstract: An autocatalytic tin plating bath containing Sn2+ ions, Ti3+ ions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.
    Type: Application
    Filed: January 11, 2012
    Publication date: November 21, 2013
    Applicant: Atotech Deutschland GmbH
    Inventors: Arnd Kilian, Jens Wegricht, Isabel-Roda Hirsekorn
  • METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BONDING ON PRINTED CIRCUIT BOARDS AND IC-SUBSTRATES
    Publication number: 20130288475
    Abstract: The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.
    Type: Application
    Filed: December 16, 2011
    Publication date: October 31, 2013
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Mustafa Özkök, Gustavo Ramos, Arnd Kilian
  • Method, clip and device for transporting an article to be treated in an electrolytic system
    Patent number: 8567590
    Abstract: The invention relates to the conveyance and preferably also to the electrical contacting of an item to be treated (1), for example in the form of a printed circuit board or a conductor foil, in an electrolysis system. A device according to the invention comprises a large number of clamps (10) able to move along a conveyance path (4) and driven by a continuously revolving drive means (20). The device is configured in such a way that the clamps (10) at the start (4a) of the conveyance path (4) are brought from an open state into a closed state in order to grip and preferably also electrically to contact the item to be treated, and that the clamps (10) respectively at the end (4b) of the conveyance path (4) are brought from the closed into the open state in order to re-release the item to be treated (1).
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: October 29, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Britta Scheller, Rainer Schmidt, Olaf Lorenz
  • IMMERSION TIN OR TIN ALLOY PLATING BATH WITH IMPROVED REMOVAL OF CUPROUS IONS
    Publication number: 20130277226
    Abstract: The invention concerns an immersion tin plating bath which comprises at least one aromatic sulfonic acid, at least one first precipitation additive and at least one second precipitation additive. The at least one first precipitation additive is an aliphatic poly-alcohol compound, an ether thereof or a polymer derived thereof having an average molecular weight in the range of 62 g/mol and 600 g/mol. The at least one second precipitation additive is a polyalkylene glycol compound having an average molecular weight in the range of 750 to 10,000 g/mol.
    Type: Application
    Filed: January 3, 2012
    Publication date: October 24, 2013
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Iris Barz, Arnd Kilian, Markus Muskulus, Britta Schafsteller
  • Metal plating additive, and method for plating substrates and products therefrom
    Patent number: 8557100
    Abstract: The present invention is directed to the fabrication of rigid memory disks, including a metal plating composition which impedes deposition of non-metallic particles during a plating process. The plating composition includes at least one sulfated fatty acid ester additive, or mixtures or salts thereof, of formula: wherein R1 is selected from the group consisting of OH, OCH2, H2CH3, C1-C7 alkyl, linear or branched; R2 selected from H and C1-C7 alkyl, linear or branched; m=1 to about 5; n=2 to about 30; o=0 to about 10; M+ is a metal or pseudo metal ion or H+. The additive has a zeta potential which impedes deposit of non-metallic particles. The invention is further directed to a method for electroless plating utilizing the additive composition in a bath with at least a stabilizing agent, complexing agent and reducing agent and source of metal ions.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: October 15, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Kevin Schell, Grant Keers, Shakeel Akhtar
  • Apparatus and method for the electrolytic treatment of a plate-shaped product
    Patent number: 8545687
    Abstract: Apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes devices 40, 42 for retaining the product L in the apparatus, one or more flow devices 10, which each include at least one nozzle 15 and are disposed situated opposite the product L, one or more counter electrodes 30, which are inert relative to the treatment agent and are disposed parallel to at least one treatment surface, eccentric motor means for generating a relative movement 44 between the product L, on the side, and the flow devices 10 and/or the counter electrodes 30, on the other side, in at least one direction parallel to a treatment surface. The product L can be immersed in the treatment agent during treatment.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: October 1, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Reinhard Schneider, Henry Kunze, Ferdinand Wiener
  • Vertical system for the plating treatment of a work piece and method for conveying the work piece
    Patent number: 8540853
    Abstract: Vertical system for the plating treatment of a work piece, the system comprising at least two treatment modules, wherein retaining devices for the work pieces are provided in the treatment modules, and at least one transport device including at least one gripping device, which retains the work piece and has a respective fastening device, and each fastening device comprises first and second clamping devices, each associated with one side of the work piece, wherein both the first and second clamping devices are displaceable for gripping and releasing the work pieces, wherein the gripping device comprises at least two fastening devices that are spaced apart from one another, each of the first and second clamping devices are moveable torsion bars as a result of which the work piece is tensioned between the fastening devices during clamping parallel to its first side.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: September 24, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Reinhard Schneider, Uwe Hauf, Britta Scheller, Henry Kunze, Ferdinand Wiener, Heinz Klingl
  • Method to form solder deposits on substrates
    Patent number: 8507376
    Abstract: Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate including a surface bearing electrical circuitry that includes at least one contact area, ii) form a solder mask layer that is placed on the substrate surface and patterned to expose the at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the conductive layer and v) etch away an amount of the solder deposit layer containing tin or tin alloy sufficient to remove the solder deposit layer from the solder mask layer area leaving a solder material layer on the at least one contact area.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: August 13, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Ingo Ewert, Sven Lamprecht, Kai-Jens Matejat, Thomas Pliet
  • COMPOSITE BUILD-UP MATERIAL FOR EMBEDDING OF CIRCUITRY
    Publication number: 20130199825
    Abstract: Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer (1), a resin layer without reinforcement (2), and a resin layer with reinforcement (3). The circuitry (9) is embedded into the resin layer without reinforcement (2).
