Abstract: A flexible thin image-sensing module with anti-EMI function includes a flexible substrate unit, an electronic element unit, an anti-EMI unit, and a conductive structure. The electronic element unit has a plurality of electronic elements disposed on a top surface of the flexible substrate unit, and the electronic elements at least include an image sensor, a low dropout regulator and a backend IC. The anti-EMI unit is disposed on a bottom surface of the flexible substrate unit. The conductive structure passes through the flexible substrate unit and is electrically connected between the electronic element unit and the anti-EMI unit in order to guide electromagnetic waves generated by the electronic element unit to the anti-EMI unit.

Abstract: A signal matching module for a single or multiple subsystems is disclosed. The signal matching module includes a plurality of electronic components with a first part of the electronic components categorized into external electronic components and a second part of the electronic components categorized into internal components. Each of the electronic components may correspond to a switch that is controllable by a corresponding control pin. And the external electronic components may be used to compensate the internal electronic components when the latter fail to cause the impedance to reach the desired level. One of the embodiments is to provide a unit cell which is used to connect with one or multiple subsystems, and an external communication port to which the external electronic components are connected serving as a feeding point for the purpose of better impedance matching.

Abstract: An integrated circuit module with temperature compensation crystal oscillator (TCXO) applying to an electronic device comprises: one substrate having one top surface; one temperature compensation crystal oscillator (TCXO) disposed on the top surface; at least one chip disposed on the top surface; one encapsulating piece formed on the top surface for covering the TCXO and the chip. As above-described structure, TCXO is prevented from exchanging heat due to the temperature difference so that the stability of the TCXO is improved.

Abstract: An image-sensing module for reducing its overall thickness and preventing electromagnetic interference (EMI) includes a flexible substrate, an image sensor, and a plurality of electronic elements. The flexible substrate has a first PCB (Printed Circuit Board), a flexible bending board bent upwards from one side of the first PCB, and a second PCB extending forwards from the flexible bending board and disposed above the first PCB. The second PCB has at least one first opening. The image sensor is electrically disposed on the first PCB, and the image sensor is exposed by the first opening of the second PCB. The electronic elements are selectively electrically disposed on the first PCB and/or on the second PCB so that the electronic elements are disposed between the first PCB and the second PCB.

Abstract: An LED package structure for increasing light-emitting efficiency includes a heat-dissipating unit, an insulating unit, a light-emitting unit and a conductive unit. The heat-dissipating unit has a heat-dissipating substrate. The insulating unit has an insulating layer formed on the heat-dissipating substrate and at least one receiving groove passing through the insulating layer and formed above the heat-dissipating substrate. The insulating layer has a top surface on a top side thereof and an inner surface, and the inner surface of the insulating layer is an annular inclined surface in the receiving groove. The light-emitting unit has at least one light-emitting element received in the receiving groove and disposed on the heat-dissipating substrate.

Abstract: An image-capturing module for simplifying optical component and reducing assembly time includes a substrate unit, an image-capturing unit, a cover unit, a light-emitting unit and an optical imaging unit. The image-capturing unit has at least one image-capturing element electrically disposed on the substrate unit. The cover unit has at least one cover element disposed on the substrate unit and covering the image-capturing element, and the cover element has an opening for exposing the image-capturing element. The light-emitting unit has at least one light-emitting element electrically disposed on the substrate unit. The optical imaging unit has a light-guiding element disposed on the cover element for receiving light beams generated by the light-emitting element and an imaging element connected with the light-guiding element and disposed in the opening of the covering element. The light-guiding element and the imaging element are integrated with each other to form one piece.

Abstract: An image-sensing chip package module for reducing its whole thickness can fix an image-sensing unit under a substrate unit via an adhesive body disposed between the substrate unit and the image-sensing unit, so that the image-sensing unit can be firmly fixed under a bottom area (the bottom area is a receiving space formed by using a plurality of first conductive protruding bodies to support the substrate unit up relative to a main PCB) of the substrate unit. In other words, the image-sensing unit is received in the receiving space formed by using the first conductive protruding bodies to support the substrate unit up relative to the main PCB, so that the whole thickness of the image-sensing chip package module can be reduced. Therefore, it is easy for designer to integrate the image-sensing chip package module into any portable electronic devices such as mobile phone or notebook.

Abstract: An LED package structure for increasing light-emitting efficiency includes a heat-dissipating unit, an insulating unit, a light-emitting unit and a conductive unit. The heat-dissipating unit has a heat-dissipating substrate. The insulating unit has an insulating layer formed on the heat-dissipating substrate and at least one receiving groove passing through the insulating layer and formed above the heat-dissipating substrate. The insulating layer has a top surface on a top side thereof and an inner surface, and the inner surface of the insulating layer is an annular inclined surface in the receiving groove. The light-emitting unit has at least one light-emitting element received in the receiving groove and disposed on the heat-dissipating substrate.

