Patents Assigned to Bostik, Inc.
  • Patent number: 10307995
    Abstract: A hot melt adhesive using polypropylene impact copolymers that is particularly well suited for elastic attachment and stretch films in diaper structures. The hot melt adhesive composition is a blend of about 2.5% to about 30%, by weight, of a polypropylene impact copolymer; about 2.5% to about 30%, by weight, of an olefin based elastomer; about 10% to about 70%, by weight, of a tackifying resin having a softening point of at least about 80° C. and up to about 140° C.; about 0% to about 60%, by weight, of a plasticizer; and about 0.1% to about 5% of a stabilizer or antioxidant.
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: June 4, 2019
    Assignee: Bostik, Inc.
    Inventors: Patrick John Czaplewski, Steven Daniel Gray
  • Patent number: 10214665
    Abstract: A method for making a laminate comprises the steps of applying a hot melt adhesive composition in a molten state to a primary substrate and mating a secondary substrate to the first substrate by contacting the secondary substrate with the adhesive composition. The composition comprises a polymer blend based on a low molecular weight semicrystalline propylene based polymer and a high molecular weight essentially amorphous propylene based polymer, both of which are prepared by using single-site catalysts. The composition further contains a compatible tackifier, a plasticizer, an antioxidant, and optionally a wax, a filler, a colorant, a UV absorber, another polymer, or combinations thereof. Particularly preferred applications include nonwoven disposable diaper and feminine sanitary napkin construction, diaper and adult incontinent brief elastic attachment, diaper and napkin core stabilization, diaper backsheet lamination, industrial filter material conversion, and surgical gown and surgical drape assemblies.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: February 26, 2019
    Assignee: Bostik Inc.
    Inventors: Baoyu Wang, Kelley Gerschke, Terhi I. Hawkins, Charley Paul, Kimberly E. Secrist
  • Patent number: 10081212
    Abstract: A non-pressure sensitive hot melt adhesive for use in mailer applications uses a styrenic block copolymer (SBC) with a hydrogenated mid-block as the primary polymer in the composition. The adhesive contains about 10% to about 50% by weight of the SBC, about 2% to about 30% by weight of a polyolefin polymer as a secondary polymer in the composition, about 10% to about 70% by weight of a suitable plasticizer, about 0% to about 30% by weight of a wax, about 0% to about 50% by weight of one or more tackifying resins, about 0.1% to about 4% by weight of a stabilizer, and about 0% to about 3% by weight of auxiliary additives, so that the viscosity of the composition is equal to or less than about 10,000 cP at 163° C. The formulation balances the cohesive and adhesive strength required to insure the adhesive fails cohesively to prevent paper tear.
    Type: Grant
    Filed: July 1, 2015
    Date of Patent: September 25, 2018
    Assignee: BOSTIK, INC.
    Inventors: Monina D. Kanderski, Michael D. Vitrano
  • Patent number: 10017674
    Abstract: An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight percent of a moisture curable polymer system; and 40 to 90 weight percent of additives for modifying physical properties of the composition. The adhesive has a composition such that, when cured, results in an elastomeric film of uniform thickness that exhibits controlled moisture vapor transmission and sound abatement properties. A floor structure and a method for constructing the floor structure using the adhesive composition are also provided.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: July 10, 2018
    Assignee: BOSTIK, INC.
    Inventors: Michael S. Lontchar, Michael A. Chronister, Kristin J. Ryan
  • Patent number: 10011744
    Abstract: A hot melt adhesive composition comprises a polymer blend based on a low molecular weight semicrystalline propylene based polymer and a high molecular weight essentially amorphous propylene based polymer, both of which are prepared by using single-site catalysts. The composition further contains a compatible tackifier, a plasticizer, an antioxidant, and optionally a wax, a filler, a colorant, a UV absorber, another polymer, or combinations thereof. The hot melt composition has low viscosity ranging from 500 mPa·s to 35,000 mPa·s at 177° C. and is useful for a variety of industrial applications where bonding of low surface energy substrates is encountered, including disposable nonwoven hygienic articles, labeling and other assembly applications.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: July 3, 2018
    Assignee: Bostik, Inc.
    Inventors: Baoyu Wang, Kelley Gerschke, Terhi I. Hawkins, Charley Paul, Kimberly E. Secrist
  • Patent number: 9982171
    Abstract: A hot melt adhesive composition containing a functionalized polymer, namely, a metallocene catalyzed polyolefin elastomer grafted with maleic anhydride, together with a non-functionalized secondary polymer, namely, a metallocene catalyzed random or block polyolefin elastomer having a melt index equal to or greater than 15, a first tackifying resin having a softening point of at least 95° C., and a wax. The composition may optionally include an aromatic reinforcing resin having a softening point equal to or higher than 115° C., and a plasticizer. These hot melts provide superior hot tack, excellent adhesion, flexibility, and heat resistance above 150° F. in applications such as rigid packaging, hot fill packaging, and bottle labeling.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: May 29, 2018
    Assignee: Bostik, Inc.
    Inventors: Monina D. Kanderski, Michael D. Vitrano
  • Patent number: 9982172
    Abstract: An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight percent of a moisture curable polymer system; and 40 to 90 weight percent of additives for modifying physical properties of the composition. The adhesive has a composition such that, when cured, results in an elastomeric film of uniform thickness that exhibits controlled moisture vapor transmission and sound abatement properties. A floor structure and a method for constructing the floor structure using the adhesive composition are also provided.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: May 29, 2018
    Assignee: BOSTIK, INC.
    Inventors: Michael S. Lontchar, Michael A. Chronister, Kristin J. Ryan
  • Patent number: 9789007
    Abstract: The present invention is directed to a novel process for preparing an absorbent article, wherein the process comprises providing a first sheet layer (2); conforming said first layer on a first roll C2, whereby longitudinal corrugations are formed on the layer; conforming said corrugated layer (2) on a second roll C3, whereby a pattern of pockets (4, 4a) is obtained; providing a pre-metered amount of SAP particulate material (6); providing a second sheet layer (7) material and affixing it for sandwiching with the first sheet layer; and finishing the absorbent article.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: October 17, 2017
    Assignees: BASF SE, BOSTIK INC.
    Inventor: Jean-Francois Chartrel
  • Patent number: 9783712
    Abstract: A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; about 5% to about 50% of a plasticizer; about 1% to about 40% by weight of a secondary polymer which is either a semi crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: October 10, 2017
    Assignee: Bostik, Inc.
    Inventors: Richard Hamann, Lianne Rachow
  • Patent number: 9649229
    Abstract: The present invention is directed to a novel process for manufacturing an absorbent article comprising the steps of: providing a first sheet layer (2); providing an array of pockets (4, 4a) into said first sheet layer; providing a pre-metered amount of SAP particulate material (6); said pre-metered amount of SAP material being delivered from a rotating delivering drum (101, 111), said drum having apertures (103a, 103b, 103c, 103d, 113a, 113b, 113c) on its periphery corresponding to the array of pockets (4, 4a), said pre-metered amount of SAP material being delivered from the inner part of said drum (101, 111) through said apertures (103a, 103b, 103c, 103d, 113a, 113b, 113c); providing a second sheet layer (7) material and affixing it for sandwiching with the first sheet layer; finishing the absorbent article.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: May 16, 2017
    Assignees: BASF SE, BOSTIK INC.
    Inventor: Jean-Francois Chartrel
  • Patent number: 9624400
    Abstract: A low temperature heat seal coating solution which contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. The coating solution can be applied to a packaging web such as a foil or film by converters using conventional methods such as gravure, rod, slot die, or printing process. The heal seal coating can be sealed to itself or another substrate to manufacture food packaging bags or pharmaceutical blister packaging. The heat seal temperature can be as low as 70° C. under conventional equipment and conditions in the industry.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: April 18, 2017
    Assignee: Bostik, Inc.
