Abstract: A vibrating structure gyroscope having a vibrating structure (3) primary drive means (4) and secondary drive means (7) and primary pick-off means (2) an secondary pick-off means (6) is provided with a control system. The control system includes a primary closed control loop (1) for controllably varying the drive signal applied to the primary drive means (4), a secondary closed control loop (5) for controllably varying the drive signal applied to the secondary drive means (7) in order to maintain a null value of the secondary pick-off means (6) and means (30) for actively adjusting the scalefactor in the primary and secondary closed control loops (1, 5). The means (30) includes means (34) for dividing a rate response signal from the loop (5) by a signal indicative of the amplitude of the primary mode vibration. The output form the means (34) is filtered to provide an applied rate output.

Abstract: A system, method and computer program for rehosting a legacy application computer program written in one computer program dialect to a target dialect, for porting a control computer program, such as a Test Program, from one hardware platform to another, and for analyzing a computer program and creating a report. The rehost computer program is used to create a translation module in a first dialect which is comprised of a plurality of processed statements that are parsed, formatted and generalized and to store the statements in a searchable tree format. An existing translation module is enhanced by processing a number of programs and adding only unique statements. Each statement in the existing translation module has as a nested array an equivalence in the target language.

Abstract: A human computer interface system capable of providing real time context intelligence in relation to automatically recognized input signals. The system provides for the real time monitoring of operator and/or user inputs providing intelligent support by way of text, electronically presented data, information and speech outputs.

Abstract: Active acoustic piping that allows treatment of material flowing in a piping system is disclosed. Treatment of waste water and other fluids is enabled, where acoustic radiation operates on the flow material. An inner pipe has a plurality of transducer elements disposed on its external perimeter. A buffer zone around the transducer elements provides an acoustic impedance mismatch, which concentrates the acoustic energy into the flow material traveling in the inner pipe. Processes such as decontamination, flow unclogging, fluid and particulate mixing, particulate size reduction, and particulate separation are enabled. No pressure compensation scheme is required.

Abstract: An apparatus for providing mechanical support to a column grid array package is disclosed. The column grid array package uses solder columns to provide electrical connections between a ceramic substrate and a printed circuit board. The ceramic substrate has two sides, with an integrated circuit chip mounted on one side and many input/output pads mounted on the other side. Solder columns are attached between the input/output pads and the printed circuit board. A corner post is located at each corner of the column grid array package to secure the position of the ceramic substrate in relation to the printed circuit board.

Abstract: An apparatus for providing mechanical support to a column grid array package is disclosed. The column grid array package uses solder columns to provide electrical connections between a ceramic substrate and a printed circuit board. The ceramic substrate has two sides, with an integrated circuit chip mounted on one side and many input/output pads mounted on the other side. Solder columns are attached between the input/output pads and the printed circuit board. A corner post is located at each corner of the column grid array package to secure the position of the ceramic substrate in relation to the printed circuit board.

Abstract: A method for manufacturing a thermoelectric cooling mechanism for an integrated circuit is disclosed. Initially, electric circuits are formed on one side of a wafer. Subsequently, thermoelectric cooling devices are formed on an opposite side of the same wafer. Specifically, the thermoelectric cooling devices are formed by depositing a first conductive layer, depositing a layer of Peltier material on top of the first conductive layer, building a set of N30 regions and P30 regions within the Peltier material layer, and depositing a second conductive layer on top of the Peltier material layer.

Abstract: A flextensional transducer projector shell design is disclosed. The shell design has a shape formed so as to reduce the stress placed on the transduction driver as compared to other shell designs. The shell design includes first and second bulbous end portions, which can each be adapted to receive a respective end of a transduction driver. A middle portion of the shell design has both concave sections and convex sections, thereby defining a wave profile.

Abstract: A dual path ring oscillator core includes three dual path inverters, each having a first inverter and a second inverter. Within the first inverter, one transistor is coupled to a first output of a previous dual path inverter, while another transistor is coupled to a second output of the previous dual path inverter. Within the second inverter, one transistor is coupled to the second output of the previous dual path inverter, while another transistor is coupled to the previous dual path inverter's first output. A first and a final dual path inverter are analogously coupled. A transient pulse will not propagate through successive dual path inverter stages. A dual to single path converter is coupled to receive signals output by the final dual path inverter. If a transient signal appears at a dual to single path converter input, stray output node capacitance maintains a correct output signal value.

Abstract: Neutral conductivity ions, preferably germanium, are implanted through the oxide of a metal oxide semiconductor after isolation formation to provide a nearly constant threshold voltage for transistor operation independent of transistor channel width as device geometries are scaled down in size. The present invention sets forth a method for fabricating a metal oxide semiconductor (MOS) structure that controls threshold voltage Vt in the structure, the method including generating an isolation region of the semiconductor structure on a major surface of a silicon substrate, growing a thin oxide on the major surface of the semiconductor structure, implanting a large diameter neutral conductivity type ion into the major surface of the semiconductor structure through the thin oxide, annealing the semiconductor structure having the neutral conductivity ion implanted therein, and processing the semiconductor structure to create MOS devices having a near constant threshold voltage over a range of device channel widths.

Abstract: A circuit includes a signal generator and a discriminator. The signal generator generates a plurality of reference signals where a majority of the reference signals have the same phase. The discriminator generates a regulated signal that has the same phase as the majority of the reference signals. Therefore, if an environmental disturbance such as a single-event transient (SET) shifts the phase or phases of a minority of the reference signals, the discriminator maintains the regulated signal at a stable frequency and phase by generating the regulated signal with reference to the undisturbed majority of the reference signals.