Abstract: An automatic wireless network linking method with a security configuration includes: providing an access point with a floating service set identifier and a shared key. The floating service set identifier has a prefix name. Next, a host system is provided to execute a setting and linking application to automatically scan the access point with the prefix name and obtain the floating service set identifier of the access point. Both the access point and the setting and linking application perform an operation process to generate a dynamic key. The dynamic key is converted into a wireless network encryption algorithm. Finally, the host system links to the access point to perform wireless communication, and uses the wireless network encryption algorithm to encrypt and decrypt data. Thereby, the time required for setting up the wireless network platform is reduced.

Abstract: A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.

Abstract: A communication module with dual systems for processing a first RF signal and a second RF signal that belong to different communication systems is provided. The communication module includes a first connection port and a signal distribution circuit. The first connection port is coupled to an external circuit, and the signal distribution circuit is coupled to the first connection port and between a first system path and a second system path inside the communication module. Regardless whether the external circuit is composed by an dual-band antenna or two uni-band antenna, the signal distribution circuit controls the first RF signal transmitting along the path between the first connection port and the first system path and controls the second RF signal transmitting along the path between the path between the first connection port and the second system path.

Abstract: A wireless receiving and transmitting device includes a casing unit, an antenna unit, a substrate unit, a projection unit and an electrical connector unit. The casing unit has a casing. The antenna unit has an antenna module fixed in the casing. The substrate unit has a circuit substrate movably disposed in the casing and electrically connected to the antenna module. The projection unit has a projection element positioned on one end of the circuit substrate. The projection element has a bottom portion selectively exposed outside the casing or hidden in the casing according to the move of the circuit substrate, and the projection element has a top portion always exposed outside the casing. The electrical connector unit has an electrical connector position on another end of the circuit substrate, and the electrical connector is selectively exposed outside the casing or hidden in the casing.

Abstract: A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.

Abstract: A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.

Abstract: A parallel testing system with shared golden calibration table includes: a storage unit, multiple testing platforms, and a server. The storage unit is used for storing the golden calibration table, and the testing platforms are used to test a device under test (DUT) respectively by utilizing the golden calibration table. The server is connected to the storage unit and the testing platforms to send the golden calibration table to the testing platforms, and then, to cumulatively record calibration data produced after the testing platforms respectively test the DUTs, so that the server can further perform a weighted arithmetic operation to the calibration data so as to update the golden calibration table. Thereby, the purpose of accelerating the convergence speed of the golden calibration table can be achieved.

Abstract: A multi-system module having a functional substrate includes a substrate comprising therein at least one control circuit units, and a plurality of main circuit units provided on one side surface of the substrate. The main circuit units are electrically connected to the control circuit unit, whereby the control circuit unit is used to manage the operation of the main circuit units. Via the above module structure, the substrate can improve the function of controlling multiple systems.

Abstract: A testing system for a RF module includes a metal casing formed a testing space therein, a RF testing socket disposed inside the testing module, and a pressing manipulator penetrating through the metal casing. A shielding material layer is disposed on the internal surface of the metal casing so that the RF signal is isolated inside the metal casing. An end of the pressing manipulator extends into the testing space. The pressing manipulator is controlled automatically and provides for a pressure on a RF module disposed on the testing module so as to execute a testing process. As mentioned above, the testing set for a RF module can prevent from RF testing interference and the testing manufacture efficiency is improved.

Abstract: A method of auto-monitoring network ports includes the steps of: receiving at least one path of an application program; detecting whether or not the application program represented by the received path needs at least one network port; notifying a router to open the relative network port required by the application program if the detecting result indicates that the application program needs the network port; and notifying the router to close the relative network port required by the application program if the detecting result indicates that the application program no longer needs the network port. Hence, the present invention can achieve the purpose of exempting users from a mandatory setup of network ports for the router according to different application programs.

Abstract: A output power detecting system with a directional coupler has a directional coupler at the output terminal of the output power detecting system. The directional coupler includes a main line, a first sub line, and a second sub line. The output of the power amplifying unit is fully coupled to a power detecting unit via the coupling between the main line and the first sub line, and the external noise is coupled to the ground via the coupling between the first sub line and the second sub line. Therefore, the power detecting unit accurately detects the output power of the output power detecting system.

Abstract: A module for integrating peripheral circuit includes a silicon chip substrate, at least one peripheral circuit unit, and at least one main circuit unit. The peripheral circuit unit is integrated in the silicon chip substrate via a semiconductor manufacturing process. The main circuit unit is mounted on the surface of the silicon chip substrate and is electrically connected with the peripheral circuit unit for transmitting the signal. Thereby, the dimension of the module is reduced.