Abstract: An image-sensing module for reducing its whole thickness includes a substrate unit, a carrier unit, an image-sensing unit and a lens unit. The substrate unit includes a substrate body and a through opening passing through the substrate body. The carrier unit includes a carrier body disposed on the bottom surface of the substrate body and corresponding to the through opening. The image-sensing unit includes an image-sensing element disposed on the top surface of the carrier body and embedded in the through opening. The lens unit includes an opaque frame disposed on the top surface of the carrier body to surround the image-sensing element and a lens connected to the opaque frame and positioned above the image-sensing element. Hence, the whole thickness of the image-sensing module can be reduced due to the design of placing the substrate body, the image-sensing element and the opaque frame on the carrier body.

Abstract: The instant disclosure relates to a lens structure, which includes a mounting seat, a sliding carriage, a lens cover, and at least one elastic member, wherein the mounting seat has a first through-hole formed thereon and defines two operating positions, the sliding carriage slidably coupled to the mounting seat and having a second through-hole formed thereon, wherein the second through-hole corresponds to the first through-hole in one operating position, the lens cover arranged on the sliding carriage and having a plurality of heat-dissipating holes formed thereon in correspondence with the second through-hole, one end of the elastic member fixed to the mounting seat, and the other end of the elastic member fixed to the sliding carriage, wherein the sliding carriage is urged to move a predetermined distance form one operating position, the elastic member provides resilient force to drive the sliding carriage to another operating position.

Abstract: A thin-type collapsible foot stand includes a base unit, a first rotatable unit and a second rotatable unit. The base unit includes a base body having a first pivot portion, a first connection portion and a first extending portion. The first rotatable unit includes a rotatable platform having a second pivot portion corresponding to the first extending portion, a second connection portion corresponding to the first connection portion, and a second extending portion corresponding to the first pivot portion. The second rotatable unit includes two rotatable support frames. Each rotatable support frame includes a support body disposed between the base body and the rotatable platform, a first pivot structure connected between one end portion of the support body and the first pivot portion, and a second pivot structure connected between the other end portion of the support body and the second pivot portion.

Abstract: An image-sensing module includes a substrate unit, a light-transmitting unit, an image-sensing unit and a lens unit. The substrate unit includes at least one flexible substrate having at least one through opening. The light-transmitting unit includes at least one light-transmitting element disposed on the top surface of the flexible substrate and corresponding to the through opening. The image-sensing unit includes at least one image-sensing element disposed on the bottom surface of the light-transmitting element and embedded in the through opening, and the image-sensing element is electrically connected to the flexible substrate. The lens unit includes an opaque frame disposed on the top surface of the flexible substrate to surround the light-transmitting element and a lens positioned on the opaque frame to correspond to the light-transmitting element.

Abstract: This instant disclosure provides a power socket with wireless communication capability including a case, a power input unit, a power output unit, a switch, and a wireless communication module. The power input unit is used for electrically coupling to a power source. The power output unit is used to output an electrical power of the power source. The switch is electrically coupled between the power input unit and the power output unit for controlling whether the power output unit outputs the electrical power of the power source. The wireless communication module is electrically coupled to the power input unit and the switch for wireless receiving a control signal. The wireless communication module controls the switch according to the control signal. Therefore, the power socket outputs or not outputs the electrical power of the power source to an electrical device according to the control signal.

Abstract: A vertical stacked light emitting structure includes a substrate unit, a stacked type light emitting module, and a flip-chip type light emitting module. The substrate unit includes a substrate body. The stacked type light emitting module includes a first light emitting unit and a light guiding unit. The first light emitting unit includes at least one first LED bare chip disposed on and electrically connected to the substrate body, and the light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The flip-chip type light emitting module includes a second light emitting unit. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Hence, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially.

Abstract: A vertical stacked light emitting structure includes a substrate unit, a first light emitting unit, a light guiding unit, and a second light emitting unit. The substrate unit includes at least one substrate body. The first light emitting unit includes at least one first LED bare chip disposed on the substrate body and electrically connected to the substrate body. The light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Therefore, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially.