Abstract: A transmitter which comprises a rf carrier signal generator for generating a rf carrier, a Class C amplifier arranged to amplify the rf carrier, a power supply for the Class C amplifier, a detector for detecting the modulated rf carrier and establishing a detected signal, a controller for controlling the power supply, means for supplying an audio signal to the controller for the purpose of amplitude modulating the rf carrier, and wherein the audio signal and the detected signal are applied to the controller to compensate for the non-linearily of the Class C amplifier.

Abstract: A procedure for temporally isolating an environmentally dependent integrated circuit fault includes the steps of determining a marginally failing and a minimally passing environmental condition corresponding to the fault; identifying a clock cycle Tmax at which the fault was first detected; determining a candidate clock cycle at which the fault may have occurred; and iteratively a) applying test pattern subsets from an initial clock cycle through the candidate clock cycle under the marginally failing environmental condition; b) applying remaining test patterns under the minimally passing environmental condition; and c) adjusting the candidate clock cycle based upon whether the fault occurred during test pattern subset application up through the candidate clock cycle under the marginally failing environmental condition.

Abstract: A self-modulating, remote, moving target detector for intrusion alarms, vehicle detection, and remote speed and distance measurement that includes a remote continuous wave radar transceiver that is used to detect moving targets. The same frequency used for the radar transmission is modulated in a continuous manner in order to transmit radar data concerning a moving target to a remote location away from the radar transceiver. The transceiver oscillator is self-modulated by the reflected signal received from a moving target in the transceiver and retransmitted such that the primary radar signal becomes the information carrier concerning the moving target, which is received remotely, in order to activate an alarm or a display system showing the moving target. The system could be utilized with any frequency from audio to light, with RF and microwave of primary interest.

Abstract: The accelerometer is linear having a substantially planar plate-like proof mass (9) mounted by four or more flexible mounting legs (8) each co-planar with the proof mass (9) to a substantially planar plate-like support (10) fixedly mounted relative to the proof mass (9) and co-planar therewith. In this way the proof mass (9) is mounted for linear movement in a sensing direction in the plane containing the proof mass (9), mounting legs (8) and support (10) to sense acceleration change applied to the accelerometer. At least two spaced apart substantially planar capacitor plates (11) each co-planar with the proof mass, mounting legs and support, are provided for sensing linear movement of the proof mass (9) in the sensing direction C. The proof mass (9), mounting legs (8), support (10) and capacitor blades (11) are formed from a single sheet of silicon and the mounting legs (8) extend substantially perpendicularly to the sensing direction C.

Abstract: Method and apparatus for determining the location at which radiation is incident on the sensor system which includes an EMI screening mesh by comparing the actual image detected, which includes the higher order diffraction effects, with a search or sample image applied sequentially at different locations and determing the location of the sample image which gives the closest match. The sample image corresponds to an expected pattern or image from a point source incident at a particular location on a particular window/sensor system, and may be generated from a real source of known location and properties incident on the system, or may be a generated image, such as a standard image such as a cross pattern or determined mathematically, for example using Fourier transforms. Preferably, once the location of the point of incidence of the radiation has been determined, image processing techniques are applied to remove the diffraction spots.

Abstract: A scannable flip flop for space-based LSSD testable integrated circuits. A scannable register can be formed from the scannable flip flops. The scannable flip flops can be radiation hardened. Each scannable flip flop can include a 2:1 input multiplexer, a first latch and a second latch. The input multiplexer is coupled to the first latch by a pair of pass gates. The pass gates are gated by a first clock input signal. A second pass gate pair couples the first latch to the second latch. A second clock input signal gates the second pass gate pair. The first and second clock input signals are non-overlapping. The latch can be employed in edge triggered logic ECAD tools for designing IC. The resulting IC logic can be tested using LSSD test testing techniques and patterns.

Abstract: An aircraft radar and altimeter system, comprising a radio transmitter and a transmitting antenna for radiating a beam of radio energy, a radio receiver and receiving antenna for receiving radio energy reflected from the ground, processing means for comparing the signal received by the receiver with the signal transmitted by the transmitter and determined from the comparison the instantaneous altitude of the aircraft above the ground, and means for changing the direction of radiation of the beam relative to the aircraft to compensate for changes in the attitude of the aircraft relative to the horizontal about at least one of the fore and aft and side-to-side axes.

Abstract: A method for stacking chips within a multichip module package is disclosed. A first chip is bonded to a substrate. A passivation layer is then deposited on a top surface of the first chip. After a first adhesive layer has been deposited on top of the passivation layer, an interposer is placed on the adhesive layer. Next, a second adhesive layer is deposited on the interposer. Finally, a second chip is bonded to the interposer via the second adhesive layer.

Abstract: A process for selectively removing a silicon-containing material through use of a byproduct of a chemical vapor deposition is disclosed. The process includes fabricating an insulating film upon a silicon base layer such that the insulating film includes a cavity. A diffusion barrier layer is deposited into the cavity. The diffusion barrier layer is formed during a chemical vapor deposition which produces an alkyl halide as a byproduct. A photoresist layer is fabricated upon a silicon-containing material. A portion of the photoresist is removed, thereby exposing a portion of the silicon-containing material. The exposed portion of the silicon-containing material is removed with a chemical etch solution including the alkyl halide.