Abstract: A gateway for communicating telecommunication information between a telecommunication network and customer premises equipment includes a telecommunication interface and a packetization module. The telecommunication interface receives first telecommunication information for a first subscriber and second telecommunication information for a second subscriber.

Abstract: A voice gateway (64) includes an input port (70) that receives a voice signal from an unbundled analog line (62) coupled to a Class 5 switch (52). The voice signal is converted to a digital format by an analog-to-digital and digital-to-analog converting unit (76). The voice signal is placed into a compressed format by a compressing/decompressing unit (80) using a selected one of a plurality of compression ratios. The voice signal is placed into a transport frame by a packetizing/depacketizing unit (84) according to a selected packet format. The voice signal is multiplexed with other voice signals by an output port (88). The output port (88) places the voice signal onto a selected one of a plurality of output lines in order to transport the voice signal in its transport frame to one of an office customer premises (12) and a residence customer premises (14).

Abstract: An apparatus for communicating telecommunication information between customer premises equipment and network equipment includes a subscriber line interface, a processing module, and a bypass switch. The interface receives an analog telephone signal communicating telecommunication information from a subscriber line. The processing module receives the analog telephone signal and processes the analog telephone signal to generate data packets for communicating the telecommunication information over a local loop circuit in a first mode of operation. The bypass switch communicates the analog telephone signal from the interface to the processing module in the first mode of operation and communicates the analog telephone signal from the interface over the local loop circuit to the network equipment in a second mode of operation.

Abstract: A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.

Abstract: According to one embodiment of the invention, a method for converting a telecommunication chassis includes providing a telecommunication chassis that includes a housing having a front and a rear, a backplane coupled to the housing, and a cable interface board having an inside surface and an outside surface coupled to the housing adjacent the rear of the housing, the outside surface facing the same general direction as the rear of the housing, and rotating the cable interface board such that the outside surface of the cable interface board faces the same general direction as the front of the housing.

Abstract: A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.

Abstract: A system for communicating telecommunication information between a telecommunication switch and customer premises equipment includes a gateway, a processing module, and a bypass switch. The gateway receives telecommunication information from the telecommunication switch. The gateway generates data packets for communicating the telecommunication information over a local loop circuit in a first mode of operation or generates a first analog signal for communicating the telecommunication information over the local loop circuit in a second mode of operation. The processing module receives the data packets from the local loop circuit and processes the data packets to generate a second analog telephone signal communicating the telecommunication information in the first mode of operation.

Abstract: An electrical connector includes a male connector and a female connector. The female connector includes a female connector housing and a plurality of female contact pins. The female contact pins includes a contact portion, a stabilizer portion, and a tail portion. The contact portion extends from the stabilizer portion at an angle. A lateral distance spanned by the angled contact portion is substantially the same as or less than the width of the stabilizer portion in the same direction. The female contact pins are arranged on the female connector housing in clusters of four. The clusters are arranged in rows such that each pair of rows defines five rows of female contact pins. The male connector includes a male connector housing and a plurality of male contact pins. The male connector housing has a plurality of buttresses extending therefrom. The male contact pins are arranged on the male connector housing to correspond to the arrangement of female contact pins.

Abstract: A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.

Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

Abstract: A system for communicating telecommunication information between a telecommunication switch and multiple local loop circuits includes a telecommunication interface, a data packet service module, an analog service module, and a cross connect. The telecommunication interface receives telecommunication information from a telecommunication switch. The data packet service module receives the telecommunication information from the telecommunication interface and generates data packets for communicating the telecommunication information in a first mode of operation. The analog signal service module receives the telecommunication information from the telecommunication interface and generates an analog telephone signal for communicating the telecommunication information in a second mode of operation. The cross connect communicates the analog telephone signal to a selected one of the local loop circuits.

Abstract: A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads.

Abstract: An integrated module includes a connector for detachable connection to a signal source, with the connector having internal electrically conductive pins, and a housing defining a cavity for holding at least one semiconductor die. The housing includes side walls and an end plate joined to the side walls. Electrically conductive leads extend through at least one of the side walls with each of the leads including an internal lead section extending within the cavity and an external lead section extending externally of the cavity through at least one side wall. One of the side walls of the housing includes a portion that is attached to the connector, with the side walls and a bottom part of the connector being formed as one integrally molded part or as two separate parts that are joined together using processes such as ultrasonic welding.

Abstract: A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.

Abstract: A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads.

Abstract: A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate.

Abstract: An electrical connector includes a male connector and a female connector. The female connector includes a female connector housing and a plurality of female contact pins. The female contact pins includes a contact portion, a stabilizer portion, and a tail portion. The contact portion extends from the stabilizer portion at an angle. A lateral distance spanned by the angled contact portion is substantially the same as or less than the width of the stabilizer portion in the same direction. The female contact pins are arranged on the female connector housing in clusters of four. The clusters are arranged in rows such that each pair of rows defines five rows of female contact pins. The male connector includes a male connector housing and a plurality of male contact pins. The male connector housing has a plurality of buttresses extending therefrom. The male contact pins are arranged on the male connector housing to correspond to the arrangement of female contact pins.

Abstract: An integrated module includes a connector for detachable connection to a signal source, with the connector having internal electrically conductive pins, and a housing defining a cavity for holding at least one semiconductor die. The housing includes side walls and an end plate joined to the side walls. Electrically conductive leads extend through at least one of the side walls with each of the leads including an internal lead section extending within the cavity and an external lead section extending externally of the cavity through at least one side wall. One of the side walls of the housing includes a portion that is attached to the connector, with the side walls and a bottom part of the connector being formed as one integrally molded part or as two separate parts that are joined together using processes such as ultrasonic welding.

Abstract: A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.

Abstract: A system for housing telecommunications equipment includes a plurality of vertically disposed chassis, each chassis having a top that is substantially closed, two sides, two ends, and a base, wherein the top of each chassis is adapted to receive the base of an adjacent chassis. At least one vent is formed in each chassis adjacent the base for allowing air to enter the chassis, and at least one of the ends and one of the sides of the chassis are formed such that air may exit the chassis. The vent is disposed between the base and a portion of the chassis selected from the group consisting of either of the ends and either of the sides, and the vent is nonplanar in relation to that portion. More specifically, the chassis may be vertically disposed with substantially zero gap, and the vent member may be either an angled vent member or a notched vent member.