    Type: Application
    Filed: October 21, 2011
    Publication date: August 8, 2013
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Alex Bruderer, Norbert Galster, Jurgen Kress, Michel Probst
  • COMPOSITE BUILD-UP MATERIALS FOR EMBEDDING OF ACTIVE COMPONENTS
    Publication number: 20130199832
    Abstract: Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding active components such as micro chips. The composite build-up materials comprise a carrier layer (1), a resin layer with reinforcement (2), and a resin layer without reinforcement (3). The active component (6) is embedded into the resin layer without reinforcement (6).
    Type: Application
    Filed: October 21, 2011
    Publication date: August 8, 2013
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Norbert Galster, Jurgen Kress, Hugh Laver
  • Method to form solder alloy deposits on substrates
    Patent number: 8497200
    Abstract: Method of forming a solder alloy deposit on a substrate comprising i) provide a substrate including a surface bearing electrical circuitry that includes at least one inner layer contact area, ii) form a solder mask layer on the substrate surface and patterned to expose at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution to provide a metal seed layer on the substrate surface, iv) form a structured resist layer on the metal seed layer, v) electroplate a first solder material layer containing tin onto the conductive layer, vi) electroplate a second solder material layer onto the first solder material layer, vii) remove the structured resist layer and etch away an amount of the metal seed layer sufficient to remove the metal seed layer from the solder mask layer area and reflow the substrate.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: July 30, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Kai-Jens Matejat, Sven Lamprecht, Ingo Ewert
  • Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface
    Patent number: 8491713
    Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: July 23, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Jürgen Barthelmes, Robert Ruether, Olaf Kurtz, Jana Breitfelder
  • METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES
    Publication number: 20130168438
    Abstract: Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate that includes at least one inner contact area, ii) contact the entire substrate area including the at least one inner contact area with a solution suitable to provide a conductive layer on the substrate surface, iii) form a patterned resist layer, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the inner contact area, v) remove the patterned resist layer, vi) form a solder resist layer having solder resist openings on the substrate surface.
    Type: Application
    Filed: June 23, 2011
    Publication date: July 4, 2013
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Sven Lamprecht, Kai-Jens Matejat, Ingo Ewert, Stephen Kenny
  • Method for continuously operating acid or alkaline zinc or zinc alloy baths
    Patent number: 8475874
    Abstract: The invention provides a process for depositing metallic layers from acidic or alkaline zinc or zinc alloy baths containing organic additives selected from brighteners, surfactants and complexing agents, a soluble zinc salt and optionally further metal salts selected from Fe, Ni, Co, Sn salts, wherein the bath can be purified continuously so that the process can be operated without interruption, as well as apparatus for carrying out this process.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: July 2, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Roland Vogel, Birgit Sonntag, Jens Heydecke, Jens Geisler, Ellen Habig, Andreas Noack
  • Chromium(VI)-free black passivation of surfaces containing zinc
    Patent number: 8460534
    Abstract: The invention relates to a treatment solution for producing substantially chromium(VI) free black conversion layers on alloy layers containing zinc, the solution comprising the following: (i) at least one first carboxylic acid having 1 to 8 carbon atoms, the acid containing no polar groups with exception of the carboxyl group and being a monocarboxylic acid, (ii) at least one second carboxylic acid having 1 to 8 carbon atoms, comprising at least one further polar group that is selected from —OH, —SO3H, —NH2, —NHR, —NR2, —NR3+, and —COOH (wherein R is a C1-C6 alkyl group), (iii) 20 to 400 mmol/l Cr3+ and (iv) 50 to 2000 mmol/l NO3?. The invention further provides a method for the black passivation of surfaces containing zinc, wherein the surface to be treated is immersed into such a treatment solution.
    Type: Grant
    Filed: January 15, 2008
    Date of Patent: June 11, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Jaroslava Krizova, Vaclav Kriz, Jiri Kloubek, Björn Dingwerth