Abstract: An inter-stage test structure for a wireless communication apparatus is provided. The wireless communication apparatus has a unit under test (UUT) and a next-stage component connected to the UUT through a signal wire. The inter-stage test structure is disposed on the signal wire and electrically connects the UUT to the next-stage unit component. The inter-stage test structure includes an upper board, a lower board, and an intermediate layer. The intermediate layer is disposed between the upper board and the lower board. The intermediate layer includes a first region and a second region defined thereon. The first region has an air cavity for generating an air impedance. The second region has an impedance adjusting cavity for generating an adjustable impedance. Accordingly, the inter-stage test structure can detect the condition of the UUT of the wireless communication apparatus based on the air impedance and the adjustable impedance.

Abstract: A module IC package structure includes a substrate unit, an electronic unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate and a grounding layer disposed inside the circuit substrate. The grounding layer is exposed from the outer surrounding peripheral surface of the circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate. The electronic components are electrically connected to the grounding layer through the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate to enclose the electronic components. The shielding unit includes a metal shielding layer disposed on the outer surface of the package gel body and the surrounding peripheral surface of the circuit substrate. The metal shielding layer directly contacts the grounding layer, thus the electronic components are electrically connected to the metal shielding layer through the grounding layer.

Abstract: A module IC package structure includes a substrate unit, an electronic unit, a package unit and a shielding unit. The substrate unit including a circuit substrate, a grounding layer disposed inside the circuit substrate, and an outer conductive structure disposed on the outer surrounding peripheral surface of the circuit substrate. The outer conductive structure includes a plurality of outer conductive layers. The grounding layer is exposed from the circuit substrate for directly contacting the outer conductive layers. The electronic unit includes a plurality of electronic components disposed on the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate to enclose the electronic components. The shielding unit includes a metal shielding layer enclosing the package gel body and directly contacting the outer conductive structure. Whereby, the grounding layer is electrically connected to the metal shielding layer through the outer conductive structure directly.

Abstract: A module IC package structure includes a substrate unit, an electronic unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate and a grounding layer disposed inside the circuit substrate. The grounding layer is exposed from the outer surrounding peripheral surface of the circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate. The electronic components are electrically connected to the grounding layer through the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate to enclose the electronic components. The shielding unit includes a metal shielding layer disposed on the outer surface of the package gel body and the surrounding peripheral surface of the circuit substrate. The metal shielding layer directly contacts the grounding layer, thus the electronic components are electrically connected to the metal shielding layer through the grounding layer.

Abstract: A module IC package structure for increasing heat-dissipating efficiency includes a substrate unit, an electronic unit, a package unit, a first heat-dissipating unit and a second heat-dissipating unit. The substrate unit includes a circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate for enclosing the electronic components. The first heat-dissipating unit includes a heat-dissipating base layer disposed on the top surface of the package gel body. The second heat-dissipating unit includes a plurality of heat-dissipating auxiliary layers disposed on the top surface of the heat-dissipating base layer. Whereby, the heat-dissipating efficiency of the module IC package structure can be increased by matching the heat-dissipating base layer and the heat-dissipating auxiliary layers.

Abstract: A wireless camera apparatus includes a power supply track and a wireless camera device detachably installed on the power supply track. The wireless camera device has a camera module and a linking module fixed on the camera module. The linking module has a connecting unit and a conductive unit electrically connected to the camera module. When the wireless camera device is installed on the power supply track, the connecting unit is coupled to the power supply track, and the conductive unit is electrically connected to the power supply track. Thus, the instant disclosure provides the wireless camera apparatus, which is adjustable to any position of the power supply track according to the user's demand. Besides, the instant disclosure further provides a wireless camera device.

Abstract: The present disclosure relates to an audiovisual apparatus, which includes an audiovisual capturing unit, an audiovisual broadcast unit, and a transmission cable module. The two ends of the transmission cable module are respectively connected to the audiovisual capturing unit and the audiovisual broadcast unit. The transmission cable module has a video cable group for transmitting video signals and an audio cable group for transmitting audio signals suitable for reducing echo. The audio cable group includes a cable for providing a digital clock for the audio signal, a cable for providing a clock for the left right channel switching audio signal, a cable for inputting serial audio signal, and a cable for outputting serial audio signal. With this arrangement, the audio signals captured by the audiovisual capturing unit and transmitted by the transmission cable module to the audiovisual broadcast unit can be effectively removed of echo.

