Patents Assigned to Atotech Deutschland GmbH
  • PLATING BATH FOR ELECTROLESS DEPOSITION OF NICKEL LAYERS
    Publication number: 20150110965
    Abstract: The present invention relates to aqueous plating bath compositions for deposition of nickel and nickel alloys utilizing novel stabilising agents possessing a carbon-carbon triple bond and a functional group to enhance the bath performance.
    Type: Application
    Filed: May 31, 2013
    Publication date: April 23, 2015
    Applicant: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Jan Picalek, Iulia Bejan, Carsten Krause, Holger Bera, Sven Rückbrod
  • Treatment solution for producing chrome and cobalt-free black conversion coatings
    Patent number: 9005373
    Abstract: The invention relates to chromium- and cobalt-free treatment solutions for producing black coatings which afford corrosion protection. The treatment solution of the invention contains oxo cations or complex halogen ions or mixtures of oxo cations and complex halogen ions, an oxidant and an organic sulphur compound.
    Type: Grant
    Filed: September 8, 2010
    Date of Patent: April 14, 2015
    Assignee: Atotech Deutschland GmbH
    Inventors: Zdenek Starkbaum, Lukas Bedrnik, Kostantin Schwarz, Bjorn Dingwerth
  • METHOD AND APPARATUS FOR ELECTROLYTICALLY DEPOSITING A DEPOSITION METAL ON A WORKPIECE
    Publication number: 20150096895
    Abstract: For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte AE are arranged and which has a device for electric current generation 60 and at least one current feeding device 31 with in each case at least one electrical contact element 34, 35 for making electrical contact with the workpiece; (b) bringing the at least one electrical contact element 34, 35 into contact with the workpiece; and (c) feeding electric current to the workpiece via the at least one electrical contact element 34, 35 in order that the deposition metal deposits on the workpiece. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element 34, 35.
    Type: Application
    Filed: April 16, 2013
    Publication date: April 9, 2015
    Applicant: Atotech Deutschland GmbH
    Inventors: Dominik Britz, Bernd Schmitt, Bernd Böse, Frank Mücklich, Christian Selzner
  • Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates
    Patent number: 8987910
    Abstract: The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: March 24, 2015
    Assignee: Atotech Deutschland GmbH
    Inventors: Mustafa Özkök, Gustavo Ramos, Arnd Kilian
  • Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces
    Patent number: 8986789
    Abstract: The invention relates to a substrate having a bondable metal coating comprising, in this order, on an Al or Cu surface: (a) a Ni—P layer, (b) a Pd layer and, optionally, (c) an Au layer, wherein the thickness of the Ni—P layer (a) is 0.2 to 10 m, the thickness of the Pd layer (b) is 0.05 to 1.0 m and the thickness of the optional Au layer (c) is 0.01 to 0.5 m, and wherein the Ni—P layer (a) has a P content of 10.5 to 14 wt.-%. The deposit internal stress of the resulting Ni—P/Pd stack is not higher than 34.48M?Pa (5,000 psi). Further, a process for the preparation of such a substrate is described.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: March 24, 2015
    Assignee: Atotech Deutschland GmbH
    Inventors: Albrecht Uhlig, Josef Gaida, Christof Suchentrunk, Michael Boyle, Brian Washo
  • Alkaline plating bath for electroless deposition of cobalt alloys
    Patent number: 8961670
    Abstract: The present invention relates to aqueous, alkaline plating bath compositions for electroless deposition of ternary and quaternary cobalt alloys Co-M-P, Co-M-B and Co-M-B—P, wherein M is selected from the group consisting of Mn, Zr, Re, Mo, Ta and W which comprise a propargyl derivative as the stabilizing agent. The cobalt alloy layers derived there from are useful as barrier layers and cap layers in electronic devices such as semiconducting devices, printed circuit boards, and IC substrates.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: February 24, 2015
    Assignee: Atotech Deutschland GmbH
    Inventors: Holger Bera, Heiko Brunner
  • Anti-corrosive treatment for surfaces made of zinc and zinc alloys
    Patent number: 8951363
    Abstract: The invention refers to a process for producing an anticorrosive coating in which a surface to be treated is brought into contact with an aqueous treatment solution containing chromium(III) ions and at least one phosphate compound and an organosol. The corrosive protection of metal surfaces, in particular those containing zinc and zinciferous surfaces with conversion layers is improved. The decorative and functional properties of the surfaces are retained or improved. In addition, the well-known problems associated with the use of compounds containing chromium(VI) or with multi-stage processes are avoided in which a passivation layer containing chromium ions and a sealing are applied one after the other.
    Type: Grant
    Filed: July 5, 2010
    Date of Patent: February 10, 2015
    Assignee: Atotech Deutschland GmbH
    Inventors: Udo Hofmann, Hermann Donsbach, Joerg Unger, Volker Krenzel
  • Non-etching non-resist adhesion composition and method of preparing a work piece
    Patent number: 8945298
    Abstract: To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching non-resist composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety and (ii) quaternary ammonium polymers having the following general chemical formula: {N+(R3)(R4)—(CH2)a—N(H)—C(Y)—N(H)—(CH2)b—N+(R3)(R4)—R5}n 2n X?, with R1, R2, R3, R4, R5, Y and X? being defined as claimed.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: February 3, 2015
    Assignee: Atotech Deutschland GmbH
    Inventors: Christian Sparing, Dirk Tews, Norbert Luetzow, Martin Thoms
  • PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES
    Publication number: 20150017331
    Abstract: The present invention relates to a process for metallizing nonconductive plastics using etching solutions free of hexavalent chromium. The etching solutions are based on permanganate solutions. After the treatment of the plastics with the etching solutions, the plastics are metallized by means of known processes.
    Type: Application
    Filed: March 15, 2013
    Publication date: January 15, 2015
    Applicant: Atotech Deutschland GmbH
    Inventors: Hermann Middeke, Enrico Kuhmeiser, Steve Schneider
  • METHOD FOR ELECTROLESS NICKEL-PHOSPHOROUS ALLOY DEPOSITION ONTO FLEXIBLE SUBSTRATES
    Publication number: 20150009638
    Abstract: The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable.
    Type: Application
    Filed: January 21, 2013
    Publication date: January 8, 2015
    Applicant: Atotech Deutschland GmbH
    Inventor: Boris Alexander Janssen
  • Method of manufacturing a circuit carrier and the use of the method
    Patent number: 8927899
    Abstract: A method of manufacturing a circuit carrier and the use of said method are proposed, said method comprising, after providing a printed circuit board (a), coating the circuit board on at least one side thereof with a dielectric (b), structuring the dielectric for producing trenches and vias therein using laser ablation (c) are performed. Next, a primer layer is deposited onto the dielectric, either onto the entire surface thereof or into the produced trenches and vias only (d). A metal layer is deposited onto the primer layer, with the trenches and vias being completely filled with metal for forming conductor structures therein (e). Finally, the excess metal and the primer layer are removed until the dielectric is exposed if the primer layer was deposited onto the entire surface thereof, with the conductor structures remaining intact (f).
    Type: Grant
    Filed: January 20, 2005
    Date of Patent: January 6, 2015
    Assignee: Atotech Deutschland GmbH
    Inventor: Hannes P. Hofmann
  • COMPOSITION AND METHOD FOR REMOVAL OF ORGANIC PAINT COATINGS FROM SUBSTRATES
    Publication number: 20140373878
    Abstract: The invention relates to a non-aqueous stripping composition for removing cured organic paint from substrates comprising i. a source of hydroxide ions; ii. a high-boiling alcohol having a boiling point of at least 100° C.; and iii. at least one surfactant represented by the following formula R—O—(CH2CH2O)nH and wherein R is an alkyl chain, linear or branched having a 2 to 24 carbon atom chain length.
    Type: Application
    Filed: February 11, 2013
    Publication date: December 25, 2014
    Applicant: Atotech Deutschland GmbH
    Inventors: Nayan H. Joshi, Kerri Little Carver, Thomas Anthony Patena, Christopher George Ringholz
  • Method of inspecting a metal coating and a method for analytical control of a deposition electrolyte serving to deposit said metal coating
    Patent number: 8894835
    Abstract: For fast and secure determination of the quality of a metal coating as well as of an electrolyte for depositing a metal, in particular for electrolytic deposition of nickel such as of semi-gloss nickel and bright nickel and for analytical control of the deposition electrolyte, a method of inspecting a metal coating is provided, which involves the following method steps: a) depositing the metal coating from a deposition electrolyte onto a working electrode; b) electrolytically dissolving the metal coating through anodic polarization of the working electrode with respect to a counter electrode, which is in electrolytic contact with the working electrode; c) recording an electrical dissolution potential at the working electrode over time, said potential occurring during a dissolution of the metal coating; and d) determining a time-averaged vale of the dissolution potential.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: November 25, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Philip Hartmann, Michael Jonat, Mathias Wuensche
  • Electroless palladium plating bath composition
    Patent number: 8888903
    Abstract: The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and/or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and at least one organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: November 18, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Isabel-Roda Hirsekorn, Jens Wegricht, Arnd Kilian
  • Method to form solder deposits on substrates
    Patent number: 8871631
    Abstract: Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate that includes at least one inner contact area, ii) contact the entire substrate area including the at least one inner contact area with a solution suitable to provide a conductive layer on the substrate surface, iii) form a patterned resist layer, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the inner contact area, v) remove the patterned resist layer, vi) form a solder resist layer having solder resist openings on the substrate surface.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: October 28, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Sven Lamprecht, Kai-Jens Matejat, Ingo Ewert, Stephen Kenny
  • CHROME-PLATED PART AND MANUFACTURING METHOD OF THE SAME
    Publication number: 20140284218
    Abstract: An nickel plating layer (5a) intended for corrosion current distribution is formed over a body (2), and a 0.05 to 2.5 micrometers thick surface chrome plating layer (6) made of trivalent chromium is formed on the surface thereof using basic chromium sulfate as a source of metal. Further on the same, a not less than 7 nm thick chromium compound film (7) is formed by cathode acidic electrolytic chromatin. The corrosion distribution nickel plating layer (5a) has a function of forming a microporous structure, a microcrack structure, or the both of the same in the surface chrome plating layer (6).
    Type: Application
    Filed: June 3, 2014
    Publication date: September 25, 2014
    Applicants: NISSAN MOTOR CO., LTD., ATOTECH DEUTSCHLAND GMBH
    Inventors: Soichiro Sugawara, Hiroaki Koyasu, Hiroshi Sakai, Jens-Eric Geissler, Grant Keers
  • Methods of Treating Metal Surfaces and Devices Formed Thereby
    Publication number: 20140261897
    Abstract: Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns.
    Type: Application
    Filed: July 6, 2010
    Publication date: September 18, 2014
    Applicant: Atotech Deutschland GmbH
    Inventors: Jen-Chieh Wei, Zhiming Liu, Steven Z. Shi, Werner G. Kuhr
  • Methods of Treating Metal Surfaces and Devices Formed Thereby
    Publication number: 20140251502
    Abstract: Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns.
    Type: Application
    Filed: May 16, 2014
    Publication date: September 11, 2014
    Applicant: Atotech Deutschland GmbH
    Inventors: Jen-Chieh Wei, Zhiming Liu, Steven Z. Shi, Werner G. Kuhr
  • Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)—group 13 (IIIA)—Group 16 (VIA)
    Patent number: 8828278
    Abstract: The invention relates to electroplating additives for the deposition of a group IB metal/binary or ternary group IB-group IIIA/ternary, quaternary or pentanary group IB-group IIIA-group VIA alloy on substrates useful for thin film solar cells. The additives are thiourea compounds or derivatives which have the general formula (A): wherein X1 and X2 may be the same or different and are selected from the group consisting of arylene and heteroarylene; FG1 and FG2 may be the same or different or are selected from the group consisting of —S(O)2OH, —S(O)OH, —COOH, —P(O)2OH and primary, secondary and tertiary amino groups and salts and esters thereof; R is selected from the group consisting of alkylene, arylene or heteroarylene and n and m are integers from 1 to 5.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: September 9, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Torsten Voss, Jöerg Schulze, Andreas Kirbs, Aylin Machmor, Heiko Brunner, Bernd Fröese, Ulrike Engelhardt
  • Method for improving the adhesion between silver surfaces and resin materials
    Patent number: 8819930
    Abstract: The invention addresses the problem of improving the adhesion between silver surfaces and resin materials, such as epoxy resins and mold materials, used in the production of electronic devices. The invention provides a method for improving the adhesion between a silver surface and a resin material comprising a step of electrolytically treating the silver surface with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the silver surface is the cathode.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: September 2, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Christian Wunderlich, Robert Rüther, Jürgen Barthelmes, Sia-Wing Kok, Nadine Menzel