Abstract: A unit dose package is provided that facilitates the automated picking of the package. The unit dose package includes a plurality of individually packaged unit dose medications separated by perforations. The unit dose package also defines a hole that may be located along at least one perforation, such as at an intersection of at least two perforations, to permit the package to be stored by being suspended by a rod. A robotic dispensing system and method are also provided that facilitate the selective dispensation of unit dose packages having different numbers of individually packaged unit dose medications. The system includes first and second storage locations for storing first and second unit dose packages which have different numbers of individually packaged unit dose medication(s). The system also includes a controller to direct picking of the first or second unit dose packages dependant upon a requested number of individually packaged unit dose medication(s).

Abstract: An apparatus for facilitating cutting of unit dose blisters from a blister card is provided. The apparatus may include a platform, a clamp, a blade and a sensor. The blister card may be positionable on the platform for cutting. The clamp may be positionable to hold a portion of the blister card in contact with the platform for cutting when the clamp is seated. The clamp may be operatively coupled to a guillotine head. The blade may also be operatively coupled to the guillotine head. The guillotine head may be configured to move the blade through a range of motion that intersects a plane of the platform. The sensor may be positioned to detect a seating status of the clamp to enable control of movement of the guillotine head based on the seating status.

Abstract: Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

Abstract: Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

Abstract: Within a storage compartment, closely spaced rows of adjacent stacks are supported on a plurality of parallel sliding rails. A pair of coordinated robots is positioned with one robot on one side of the stacks to push the stacks within a selected row toward the other robot. The pushing robot on one side of the row starts off with a starting stack supported in its support arms. The pushing robot pushes the starting stack into one end of the selected row, causing the row to shift toward the waiting receiving robot, which receives the stack at the opposite end of the row from the starting stack. A series of pushes between the two robots moves a stack containing a desired sample into alignment with an access port in the storage compartment.

Abstract: A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.

Abstract: An executable circuit design is used to generate waveforms, from which behaviors of the circuit are captured. The behaviors and various combinations thereof can then be saved in a database, along with descriptions and other metadata about them, thereby generating a behavioral index of the circuit design code. Behavioral indexing of circuit designs allows a user to maintain an indexed behavior database, track changes in behaviors as the circuit design's executable description evolves, and figure out how the executable description can be reused in different projects. When applied to digital design development, it facilities the current design and verification effort, as well as design reuse down the line.

Abstract: In accordance with one aspect of the exemplary embodiments, a substrate transport apparatus is provided comprising a drive mechanism, a movable arm assembly connected to the drive mechanism, an end effector connected to the arm assembly. A chuck for holding a substrate is mounted on the end effector and having a movable edge gripper with a contact surface and an edge of the substrate may be gripped by actuating the movable edge gripper to engage the substrate with the contact surface. The apparatus further comprising a motion sensor for providing a signal to actuate the movable edge gripper to close and open the moveable edge gripper for capturing and releasing the substrate.

Abstract: A system and process for utilizing probability distribution information about process parameters to quantify the probability of manufacturing process variation for variants of circuit designs in order to more efficiently analyze and simulate the designs.

Abstract: A system, method, apparatus, and computer program product are provided for detecting that an object has been accessed. A system may include a first surface carrying a first signaling tag and a second surface carrying a second signaling tag. The first and second signaling tags may be positioned such that when the second surface is in a first position, the first signaling tag and the second signaling tag are sufficiently proximate to each other such that a coupling between the first signaling tag and the second signaling tag results in a first signal state being emitted by at least one of the signaling tags. When the second surface is transitioned from the first position to a second position, a decoupling between the first signaling tag and the second signaling tag may in a second signal state being emitted by at least one of the signaling tags.

Abstract: Embodiments of the invention may provide a modular conveyor that includes a conveyor frame including an access opening, a plurality of conveyor buckets configured to move along a continuous path within the conveyor frame, and an access station where the contents of a conveyor bucket disposed at the access station may be accessible through the access opening. Each of the plurality of conveyor buckets may be configured to be substantially enclosed by the conveyor frame when not at the access station. The conveyor frame may include at least one channel disposed about a perimeter of the continuous path, where each of the plurality of conveyor buckets include at least one projection configured to engage the at least one channel. The conveyor buckets may be driven along the continuous path by a drive mechanism disposed outside of the conveyor frame.

Abstract: Linear semiconductor handling systems provide more balanced processing capacity using various techniques to provide increased processing capacity to relatively slow processes. This may include use of hexagonal vacuum chambers to provide additional facets for slow process modules, use of circulating process modules to provide more processing capacity at a single facet of a vacuum chamber, or the use of wide process modules having multiple processing sites. This approach may be used, for example, to balance processing capacity in a typical process that includes plasma enhanced chemical vapor deposition steps and bevel etch steps.

Abstract: A tool for separating material layers may include a first arm including a first end and a second end; a second arm including a first end and a second end; a first material contact pad carried by the first arm proximate the first end of the first arm; and a second material contact pad carried by the second arm proximate the first end of the second arm. The second end of the first arm may be joined to the second end of the second arm, and the first material contact pad and the second material contact pad may be movable with respect to one another along two substantially orthogonal axes.

Abstract: A substrate processing system including a housing for housing at least part of a processing device, at least one target affixed to the processing device, the processing device having a first processing device reference point in a known relationship with the at least one target, at least one transmitter located within the housing and configured to transmit an identification signal identifying the at least one transmitter to the at least one target and a controller operably connected to the at least one target and the at least one transmitter, the controller being configured to receive data signals, based on the identification signal, from one of the at least one target and the at least one transmitter and control an operational characteristic of the processing device, based on the data signals.

Abstract: A force transfer apparatus includes a housing, a shaft, a plunger, a retention plate, and a force sensor. The housing defines a cavity and a sidewall with an aperture. The shaft is supported in the cavity for rotation about a first axis that is a longitudinal axis of the shaft. The plunger is disposed in the aperture and has a first and second ends. The first end is operably coupled to the shaft such that the plunger can slide along a second axis that is transverse to the first axis in response to rotation of the shaft. The retention plate is fixed to the sidewall outside of the cavity adjacent to the aperture. The force sensor is disposed between the second end of the plunger and the retention plate. As such, the force sensor can detect the amount of force applied to the plunger by the rotation of the shaft.

Abstract: A semiconductor workpiece processing system including at least one substrate processing tool that has a common housing with a first side having a first substrate holding container interface and a second side having a second substrate holding container interface having a different orientation than the first substrate holding container interface, a first transport section disposed corresponding to the first side of the tool, a second transport section being separate and distinct from the first transport section and interfacing with the first transport section and being configured to transport the substrate holding container between the first transport section and the tool and between the first side and the second side of the tool, the second transport section including at least one overhead gantry disposed above the tool, where the second transfer section is capable of interfacing with at least the second substrate holding container interface.

Abstract: A modular, electrified monorail system upon which at least one motorized trolley assembly may be propelled along. The system may incorporate a plurality of rail assemblies adapted to be coupled adjacent to one another to form a generally continuous track. Each rail assembly may make use of an electrified track adapted to provide an electrical signal from an electrical power source to at least one electrical conductor extending coextensively along the electrified track. A controller may be mounted on the electrified track. The controller may be configured to selectively apply and remove the electrical power from the electrified track to control propulsion of the motorized trolley assembly along the electrified track.

Abstract: A gripper apparatus for removing and replacing objects such as containers or vials in an array of containers has a gripper head which extends downward from a support arm, a planetary gear assembly mounted in the gripper head including at least three planet gears, and at least one gripping grip extending downward from each planet gear and projecting beyond a lower end of the gripper head. A drive motor drives the planetary gear assembly to rotate the planet gears in opposite directions, moving the grips inward and outward along predetermined paths to grip and carry an object and release the object when in a desired location.

Abstract: A substrate processing apparatus having a station for loading and unloading substrates from the apparatus is provided. The station has a loading and unloading aperture, a magazine door drive for opening a substrate magazine by removing a door of a substrate magazine through the loading and unloading aperture, and a substrate magazine transport having a magazine support, the substrate magazine transport being configured to move the substrate magazine horizontally between a first position and a second position. When in the first position the substrate magazine is seated on the magazine support and communicates with the aperture and when moved to the second position the substrate magazine is offset from the first position, where the substrate magazine remains seated on the magazine support during horizontal transfer between the first and second positions and another substrate magazine is capable of being located at the first position in communication with the aperture.

Abstract: Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.