Abstract: Techniques for providing SOS call routing for emergency calls are disclosed. One example system includes a first computing device that receives a message including identification information from a telephony endpoint; and retrieves location information for an IoT device based on the message. The system includes a second computing device that receives a call from the telephony endpoint that includes call information. The first computing device receives a notification of the call from the second computing device that includes the call information; verifies the call is associated with the message based on the identification information and call information; and generates instructions for the second computing device that includes forwarding the call using the location and callback information to a public safety answering point (PSAP).

Abstract: Arrangements (e.g., apparatus, method, machine-readable medium, chipset, etc.) guiding selection of a gateway to which to present a hand-off request for an outgoing communication session, including: referencing a gateway database storing gateway data for gateways of plural communication carriers, respectively, the gateway data of each subject gateway including an IP address and at least one connection efficiency value for the subject gateway; and considering connection efficiency values of ones of the gateways of the plural communication carriers in the gateway database according to a predetermined selection criteria, to form an output instruction which guides selection of at least one gateway to which to present the hand-off request.

Abstract: Techniques are described for single or multi-factor authentication. An access request is received followed by a prompt for authentication data comprising a segment of a continuous rolling authentication code. Upon receipt of the segment of a continuous rolling authentication code, it is compared to another version of the continuous rolling authentication code generated by an algorithm and shared secret key known to both parties. The access request may be authenticated when the segment of the rolling authentication code received in response to the prompt for authentication data matches a segment the continuous rolling authentication code generated. Otherwise, it is rejected.

Abstract: Techniques are disclosed for passing short message service (SMS) messages between sending and receiving SMS service providers over a network comprising a default data center and one or more alternative data centers. The default data center may receive message segments of an SMS message from the sending SMS provider into a local storage area of a concatenator comprising a local and a global storage area. The message segments may include segmentation information indicative of a number of message segments associated with the SMS message, routing information, the sending SMS provider, and the receiving SMS provider. When all the message segments have been received within a local timeout period, the default data center concatenates the message segments into a single SMS message and sends it to the receiving SMS service provider.

Abstract: Disclosed are techniques for handling emergency calls via an emergency call routing system. A Voice-over Internet Protocol (VoIP) emergency call server may be configured to receive a session initiation protocol (SIP) INVITE for an emergency call from a telephone number serviced by a telecommunication service provider (TSP) SIP call server. The SIP INVITE message header may include multiple location objects including a registered geo-coded address location object associated with the telephone number placing the emergency call, and a location object comprised of lat-long coordinates determined at the time the emergency call is placed. The emergency call server may determine whether the registered geo-coded address and the lat-long coordinates are within a specified distance of one another.

Abstract: A system for providing lifeline telecommunication service includes a gateway, an analog signal service module, and an integrated access device. The gateway receives telecommunication information from a telecommunication switch and generates data packets for communicating the telecommunication information. The analog signal service module is remotely coupled to the gateway. The analog signal service module may receive the data packets from the gateway and generate a first analog telephone signal for communicating the telecommunication information over a local loop circuit. Coupled to the local loop circuit, the integrated access device may receive the first analog telephone signal from the analog signal service module and communicate the first analog telephone signal to a subscriber line in a first mode of operation.

Abstract: A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of each group overlaps into an adjacent row or an adjacent column of the groups of the array; a semiconductor die; and structure for providing electrical connection between the semiconductor die and the conductive contacts.

Abstract: A voice gateway (64) includes an input port (70) that receives a voice signal from an unbundled analog line (62) coupled to a Class 5 switch (52). The voice signal is converted to a digital format by an analog-to-digital and digital-to-analog converting unit (76). The voice signal is placed into a compressed format by a compressing/de-compressing unit (80) using a selected one of a plurality of compression ratios. The voice signal is placed into a transport frame by a packetizing/de-packetizing unit (84) according to a selected packet format. The voice signal is multiplexed with other voice signals by an output port (88). The output port (88) places the voice signal onto a selected one of a plurality of output lines in order to transport the voice signal in its transport frame to one of an office customer premises (12) and a residence customer premises (14).

Abstract: Ultrasonically formed seals, their use in semiconductor packages, and methods of fabricating semiconductor packages. A brittle center member (such as glass) has a molded edge member. That edge member is ultrasonically welded to a body. The molded edge member and body are comprised of ultrasonically weldable materials. A hermetically sealed semiconductor package includes a lid with a brittle center plate and a molded edge. The molded edge is ultrasonically welded to a body. Locating features that enable accurate positioning of the lid relative to the body, and energy directors can be included. Pins having a relieved portion and a protruding portion can also be hermetically sealed to the body. Such pins can have various lengths that enable stadium-type pin rows. The pins can be within channels, which can hold a sealant. The body can include a device that is electrically connected to the pins.

Abstract: A capacitor structure may be incorporated into an interposer or substrate associated with an IC chip to stabilize the input/output signals, such as power and ground, between the IC chip and a printed circuit board. In accordance with one embodiment, the capacitor structure may include a plurality of individual capacitors connected together to form a monolithic capacitor blade having a length, width, and height, wherein each of the length and height of the blade spans multiple of the individual capacitors. The blade includes multiple electrical conductive paths extending the height of the capacitor blade. According to another embodiment, the capacitor structure includes multiple interleaved power and ground layers separated by insulating layers. The power layers connect to power leads and the ground layers connect to ground leads.