Abstract: An optical touch control module for providing at least one sensing area includes: a light-reflecting unit, a first light-sensing unit and a second light-sensing unit. The light-reflecting unit includes a light-reflecting element for partially surrounding the at least one sensing area. The first light-sensing unit is disposed beside one edge of the at least one sensing area and adjacent to one end of the light-reflecting element. The first light-sensing unit includes at least one first light-emitting element, at least one first light-detecting element, and at least one first oscillating reflecting element oscillating depending on time. The second light-sensing unit is disposed beside another edge of the at least one sensing area and adjacent to another end of the light-reflecting element. The second light-sensing unit includes at least one second light-emitting element, at least one second light-detecting element, and at least one lens element.

Abstract: An optical touch control module for providing at least one sensing area includes: a light-reflecting unit, a first light-sensing unit and a second light-sensing unit. The light-reflecting unit includes a light-reflecting element for partially surrounding the sensing area. The first light-sensing unit is disposed beside one edge of the at least one sensing area and adjacent to one end of the light-reflecting element. The first light-sensing unit includes at least one first light-emitting element, at least one first light-detecting element, and at least one first oscillating reflecting element oscillating depending on time. The second light-sensing unit is disposed beside another edge of the at least one sensing area and adjacent to another end of the light-reflecting element. The second light-sensing unit includes at least one second light-emitting element, at least one second light-detecting element, and at least one second oscillating reflecting element oscillating depending on time.

Abstract: This invention provides a system of testing multiple RF modules. The system includes a RF signal analyzer, a RF switch, a control module, and a plurality of testing modules. The RF switch is electrically coupled to the RF signal analyzer, and operational bands of the RF switch includes operational bands of the RF modules for transmitting and receiving RF signals. The controller module controls the RF signal analyzer and the RF switch. The testing modules are electrically coupled to the controller module and controlled by the controller module. Each testing module has a memorizing unit for storing testing results for the RF modules transmitting and receiving the RF signals. The RF switch and the testing modules are used to electrically couple each RF module.

Abstract: A module IC package structure having a metal shielding function includes a substrate unit, an electronic unit, a shielding unit, and an insulative unit. The substrate unit includes a substrate body and at least one grounding pad disposed on the substrate body. The electronic unit includes at least one electronic module disposed on the circuit substrate and electrically connected to the circuit substrate. The shielding unit includes a metal shielding layer formed on an external surface of the at least one electronic module, and the metal shielding layer contacts the at least one grounding pad. The insulative unit includes an insulative layer formed on an external surface of the metal shielding layer. Hence, the module IC package structure can be used to prevent electrical malfunction induced by short-circuit due to the design of forming the insulative layer formed on the external surface of the metal shielding layer.

Abstract: An image-capturing module for simplifying optical component and reducing assembly time includes a substrate unit, an image-capturing unit, a cover unit, a light-emitting unit and an optical imaging unit. The image-capturing unit has at least one image-capturing element electrically disposed on the substrate unit. The cover unit has at least one cover element disposed on the substrate unit and covering the image-capturing element, and the cover element has an opening for exposing the image-capturing element. The light-emitting unit has at least one light-emitting element electrically disposed on the substrate unit. The optical imaging unit has a light-guiding element disposed on the cover element for receiving light beams generated by the light-emitting element and an imaging element connected with the light-guiding element and disposed in the opening of the covering element. The light-guiding element and the imaging element are integrated with each other to form one piece.

Abstract: A vertical stacked light emitting structure includes a substrate unit, a first light emitting unit, a light guiding unit, and a second light emitting unit. The substrate unit includes at least one substrate body. The first light emitting unit includes at least one first LED bare chip disposed on the substrate body and electrically connected to the substrate body. The light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Therefore, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially.