Abstract: A sensor package structure includes a sensing die, a light-filtering sheet, and an annular pressure-sensitive adhesive sheet. An active surface of the sensing die has a sensing region and a connecting region around the sensing region. The periphery contour of sensing die is greater than or equal to the periphery contour of light-filtering sheet. The pressure-sensitive adhesive sheet has two opposite adhesive surfaces and defines an opening. The adhesive surfaces respectively adhere to the connecting region of the sensing die and the inner surface of the light-filtering sheet, and the sensing region faces the inner surface of the light-filtering sheet via the opening. The sensing region is sealed by the pressure-sensitive adhesive sheet and the light-filtering sheet. Thus, the instant disclosure provides the sensor package structure with low cost, high capacity, and high yield. Moreover, the instant disclosure provides a production apparatus for manufacturing the sensor package structure.

Abstract: A wireless camera apparatus includes a power supply track and a wireless camera device detachably installed on the power supply track. The wireless camera device has a camera module and a linking module fixed on the camera module. The linking module has a connecting unit and a conductive unit electrically connected to the camera module. When the wireless camera device is installed on the power supply track, the connecting unit is coupled to the power supply track, and the conductive unit is electrically connected to the power supply track. Thus, the instant disclosure provides the wireless camera apparatus, which is adjustable to any position of the power supply track according to the user's demand. Besides, the instant disclosure further provides a wireless camera device.

Abstract: An image sensing module includes an image sensing unit, a light transmitting unit, a substrate unit and lens unit. The image sensing unit includes an image sensing element having an image sensing area on the top side of the image sensing element. The light transmitting unit includes a light transmitting element supported above the image sensing element by a plurality of support members. The substrate unit includes a flexible substrate disposed on the image sensing element and electrically connected to the image sensing element through a plurality of electrical conductors, and the flexible substrate has at least one through opening for receiving the light transmitting element. The lens unit includes an opaque holder disposed on the flexible substrate to cover the light transmitting element and a lens assembly connected to the opaque holder and disposed above the light transmitting element.

Abstract: The bulb socket comprises a main body, a lighting module, and an adapter cover. The main body has a head portion and a carrying portion arranged on two opposite end portions thereof. The lighting module is fixed on the carrying portion of the main body and electrically connecting to the head portion. The adapter cover module has a translucent cover and a power supply. The translucent cover is disposed on the carrying portion of the main body for allowing light generated from the lighting module to go through the translucent cover. The translucent cover has a receiving compartment. The power supply unit is disposed on the receiving compartment and electrically connecting to the head portion. Thus, the bulb socket of the instant disclosure can be used for being inserted by an electronic device.

Abstract: The bulb socket comprises a main body, a lighting module, and an adapter cover. The main body has a head portion and a carrying portion arranged on two opposite end portions thereof. The lighting module is fixed on the carrying portion of the main body and electrically connecting to the head portion. The adapter cover module has a translucent cover and a power supply. The translucent cover is disposed on the carrying portion of the main body for allowing light generated from the lighting module to go through the translucent cover. The translucent cover has a receiving compartment. The power supply unit is disposed on the receiving compartment and electrically connecting to the head portion. Thus, the bulb socket of the instant disclosure can be used for being inserted by an electronic device.

Abstract: A thin-type collapsible foot stand includes a base unit, a first rotatable unit and a second rotatable unit. The base unit includes a base body having a first pivot portion, a first connection portion and a first extending portion. The first rotatable unit includes a rotatable platform having a second pivot portion corresponding to the first extending portion, a second connection portion corresponding to the first connection portion, and a second extending portion corresponding to the first pivot portion. The second rotatable unit includes two rotatable support frames. Each rotatable support frame includes a support body disposed between the base body and the rotatable platform, a first pivot structure connected between one end portion of the support body and the first pivot portion, and a second pivot structure connected between the other end portion of the support body and the second pivot portion.

