Abstract: A packaging system that is manufactured entirely out of recyclable materials and that allows consumers to view the items, such as food items, within the package container is disclosed. Specifically, the packaging system comprises a package container manufactured entirely out of recyclable materials, and a code identifier component positioned thereon which is linked to an image or other information of the product contained within the package container. The code identifier component is typically a 2D bar code or an RFID tag. Further, the image linked to the code identifier component can be generic, or the actual individual image of the product in the container, and the image can be associated with the product during its manufacture, or when it is packaged. The image can be viewed with a tablet, mobile phone, virtual reality headset, a provided terminal, or other suitable device.

Abstract: Semiconductor wafer devices are formed of a wafer or a portion of a wafer. The wafer or wafer portion includes a plurality of functional blocks, one of which comprises an energy source and another which takes some other form, such as digital logic, data storage, a communication module, a display, a display driver, or a sensor. A functional block may be formed as part of processing of the wafer or may comprise a post-processing element. The functional blocks combine to provide an operational system having a plurality of functions. The wafer may be formed of an amorphous material, allowing the device to have a three-dimensional, non-planar structure, such as a cuboidal or tubular structure. If the device comprises only a portion of a wafer, a plurality of devices may be formed from a single wafer, with each portion being removed from the remainder of the wafer to define a device.

Abstract: A wearable RFID device is disclosed herein. The wearable RFID device is preferably comprised of a band, one or more RFID inlays attached to a backside of said band, and at least one tamper resistant cut or notch in one or more of the band and/or the RFID inlays so that the RFID inlay(s) are rendered inoperable or destroyed when the wearable RFID device is removed from the user. The band is preferably formed by attaching a first and a second end of the band with an adhesive to form an adhesive closure, and the RFID inlay may be positioned on either side of, or extend across, the adhesive closure to suit user preference or other design considerations.

Abstract: An adhesive article includes a polymeric layer, a haptic layer disposed adjacent a first major surface of the polymeric layer, and an adhesive layer disposed adjacent a second major surface of the polymeric layer. The haptic layer includes a predetermined amount of at least one release agent. A method of forming the adhesive article includes providing the polymeric layer, disposing the haptic layer over and directly on the polymeric layer, and disposing the adhesive layer over and directly on the polymeric layer opposite the haptic layer.

Abstract: RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes an antenna defining a gap and configured to operate at a first frequency. An RFID chip is electrically coupled to the antenna across the gap. A shielding structure is electrically coupled to the antenna across the gap and overlays the RFID chip. The shielding structure includes a shield conductor and a shield dielectric at least partially positioned between the shield conductor and the RFID chip. The shielding structure is configured to limit the voltage across the gap when the antenna is exposed to a second frequency that is greater than first frequency. In additional embodiments, RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes an RFID chip and an antenna electrically coupled to the RFID chip.

Abstract: Microporous structures in face films are described for improving printability of the films. Also described are laminates and pressure sensitive adhesive laminates including the microporous structured face films. Various related methods are additionally described.

Abstract: A temperature-sensing RFID device includes an RFID chip and an antenna electrically coupled thereto. The RFID chip includes a temperature sensor, while the antenna is adapted to receive energy from an RF field and produce a signal. A shielding structure and/or a thermally conductive or absorbent structure may be associated with the RFID chip. The shielding structure is oriented so as to be positioned between at least a portion of the RFID chip and an outside environment and configured to shield the temperature sensor from at least one environmental factor capable of affecting a temperature sensed by the temperature sensor of an article to which the RFID device is secured. The thermally conductive or absorbent structure is oriented so as to be positioned between at least a portion of the RFID chip and the article and configured to enhance thermal coupling between the temperature sensor and the article.

Abstract: A high-field emission tolerant RFID tag device that may be secured to a product to be cooked, heated, reheated and/or thawed in a heating apparatus such as, but not limited to, a microwave oven and that does not need to be removed from the product before initiating the heating process. The RFID device is microwave safe and does not damage the product or food item to which it is attached during the microwave process, and may contain data to control the microwave process. The microwave safe RFID tag comprises a split ring (or shield) conductor formed on one side of a substrate (or dielectric), a coil antenna conductor formed on an opposite side of the substrate, and a RFID chip. The split ring conductor capacitively couples to the coil antenna conductor via the dielectric and a gap in the split ring conductor prevents arcing.

Abstract: Systems and methods are provided for assembling an RFID device mounted to a fabric substrate via a “flip chip” approach. The system includes a pin thermode with a tip configured to penetrate the fabric substrate. The pin thermode may include or omit a heating element, with the tip being variously configured. The tip may have a variable cross-sectional area or include a plurality of projections that separately penetrate the fabric substrate, for example. If the pin thermode includes a heating element, a body of the pin thermode may be formed of a low thermal conductivity material to allow the temperature of the tip to increase without increasing the temperature of the body to the same degree. The body may define a lumen, with the tip and/or body defining an aperture for flowing a liquid out of the pin thermode and into the region surrounding the pin thermode.

Abstract: Systems and methods of using ultrasonic welding to form labels with RFID tags are disclosed. The methods can be useful for the production of a large volume of labels such as production with roll-to-roll processing. The labels can be useful for consumer products such as garments. The present invention discloses in one embodiment, a label having a first and second printed fabric label layer such that a radio frequency identification (RFID) inlay is disposed between the two printed fabric layers.

Abstract: RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes a substrate having opposing first and second surfaces. An antenna is secured to the first surface, with the antenna defining a gap and being configured to operate at a first frequency. An RFID chip is electrically coupled to the antenna across the gap. A shielding structure is secured to the second surface of the substrate, with at least a portion of the shielding structure being in substantial alignment with the gap. The shielding structure is configured to limit the voltage across the gap when the antenna is exposed to a second frequency that is greater than first frequency. Also provided are methods for manufacturing RFID tags from a web in which conductive layers are secured to opposing surfaces of a substrate.

Abstract: Identification labels and their incorporation in rubber-based articles are described. The labels include RFID components and can be incorporated in tires. The labels can withstand the relatively harsh conditions associated with vulcanization.

Abstract: A labeling apparatus comprises a separation member configured to promote detachment of an adhesive label from liner web. Adhesive labels are fed to the separation member such that a surface of the facestock contacts the separation member. The separation member has a surface exhibiting a tack such that the tack force between the facestock and the separation member is greater than the release force between the release liner and the adhesive layer of the labels. The labels become associated with the separation member, and the label is applied to a surface of a substrate by contacting the exposed adhesive layer with a surface of a substrate, which causes the adhesive label to detach from the separation member.