Patents Assigned to Atotech Deutschland GmbH
  • Method for improving the adhesion between silver surfaces and resin materials
    Patent number: 8819930
    Abstract: The invention addresses the problem of improving the adhesion between silver surfaces and resin materials, such as epoxy resins and mold materials, used in the production of electronic devices. The invention provides a method for improving the adhesion between a silver surface and a resin material comprising a step of electrolytically treating the silver surface with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the silver surface is the cathode.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: September 2, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Christian Wunderlich, Robert Rüther, Jürgen Barthelmes, Sia-Wing Kok, Nadine Menzel
  • FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION
    Publication number: 20140242264
    Abstract: The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a source of glyoxylic acid as reducing agent, and at least one polyamino disuccinic acid or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid as complexing agent, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.
    Type: Application
    Filed: October 1, 2012
    Publication date: August 28, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Edith Stenhäuser, Sandra Röseler, Stefanie Wiese, Tang Cam Lai Nguyen, Lutz Stamp
  • ELECTROLESS PALLADIUM PLATING BATH COMPOSITION
    Publication number: 20140242265
    Abstract: The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and/or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and at least one organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions.
    Type: Application
    Filed: August 22, 2012
    Publication date: August 28, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Isabel-Roda Hirsekorn, Jens Wegricht, Arnd Kilian
  • Autocatalytic plating bath composition for deposition of tin and tin alloys
    Patent number: 8801844
    Abstract: An autocatalytic tin plating bath containing Sn2+ ions, Ti3+ ions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.
    Type: Grant
    Filed: January 11, 2012
    Date of Patent: August 12, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Arnd Kilian, Jens Wegricht, Isabel-Roda Hirsekorn
  • Electrolytic method for filling holes and cavities with metals
    Patent number: 8784634
    Abstract: Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: July 22, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Bert Reents, Bernd Roelfs, Tafadzwa Magaya, Markus Youkhanis, René Wenzel, Soungsoo Kim
  • Agent for the production of anti-corrosion layers on metal surfaces
    Patent number: 8764916
    Abstract: An agent for the production of anti-corrosion layers on metal surfaces is produced by producing an aqueous solution, which contains at least oxo-cations and halogen complex anions, and forming nanoparticles in the solution in situ by physical and/or chemical treatment of the solution. The oxo-cations are selected from MnO3+, VO3+, VO2+, WO22+, MoO22+, TiO2+, ZrO2+ and mixtures thereof, and the halogen complex anions have the structure MXab?, wherein M is selected from B, Ti, Zr, Si, Al, X is selected from F, Cl, Br, I, a is an integer of between 3 and 6 and b is an integer of between 1 and 4. The nanoparticles have a mean particle diameter of <500 nm.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: July 1, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Hermann Donsbach, Udo Hofmann, Joerg Unger
  • Silicon solar cell
    Patent number: 8759120
    Abstract: A silicon solar cell includes a first silicon layer with an emitter layer which has a thickness in a range of 50 nanometers to few hundreds nanometers. The emitter layer has at least one region which is porosified by chemical or electrochemical etching, wherein at least one part of the porosified region is embodied as metal silicide layer. A second silicon layer is disposed underneath the emitter layer, with the metal silicide extending from a top side of the emitter layer in a direction to the second silicon layer. At least one metal layer is applied on the metal silicide layer.
    Type: Grant
    Filed: August 8, 2011
    Date of Patent: June 24, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Mike Becker, Dietmar Lütke-Notarp
  • Composition and method for micro etching of copper and copper alloys
    Patent number: 8758634
    Abstract: Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of ?100 ?m.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: June 24, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Dirk Tews, Christian Sparing, Martin Thoms
  • ELECTROLESS NICKEL PLATING BATH COMPOSITION
    Publication number: 20140150689
    Abstract: The present invention relates to an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of 5 to 12 wt. %. The plating bath comprises a sulfur-containing organic stabilizing agent.
    Type: Application
    Filed: July 4, 2012
    Publication date: June 5, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Boris Alexander JANSSEN, Holger BERA, Sebastian WEISSBROD, Britta SCHAFSTELLER
  • METHOD FOR PROVIDING ORGANIC RESIST ADHESION TO A COPPER OR COPPER ALLOY SURFACE
    Publication number: 20140141169
    Abstract: The present invention relates to a method for increasing the adhesion of organic resist materials on copper or copper alloy surfaces. The copper or copper alloy surface is contacted with an aqueous adhesion promoting solution comprising at least one organic acid, a peroxide compound and optionally one or more substances selected from the group consisting of urea, derivatives thereof and water-soluble polymers.
    Type: Application
    Filed: June 29, 2012
    Publication date: May 22, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Thomas Huelsmann, Arno Clicque, Dirk Tews, Mirko Kloppisch, Andry Liong
  • Aqueous Acidic Bath for Electrolytic Deposition of Copper
    Publication number: 20140138252
    Abstract: The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at least one leveler for copper-deposition, wherein at least one leveler is a ruthenium compound, and to a process for the electrolytic deposition of copper, in particular for filling a blind micro Vertical Interconnect Access (VIA), through hole VIA, trench and similar structures on printed circuit boards, chip carriers and semiconductor wafers.
    Type: Application
    Filed: April 25, 2012
    Publication date: May 22, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Nina Dambrowsky, Uwe Hauf, Ingo Ewert, Christof Erben, René Wenzel
  • PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER-TIN ALLOYS
    Publication number: 20140124376
    Abstract: A pyrophosphate-containing bath for the cyanide-free deposition of copper alloys on substrate surfaces, comprising a reaction product of a secondary monoamine with a diglycidyl ether, is described. The electrolyte bath is suitable for the galvanic deposition of glossy white, even and uniform copper-tin alloy coatings.
    Type: Application
    Filed: December 9, 2013
    Publication date: May 8, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Philip Hartmann, Klaus-Dieter Schulz, Lars Kohlmann, Heiko Brunner
  • Method and device for producing a plastic coating
    Patent number: 8715780
    Abstract: Method for producing a plastic layer having a layer thickness of less than 200 ?m on an upper side of a substrate includes the following steps: applying plastic powder to the substrate upper side by means of a powder scattering device, then cleaning the substrate underside, then melting the applied plastic powder in a furnace, as a result of which the plastic layer is formed on the substrate, and cooling the substrate, wherein the substrate is transported continuously from method step to method step.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: May 6, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Alex Bruderer, Jurgen Herbert, Max Hunziker, Michel Probst
  • Device and Method for Recovering a Recovering Material from a Recovering Fluid Containing the Recovering Material
    Publication number: 20140116950
    Abstract: To achieve high efficiency in regeneration of waste fluid from metal plating electrolytes for example, a device and a method for recovering a recovering material from a recovering fluid containing the recovering material are provided.
    Type: Application
    Filed: May 24, 2012
    Publication date: May 1, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Jens Heydecke, Sebastian Kuhne
  • METHOD FOR ELECTROLESS PLATING
    Publication number: 20140113158
    Abstract: The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.
    Type: Application
    Filed: April 17, 2012
    Publication date: April 24, 2014
    Applicant: Atotech Deutschland GmbH
    Inventors: Frank Brüning, Birgit Beck, Bexy Dosse, Johannes Etzkorn
  • WIRE BONDABLE SURFACE FOR MICROELECTRONIC DEVICES
    Publication number: 20140110844
    Abstract: The present invention concerns thin diffusion barriers in metal and metal alloy layer sequences of contact area/barrier layer/first bonding layer type for metal wire bonding applications. The diffusion barrier is selected from Co-M-P. Co-M-B and Co-M-B—P alloys wherein M is selected from Mn, Zr, Re, Mo, Ta and W having a thickness in the range 0.03 to 0.3 ?m. The first bonding layer is selected from palladium and palladium alloys.
    Type: Application
    Filed: May 9, 2012
    Publication date: April 24, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Albrecht Uhlig, Josef Gaida, Christof Suchentrunk
  • METHOD FOR COPPER PLATING
    Publication number: 20140102910
    Abstract: A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to said heterocyclic core by a spacer is disclosed. Said method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates.
    Type: Application
    Filed: May 7, 2012
    Publication date: April 17, 2014
    Applicant: Atotech Deutschland GmbH
    Inventors: Dirk Rohde, Bernd Roelfs, Jun Higuchi
  • Aqueous, acid bath and method for the electrolytic deposition of copper
    Patent number: 8679316
    Abstract: An aqueous, acid bath for the electrolytic deposition of copper contains at least one copper ion source, at least one acid ion source, at least one brightener compound, and at least one leveler compound, and generates a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches. The leveler compound is selected from among synthetically produced non-functionalized peptides, synthetically produced functionalized peptides, and synthetically produced functionalized amino acids.
    Type: Grant
    Filed: April 27, 2009
    Date of Patent: March 25, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Bernd Roelfs, Dirk Rohde, Thomas Pliet
  • SOLUTION AND PROCESS FOR THE PRE-TREATMENT OF COPPER SURFACES USING AN N-ALKOXYLATED ADHESION-PROMOTING COMPOUND
    Publication number: 20140076461
    Abstract: The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I).
    Type: Application
    Filed: October 24, 2011
    Publication date: March 20, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Christian Sparing, Thomas Huelsmann, Arno Clicque, Patrick Brooks, Adrian Zee, Heiko Brunner
  • Device and method for chemically and electrolytically treating work pieces using a conveyor system to transport work pieces between treatment tanks
    Patent number: 8656858
    Abstract: A device and a method for chemically or electrolytically treating work pieces (1) are proposed in an effort to avoid irregular contours of finest conductive structures, pads and lands as well as bridges (shorts) on the one side or breaks on printed circuit boards on the other side. The device comprises processing tanks (2) for the treating of work pieces and a conveyor system for the transport thereof. The conveyor system comprises at least one transport carriage (18), at least one holding element (14, 25) and at least one connection means (12, 13, 35) between the transport carriage(s) and the holding element(s). The processing tanks adjoined with a clean room zone (3). The work pieces are conveyed through the clean room zone using the conveyor system.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: February 25, 2014
    Assignee: Atotech Deutschland GmbH
    Inventor: Reinhard Schneider