Abstract: A filtering apparatus and method for dual-band sensing circuit are disclosed. The invention features a dual-band sensing unit disposed in a filtering device that receives the signals from a sub-system with variable frequency spectrum. The signals are split up into several bands. After that, one or more frequency detecting units are used to detect the power of high-band and low-band signals, and convert the power into a voltage signal. Users can externally adjust the gain of a tunable gain amplifier for the voltage signal. Further, a comparison operation is processed by a comparator, and a signal resulted from the comparison operation is used to control the switch timing for an RF switching unit. Consequently, this like adaptive notch filter is achieved to determine the intensity of noise and thereby to turn on the high-band or low-band notch filters, so as to reduce the in-band loss.

Abstract: The present invention discloses an interactive projection system including a pointing device and a projector. The pointing device is used to generate a light spot. The projector includes a projecting module, an image capturing module, and a processing module, and the projector includes a built-in operating system. The operating system includes a plurality of applications with graphical user interfaces. The projecting module projects a projected image being present of the operating system onto a screen. The image capturing module captures an image generated by projecting the light spot onto the screen. The processing module calculates a coordinate of the light spot according to the above-mentioned image, and determines whether the light spot has stayed on the graphical user interface associated with one of the applications on the projection screen, so as to execute the application corresponding to the light spot.

Abstract: A substrate module having an embedded phase-locked loop is cooperated with at least one function unit mounted thereon for forming an integrated system. The substrate module includes a base, a multi-layer structure, a built-in circuit unit, and an external circuit unit. The built-in circuit unit is integrated inside the multi-layer structure and the multi-layer structure is formed in the base. The external circuit unit is mounted on the upper surface of the base and is electrically coupled to the built-in circuit unit for jointly forming a phase-locked loop, so as to cooperate with the function unit.

Abstract: A projection device for increasing light-transmitting efficiency includes a light-emitting unit, a light-guiding unit, an image display module and an image projection unit. The light-emitting unit includes a first light-emitting module for generating a first predetermined light source, a second light-emitting module for generating a second predetermined light source, and a third light-emitting module for generating a third predetermined light source. The light-guiding unit includes at least one photonic crystal fiber structure having a first light input terminal for receiving the first predetermined light source, a second light input terminal for receiving the second predetermined light source, a third light input terminal for receiving the third predetermined light source, and a light output terminal. The image display module is corresponding and adjacent to the light output terminal. The image projection unit includes at least one projection lens corresponding and adjacent to the image display module.

Abstract: The present disclosure relates to an audiovisual apparatus, which includes an audiovisual capturing unit, an audiovisual broadcast unit, and a transmission cable module. The two ends of the transmission cable module are respectively connected to the audiovisual capturing unit and the audiovisual broadcast unit. The transmission cable module has a video cable group for transmitting video signals and an audio cable group for transmitting audio signals suitable for reducing echo. The audio cable group includes a cable for providing a digital clock for the audio signal, a cable for providing a clock for the left right channel switching audio signal, a cable for inputting serial audio signal, and a cable for outputting serial audio signal. With this arrangement, the audio signals captured by the audiovisual capturing unit and transmitted by the transmission cable module to the audiovisual broadcast unit can be effectively removed of echo.

Abstract: The instant disclosure relates to a lens structure, which includes a mounting seat, a sliding carriage, a lens cover, and at least one elastic member, wherein the mounting seat has a first through-hole formed thereon and defines two operating positions, the sliding carriage slidably coupled to the mounting seat and having a second through-hole formed thereon, wherein the second through-hole corresponds to the first through-hole in one operating position, the lens cover arranged on the sliding carriage and having a plurality of heat-dissipating holes formed thereon in correspondence with the second through-hole, one end of the elastic member fixed to the mounting seat, and the other end of the elastic member fixed to the sliding carriage, wherein the sliding carriage is urged to move a predetermined distance form one operating position, the elastic member provides resilient force to drive the sliding carriage to another operating position.

Abstract: An image-capturing module for simplifying optical component includes a first substrate unit, an image-capturing unit, an optical imaging unit, a second substrate unit, a light-emitting unit and a cover unit. The second substrate unit is disposed on the outer surface of the optical imaging unit and electrically connected to the first substrate unit. The light-emitting unit has a light-emitting element electrically disposed on the second substrate unit. The cover unit has a reflective layer formed on an inner surface thereof. Therefore, the light beams generated by the light-emitting element are reflected by the reflective layer to form first reflected light beams projected onto the object, then the first reflected light beams are reflected by the object to form second reflected light beams projected onto the optical imaging unit, and then the second reflected light beams pass through the optical imaging unit and project onto the image-capturing unit.