Abstract: Optoelectronic packaging assemblies for optically and electrically interfacing a protected electro-optical device or system to both an optical fiber and to external circuitry. Such assemblies are comprised of body components that are comprised of plastic that coated or plated with a conductive material. Electrical contact pins in the form of transmission lines are used to couple external electrical signals with the package. The optoelectronic packaging assemblies are dimensioned with small cavities and with steps, breaks, walls, and/or fins molded into the body components. The optoelectronic packaging assemblies further include an optical input receptacle for receiving an optical ferrule and an optical fiber. The optoelectronic packaging assembly provides for cooling, such as by heat sink fins and/or a thermal-electric-cooler. The transmission line pins and body components are dimensioned to mate with a standardized circuit board having transmission line traces.

Abstract: A method for testing a voice gateway includes the operation of transmitting a first series of network packets containing test data from test equipment to a network interface of the voice gateway. After the test data has been converted by the voice gateway from a network format to a telephony format and then converted back to a network format, the test equipment receives a second series of network packets containing the test data. The test equipment then analyzes the test data in the second series of network packets to determine performance characteristics of the voice gateway. The operation of analyzing the test data may include the operation of identifying bytes from the test data with byte values that represent idle insertion by a telephony interface and/or the operations of determining elapsed time between transmission and reception of the test data by the test equipment.

Abstract: A method reliably communicates content for multiple subscriber lines via a single physical transmission medium between a telecommunication gateway and equipment at a customer location. In that method, content for two or more subscriber lines of the customer location is received and converted into packetized data for network communications and/or multiplexed to form an added-main-line (AML) signal that includes power. The packetized data or the AML signal is communicated between the customer location and the telecommunication gateway via the single physical transmission medium. External power can be used to extract the content for the two or more subscriber lines from the packetized data in a primary mode of operation, and the power from the AML signal can be used to extract the content for the two or more subscriber lines from the AML signal in a backup mode of operation.

Abstract: A modular connector assembly includes a modular frame having a first holes, second holes, and third holes formed at evenly spaced intervals. A plurality of modular interconnect components, fixable within the modular frame, have a back surface projection formed thereon. Each modular interconnect includes a contact housing made of electrically insulating material, an exterior of the contact housing comprising first and second side surfaces, a back surface, and a top surface. Contact signal pins are fixed within and electrically insulated from the contact housing.

Abstract: A voice gateway (18) in a telecommunications network (1) includes a plurality of telephony port modules (102). Each telephony port module (102) receives telephony voice signals from a public switched telephony network (13). Each telephony port module (102) includes one or more digital signal processors (110) that perform one or more processing functions on the telephony voice signals. A particular telephony port module (102) may receive a telephony voice signal and use its associated digital signal processor (110) to process the received telephony voice signal or transfer the received telephony voice signal for processing to any digital signal processor (110) on any telephony port module (102). Telephony signals may also be transferred for processing to digital signal processors (110) on another voice gateway (18) in a voice gateway system.

Abstract: A backplane (11) of a telecommunications chassis includes a pair of controller slots that can receive respective controller modules. The backplane (11) also has a plurality of module slots that can receive respective telephony modules. Each of the pair of controller slots is connected by a plurality of buses to each of the plurality of module slots. The backplane (11) provides the ability to place any module type into any of the plurality of module slots.

Abstract: A lead insertion machine includes a substrate supply, a conductive lead supply, and an lead insertion mechanism. The conductive leads are inserted into lead passages formed in side walls of the substrate. Also disclosed is a method of manufacturing a semiconductor die carrier including the steps of forming a plurality of conductive leads, forming a substrate for holding a semiconductor die, the substrate having a plurality of insulative side walls defining an exterior surface of the substrate, each of the side walls having a plurality of lead passages formed therethrough, and simultaneously inserting at least one of the conductive leads into the lead passage of one of the side walls for retention therein and at least one other of the conductive leads into the lead passage of another of the side walls for retention therein.

Abstract: A packaged semiconductor device that is fabricated with a plurality of conductive leads defined in a strip that beneficially includes a radio frequency shield box. The conductive contacts are located in a housing, beneficially by insert molding or by sandwiching between a bottom piece and a top piece. The housing can further include a cavity that receives a semiconductor device, and the radio frequency shield can receive another semiconductor device. Bonding conductors electrically connect at least one semiconductor device to another semiconductor device and/or to the conductive contacts. A conductive cover is disposed over the housing. The cavity beneficially includes a beveled wall and the conductive leads and the radio frequency shield are beneficially comprised of copper.

Abstract: A telecommunications network (10) includes a gateway (18) that receives signaling information in a message based signaling format from a Class 5 softswitch (26). The gateway (18) also receives voice traffic over an inter-machine trunk from a public switched telephone network (12). The gateway (18) places the voice traffic into data packets. The gateway (18) transfers the data packets and the signaling information to an Internet Protocol network (30). The data packets and the signaling information may be transferred over a common physical link and over separate logical links.

Abstract: A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads.