Patents Assigned to Avery Dennison
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Patent number: 12131614Abstract: RFID devices for use in electronic surveillance article (“EAS”) systems may be differently configured, resulting in different performance at the operating frequency or range of frequencies of an EAS system. The performance of differently configured RFID devices may be converged or rendered substantially similar by testing the performance of such RFID devices in a range of frequencies. At least one of the RFID devices is reconfigured to converge the performance of the RFID devices in the range of frequencies if the performance of the RFID devices is not sufficiently similar. This may include changing the configuration of an antenna, an RFID chip, and/or a non-functional component of an RFID device and/or the location in which an RFID device is associated to an article. Differently configured RFID devices may all be manufactured from the same initial configuration, with different RFID devices being differently processed before incorporation in an EAS system.Type: GrantFiled: February 25, 2021Date of Patent: October 29, 2024Assignee: Avery Dennison Retail Information Services LLCInventor: Ian J. Forster
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Publication number: 20240338545Abstract: A method of detection of unauthorized intervention into an identification structure is provided. The method includes configuring the identification structure such that the identification structure interacts with the intervention such as a physical intervention, or mechanical intervention, or electrical intervention. Further, the method involves propagating the intervention along the identification structure in such a control as to cause a detectable alteration in any predetermined attributes associated with the identification structure including a physical attribute, mechanical attribute, electrical attribute, and an optical attribute. Finally, the alteration in the attributes is detected by visual, electrical, or optical assessments or a combination of assessments.Type: ApplicationFiled: September 26, 2022Publication date: October 10, 2024Applicant: AVERY DENNISON RETAIL INFORMATION SERVICES LLCInventors: Mathieu DE BACKER, William TONEY, Renee MICEK, Carol L. CALLAHAN
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Patent number: 12109180Abstract: Compositions and methods to produce adhesive articles with active agents concentrated at the substrate contacting surface. The active agents are applied in powder form, or in combination with a liquid or gel vehicle, to the substrate contacting surface of an adhesive layer of an adhesive article. The active agent compositions are directly applied to the adhesive layer, or are first applied to a release liner, which is then brought into contact with the adhesive layer to dispose the active agent compositions to the substrate contacting surface of the adhesive layer. Upon application of the adhesive article to a substrate, the active agent is delivered to a region of interest on the substrate.Type: GrantFiled: April 25, 2022Date of Patent: October 8, 2024Assignee: Avery Dennison CorporationInventors: Anna Andrews, Rachel Shi, Anne Marie Wibaux, Emily Berlin
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Patent number: 12112222Abstract: A temperature-sensing RFID device includes an RFID chip and an antenna electrically coupled thereto. The RFID chip includes a temperature sensor, while the antenna is adapted to receive energy from an RF field and produce a signal. A shielding structure and/or a thermally conductive or absorbent structure may be associated with the RFID chip. The shielding structure is oriented so as to be positioned between at least a portion of the RFID chip and an outside environment and configured to shield the temperature sensor from at least one environmental factor capable of affecting a temperature sensed by the temperature sensor of an article to which the RFID device is secured. The thermally conductive or absorbent structure is oriented so as to be positioned between at least a portion of the RFID chip and the article and configured to enhance thermal coupling between the temperature sensor and the article.Type: GrantFiled: August 8, 2023Date of Patent: October 8, 2024Assignee: Avery Dennison Retail Information Services LLCInventor: Ian J. Forster
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Patent number: 12112221Abstract: A temperature-sensing RFID device includes an RFID chip and an antenna electrically coupled thereto. The RFID chip includes a temperature sensor, while the antenna is adapted to receive energy from an RF field and produce a signal. A shielding structure and/or a thermally conductive or absorbent structure may be associated with the RFID chip. The shielding structure is oriented so as to be positioned between at least a portion of the RFID chip and an outside environment and configured to shield the temperature sensor from at least one environmental factor capable of affecting a temperature sensed by the temperature sensor of an article to which the RFID device is secured. The thermally conductive or absorbent structure is oriented so as to be positioned between at least a portion of the RFID chip and the article and configured to enhance thermal coupling between the temperature sensor and the article.Type: GrantFiled: August 8, 2023Date of Patent: October 8, 2024Assignee: Avery Dennison Retail Information Services LLCInventor: Ian J. Forster
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Patent number: 12109319Abstract: Adhesives comprising rubber, tackifier, oil, and optionally absorbent and active ingredient are described. The adhesives are suitable for medical applications as they are repositionable on skin. Also described are medical articles using the adhesives.Type: GrantFiled: December 12, 2022Date of Patent: October 8, 2024Assignee: Avery Dennison CorporationInventors: Xianbo Hu, Neal Carty
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Patent number: 12093759Abstract: In some embodiments, a method of manufacturing a radio frequency identification (RFID) tag on a target surface of a non-planar object may be provided. The method may include positioning an antenna on the target surface of the non-planar object, positioning a reactive RFID strap on the target surface, and coupling the reactive RFID strap to the antenna to induce an antenna response.Type: GrantFiled: December 28, 2020Date of Patent: September 17, 2024Assignee: Avery Dennison Retail Information Services LLCInventor: Ian J. Forster
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Patent number: 12086667Abstract: In some embodiments, a radio frequency identification (RFID) device may include a reactive strap may include a conductor enclosing an area and an RFID chip connected to the conductor, the conductor enclosing an area and defining a first opening, and a flexible substrate attached to the conductor and defining a second opening. The first and second openings together may define a passage through both the conductor and the flexible backing material.Type: GrantFiled: December 28, 2020Date of Patent: September 10, 2024Assignee: Avery Dennison Retail Information Services LLCInventor: Ian J. Forster
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Patent number: 12071570Abstract: Provided herein are multilayer tape constructions comprising a damping layer and a bonding layer, wherein the multilayer tape construction effectively dissipates vibrations at low temperatures. The materials and configurations of the layers are selected such that the glass transition temperature of the bonding layer is greater than the glass transition of the damping layer, and the difference between the glass transition temperatures is related to the relative thicknesses of the damping layer and the bonding layer. The multilayer tape constructions may further comprise a carrier layer. Also provided are systems and methods using the disclosed multilayer tape constructions.Type: GrantFiled: November 26, 2019Date of Patent: August 27, 2024Assignee: Avery Dennison CorporationInventors: Mahesh Ganesan, Henry Milliman, Joseph L. Meckler
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Patent number: 12073274Abstract: A method, system, and apparatus for inserting a woven label with integrated radio frequency identification (RFID) capabilities into a garment seam is shown and described. In exemplary embodiments, a woven RFID label is inserted into a garment seam during stitching. For example, the woven RFID label is automatically inserted using an overlock machine adapted to include a guide system. The guide system is configured to insert and encode the RFID tag incorporated in the woven label device during a stitching process.Type: GrantFiled: February 19, 2021Date of Patent: August 27, 2024Assignee: Avery Dennison Retail Information Services LLCInventor: Mathieu De Backer
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Patent number: 12065598Abstract: Compositions which are well suited for forming into machine direction orientation (MDO) films are described. Multilayer films containing one or more layers of the compositions and/or films are also described. Additionally, label assemblies utilizing the multilayer films, labeled substrates, and related methods are described. Various versions of the multilayer films are described including films having at least two skin layers and an interior core layer. Particular multilayer films are described having polyethylene rich cores.Type: GrantFiled: July 28, 2022Date of Patent: August 20, 2024Assignee: Avery Dennison CorporationInventors: Christopher J. Blackwell, Sara E. Porosky
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Patent number: 12065588Abstract: Methods for forming melt processable, actinic radiation polymerizable and crosslinkable adhesives are described. In certain versions, the adhesives or pre-adhesive compositions include two initiators and are polymerized and/or crosslinked by exposure to actinic radiation such as UV light or electron beam radiation. Also described are pre-adhesive compositions including polymerizable monomers, articles including the adhesives, and various methods and systems related to the adhesives and their application. In addition, various apparatuses are described for polymerizing or crosslinking the compositions.Type: GrantFiled: March 23, 2022Date of Patent: August 20, 2024Assignee: Avery Dennison CorporationInventors: Eric L. Bartholomew, William L. Bottorf, Kyle R. Heimbach, Brandon S. Miller, Michael T. Waterman, Michael T. Zajaczkowski, Qiang Luo, Andrew P. Full, Christopher E. Kohler
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Patent number: 12061948Abstract: Some embodiments include a kit for forming a radio frequency container. The kit may include a top panel, a bottom panel having a raised support, at least one side panel configured to connect the top panel and the bottom panel, and an RF antenna configured for attachment to an interior surface of the container. The top panel, the bottom panel, and the at least one side panel may be configured to reflect and contain RF signals within the radio frequency container.Type: GrantFiled: December 12, 2020Date of Patent: August 13, 2024Assignee: Avery Dennison Retail Information Services LLCInventor: Mark Roth
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Patent number: 12060193Abstract: Multilayer laminates are described which include one or more layers or regions of printed images or graphics captured under an outer adhesive layer. The laminates include two layers of a release coating applied to opposite faces of a support layer. Also described are systems and methods for applying wound rolls of the multilayer laminates to a collection of articles.Type: GrantFiled: July 7, 2022Date of Patent: August 13, 2024Assignee: Avery Dennison CorporationInventors: Ronald Wiegers, Di Wu
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Patent number: D1038920Type: GrantFiled: December 19, 2022Date of Patent: August 13, 2024Assignee: Avery Dennison Retail Information Services LLCInventor: Nurasma Husna Binti Mohd Sabri
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Patent number: D1039039Type: GrantFiled: May 9, 2022Date of Patent: August 13, 2024Assignee: Avery Dennison Retail Information Services LLCInventors: John D. Mistyurik, Lee R. Turck
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Patent number: D1046832Type: GrantFiled: April 19, 2023Date of Patent: October 15, 2024Assignee: Avery Dennison Retail Information Services LLCInventor: Shubin Ma
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Patent number: D1046833Type: GrantFiled: May 25, 2023Date of Patent: October 15, 2024Assignee: Avery Dennison Retail Information Services LLCInventor: Antti T. Leskelä
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Patent number: D1046834Type: GrantFiled: May 26, 2023Date of Patent: October 15, 2024Assignee: Avery Dennison Retail Information Services LLCInventor: Shubin Ma
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Patent number: D1046835Type: GrantFiled: July 28, 2023Date of Patent: October 15, 2024Assignee: Avery Dennison Retail Information Security LLCInventor: Antti T. Leskelä