Abstract: A vertical stacked light emitting structure includes a substrate unit, a stacked type light emitting module, and a flip-chip type light emitting module. The substrate unit includes a substrate body. The stacked type light emitting module includes a first light emitting unit and a light guiding unit. The first light emitting unit includes at least one first LED bare chip disposed on and electrically connected to the substrate body, and the light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The flip-chip type light emitting module includes a second light emitting unit. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Hence, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially.

Abstract: A docking station includes a casing, a socket and a plurality of peripheral interface devices. The casing includes a base and a cover, wherein the cover is pivotingly disposed on the base, openably and coverably, to form an appearance of a notebook computer. The socket is formed in a surface of the base for receiving a mobile communication device, and a high speed transmission interface is formed in a bottom of the socket. The plurality of peripheral interface devices is disposed on the casing and electrically connected with the high speed transmission interface. When the mobile communication device is placed in the socket, the mobile communication device is electrically connected with the high speed transmission interface and transmits signals with the plurality of peripheral interface devices. Basing on the structure, the present invention can ensure that mobile communication devices are convenient for operation.

Abstract: An image-capturing module for simplifying optical component includes a first substrate unit, an image-capturing unit, an optical imaging unit, a second substrate unit, a light-emitting unit and a cover unit. The second substrate unit is disposed on the outer surface of the optical imaging unit and electrically connected to the first substrate unit. The light-emitting unit has a light-emitting element electrically disposed on the second substrate unit. The cover unit has a reflective layer formed on an inner surface thereof. Therefore, the light beams generated by the light-emitting element are reflected by the reflective layer to form first reflected light beams projected onto the object, then the first reflected light beams are reflected by the object to form second reflected light beams projected onto the optical imaging unit, and then the second reflected light beams pass through the optical imaging unit and project onto the image-capturing unit.

Abstract: A module IC package structure includes a substrate unit, a radio frequency unit, an inner shielding unit, an insulative package unit, and an outer shielding unit. The substrate unit includes a circuit substrate. The radio frequency unit includes at least one radio frequency element disposed on and electrically connected to the circuit substrate. The inner shielding unit includes an inner metal shielding layer formed on a predetermined surface of the radio frequency element. The insulative package unit includes an insulative package resin body disposed on the circuit substrate to cover the radio frequency element. The outer shielding unit is formed on the outer surface of the insulative package resin body and electrically connected to the circuit substrate. The inner metal shielding layer is a radio frequency property maintaining layer disposed between the radio frequency element and one part of the outer shielding unit for shielding the radio frequency element.

Abstract: A through-hole structure for a wafer level packaging includes a wafer, a RF passage penetrating through the wafer, and a through-hole structure disposed around the RF passage. The through-hole structure has three types of structure. The through hole structure includes a plurality of holes filled with metal material thereinside. On the other hand, the through hole structure can be a plurality of holes coated with a metal layer on the internal surface thereof. Alternatively, the through hole structure has both of the two above hole structure. Depending on the structure, the through hole structure performs an electric reference for preventing the RF signal from decay or interference.

Abstract: A module IC package structure with electrical shield function includes a substrate unit, an electronic unit, a conductive unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having at least one grounding pad. The electronic unit includes a plurality of electronic elements electrically connected to the circuit substrate. The conductive unit includes at least one conductive element disposed on the circuit substrate, and the conductive element has a first end portion electrically connected to the grounding pad. The package unit includes a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the conductive element, and the conductive element has a second end portion is exposed from the package resin body. The shielding unit includes a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion.

Abstract: A module IC package structure includes a substrate unit, an electronic unit, a conductive unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having at least one grounding pad. The electronic unit includes a plurality of electronic elements electrically connected to the circuit substrate. The conductive unit includes at least one elastic conductive element disposed on the circuit substrate, and the elastic conductive element has a first end portion electrically connected to the grounding pad. The package unit includes a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the elastic conductive element, and the elastic conductive element has a second end portion is exposed from the package resin body. The shielding unit includes a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion.