Patents Assigned to Avery Dennison
  • Patent number: 12235475
    Abstract: Provided herein is flexible retroreflective sheeting that includes an emboss layer having retroreflective elements, a backing layer and/or metallized layer in contact with the retroreflective elements, and an interleaf layer sandwiched between two adhesive layers. The tensile and color properties of the layers of the construction allow the sheeting to be particularly useful as a label for articles, e.g., traffic safety devices, subject to crushing or bending. Also provided are methods and articles including the provided sheeting.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: February 25, 2025
    Assignee: Avery Dennison Corporation
    Inventor: Chieh-Wen Chen
  • Patent number: 12229617
    Abstract: A textile RFID transponder (20) has a textile carrier substrate (19) with a flat thread structure (16). At least one electrically conductive antenna thread (17) is introduced into the flat thread structure (16) of the textile carrier substrate (19). An RFID chip module (15) with a chip-bound module antenna (11) is applied to a first side of the textile carrier substrate (19) so that the module antenna (11) is coupled inductively into a transponder antenna (18) formed by the at least one conductive antenna thread (17). At least one hot-melt adhesive yarn (12; 16a; 16b; 16c) is introduced into the flat thread structure (16) of the textile carrier substrate (19).
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: February 18, 2025
    Assignee: Avery Dennison Retail Information Services LLC
    Inventors: Stephan Buhler, Dirk Boltersdorf
  • Patent number: 12187922
    Abstract: Provided herein is a pressure sensitive adhesive (PSA) comprising two different acrylate polymers and a metal chelating agent to produce the PSA. The PSAs produced according to the methods described herein can be used under a broad range of working temperatures, i.e., from ?99° C. to 40° C., e.g., ?40° C. to 37° C. These PSAs demonstrate optimal tack and cohesiveness and/or resistance to warm water bath, when affixed to substrates.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: January 7, 2025
    Assignee: Avery Dennison Corporation
    Inventors: Ke Zhao, Yurun Yang
  • Patent number: 12182651
    Abstract: A system and method for configuring Radio Frequency Identification (RFID) read and write power levels includes an RFID module that generates RF signals, a digital step attenuator that attenuates RF signals, an antenna that transmits attenuated RF signals, and an RF shield that isolates the antenna from an RFID label supply roll. A floor read power is determined by iteratively interrogating an RFID label while decreasing the RF signal power until the label fails to respond to the interrogation. A ceiling read power is determined by iteratively interrogating the RFID label while increasing the RF signal power until multiple labels respond to the interrogation. The read power level is set between the floor read power and the ceiling read power. The write power level is determined by iteratively attempting to program the RFID module while increasing the write power from the read power level until successfully written.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: December 31, 2024
    Assignee: Avery Dennison Retail Information Services LLC
    Inventors: David J. Wimmers, John D. Mistyurik, Scott P. Fowler, Ryan McCoppin
  • Patent number: 12173171
    Abstract: UV-LED ink composition compositions containing a matrix or binder system, one or more colorants, and one or more photo-initiators. In some embodiments, the matrix or binder system is cured using one or more UV-LED sources. In some embodiments, the matrix or binder system contains one or more materials that are polymerized, crosslinked, and/or cured upon exposure to the UV-LED source. This allows the ink composition to be free of any organic solvents. After polymerization and/or crosslinking, the ink is dry. UV-LED ink compositions can be better suited for curing black inks, improve/increase productivity due to its instant on/instant off capability, and produce little or no heat. Such compositions may have environmental benefits as well as the curing process does not produce ozone and requires less exhaust air surrounding the press.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: December 24, 2024
    Assignee: Avery Dennison Corporation
    Inventors: Radha Sen, Michael P. Garlock
  • Patent number: 12173200
    Abstract: A label assembly includes a label print layer with enhanced tensile, tear, and/or stiffness properties. The enhanced property or properties may be achieved by including a reinforcement layer, including a reinforcement material in the adhesive layer, and/or modifying the facestock layer.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: December 24, 2024
    Assignee: Avery Dennison Corporation
    Inventors: Farminder Anand, Lauren Kalb
  • Patent number: 12168740
    Abstract: Hot melt adhesives comprising (i) styrene butadiene copolymer, (ii) olefin block copolymer (OBC), and (iii) water white hydrogenated hydrocarbon resin are described. The adhesives exhibit high optical clarity and are relatively clear over a wide range of temperatures. The adhesives also exhibit good adhesion at cold temperatures. Also described are laminates of the adhesive with polymeric films, such as adhesive labels that can be used in labeling containers. In addition, various goods such as containers labeled using the adhesives are described.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: December 17, 2024
    Assignee: Avery Dennison Corporation
    Inventor: Jarkko T. Pitko
  • Patent number: 12163069
    Abstract: Modification of functional groups along a polymer backbone to render the groups activatable upon exposure to actinic radiation is described. The polymers are typically controlled architecture polymers. Also described are adhesives containing the modified architectured polymers and related methods of use.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: December 10, 2024
    Assignee: Avery Dennison Corporation
    Inventors: Eric L. Bartholomew, William Bottorf, Kyle R. Heimbach, Brandon S. Miller, Michael T. Waterman, Michael Zajaczkowski
  • Patent number: 12162300
    Abstract: Microporous structures in face films are described for improving printability of the films. Also described are laminates and pressure sensitive adhesive laminates including the microporous structured face films. Various related methods are additionally described.
    Type: Grant
    Filed: August 16, 2023
    Date of Patent: December 10, 2024
    Assignee: Avery Dennison Corporation
    Inventors: David Bland, Wen-Li A. Chen, Michael Ramsay, Shanshan Wang
  • Patent number: 12159521
    Abstract: RFID devices are provided for improving the performance of electronic surveillance article systems. The RFID devices may be modified in any of a number of ways to decrease their peak sensitivity and increase their bandwidth, thereby stabilizing their read range. The performance of an RFID device will depend on the nature of the article to which it is associated, such that the nature of the article to which the RFID device is to be associated may be factored into the design of the RFID device to equalize the performance at an operating frequency of RFID devices associated with different articles. By reducing the peak sensitivity and increasing the bandwidth of RFID devices in an electronic article surveillance system, the size of a transition zone between two read zones of the system may be reduced.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: December 3, 2024
    Assignee: Avery Dennison Retail Information Services LLC
    Inventor: Ian J. Forster
  • Patent number: D1054405
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: December 17, 2024
    Assignee: Avery Dennison Retail Information Services LLC
    Inventor: Antti T. Leskelä
  • Patent number: D1055896
    Type: Grant
    Filed: October 10, 2023
    Date of Patent: December 31, 2024
    Assignee: Avery Dennison Retail Information Services LLC
    Inventor: Tero Uusitupa
  • Patent number: D1060319
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: February 4, 2025
    Assignee: Avery Dennison Retail Information Services LLC
    Inventor: Antti T. Leskelä
  • Patent number: D1063900
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: February 25, 2025
    Assignee: Avery Dennison Retail Information Services LLC
    Inventor: Shubin Ma
  • Patent number: D1063902
    Type: Grant
    Filed: September 29, 2023
    Date of Patent: February 25, 2025
    Assignee: Avery Dennison Retail Information Services LLC
    Inventors: Ian J. Forster, Panagiotis Petridis
  • Patent number: D1063903
    Type: Grant
    Filed: October 13, 2023
    Date of Patent: February 25, 2025
    Assignee: Avery Dennison Retail Information Services LLC
    Inventor: Nur Farhanah Binti Hider
  • Patent number: D1063904
    Type: Grant
    Filed: October 13, 2023
    Date of Patent: February 25, 2025
    Assignee: Avery Dennison Retail Information Services LLC
    Inventor: Nur Farhanah Binti Hider
  • Patent number: D1063905
    Type: Grant
    Filed: October 13, 2023
    Date of Patent: February 25, 2025
    Assignee: Avery Dennison Retail Information Services LLC
    Inventor: Nurasma Husna Binti Mohd Sabri
  • Patent number: D1063906
    Type: Grant
    Filed: October 13, 2023
    Date of Patent: February 25, 2025
    Assignee: Avery Dennison Retail Information Services LLC
    Inventor: Nurasma Husna Binti Mohd Sabri
  • Patent number: D1063907
    Type: Grant
    Filed: October 13, 2023
    Date of Patent: February 25, 2025
    Assignee: Avery Dennison Retail Information Services LLC
    Inventor: Nurasma Husna Binti Mohd Sabri