    Inventors: Darius K. Deak, Thomas Lee Ruppert, Elaine Lo
  • Patent number: 9532906
    Abstract: The present invention is directed to a liquid-absorbing article comprising: a first sheet layer presenting an array of absorbent receiving pockets; masses of superabsorbent material, which masses are placed in said absorbent receiving pockets; a second sheet layer placed on top of the first layer; bonding beads placed between the respective pockets.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: January 3, 2017
    Assignees: BASF SE, BOSTIK INC.
    Inventors: Christophe Bauduin, Jean-Francois Chartrel, Thomas Daniel, Julien Liger, Renate Wuestefeld
  • Patent number: 9404004
    Abstract: A hot applied, non-crosslinking, non-butyl, sealant. These sealants are composed of olefin polymers, styrenic block copolymers, an ethylene vinyl acetate copolymer, tackifying resins, plasticizers, and preferably inorganic fillers, and organosilane adhesion promoters. Optionally, the sealant may include UV absorbers, antioxidants, pigments, and the like. The sealants are suitable for use as edge sealants for insulated glass (IG) window units.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: August 2, 2016
    Assignee: BOSTIK, INC.
    Inventors: Patrick John Czaplewski, David P. Keuler, Michael D. Vitrano
  • Publication number: 20160215176
    Abstract: A low activation temperature heat seal hot melt adhesive for packaging applications based on a blend of metallocene catalyzed polyolefin polymer, tackifying resin, wax and other optional additives. In order to achieve the high viscosity suitable for an extrusion heat seal application, the adhesive composition of the invention is highly loaded with polymer, and thus should have a viscosity of about 50,000 centipoise or more measured at a temperature of 300° F. Accordingly, the hot melt adhesive composition contains about 50% to about 90% by weight of metallocene catalyzed polyolefin polymer, about 5% to about 50% by weight of tackifying resin, about 0.5% to about 40% by weight of wax, about 0.1% to about 5% by weight of a stabilizer or antioxidant, and 0% to about 25% by weight of optional additives. The hot melt adhesive composition must have an activation temperature of about 160° F. or less, and provide a minimum peel force of about 1.
    Type: Application
    Filed: January 22, 2016
    Publication date: July 28, 2016
    Applicant: Bostik, Inc.
    Inventors: Monina D. Kanderski, Michael D. Vitrano
  • Publication number: 20160177119
    Abstract: A hot applied, non-crosslinking, non-butyl, sealant. These sealants are composed of olefin polymers, styrenic block copolymers, an ethylene vinyl acetate copolymer, tackifying resins, plasticizers, and preferably inorganic fillers, and organosilane adhesion promoters. Optionally, the sealant may include UV absorbers, antioxidants, pigments, and the like. The sealants are suitable for use as edge sealants for insulated glass (IG) window units.
    Type: Application
    Filed: December 28, 2012
    Publication date: June 23, 2016
    Applicant: Bostik, Inc.
    Inventors: Patrick John Czaplewski, David P. Keuler, Michael D. Vitrano
  • Publication number: 20160151213
    Abstract: The present invention relates to absorbent cores especially ultrathin fluid absorbent cores comprising fluid-absorbent polymers in a plurality of pockets, wherein the particle size distribution of the fluid-absorbent polymers in the pockets vary by not more than 15% between the pockets.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 2, 2016
    Applicants: BASF SE, BOSTIK INC.
    Inventors: Christophe BAUDUIN, Jean Francois CHARTREL, Thomas DANIEL, Julien LIGER
  • Patent number: 9334431
    Abstract: A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has a) about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; b) about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; c) about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; d) about 5% to about 50% of a plasticizer; e) about 1% to about 40% by weight of a secondary polymer which is either a semi-crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; f) about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: May 10, 2016
    Assignee: BOSTIK, INC.
    Inventors: Richard Hamann, Lianne Rachow
  • Publication number: 20160102230
    Abstract: A hot melt adhesive made from a blend of a polypropylene-based polymer, a polyolefin elastomer, and an amorphous polyolefin. These adhesives exhibit excellent molten and pre-set flow allowing them to wet out substrates yet develop properties needed to form and maintain strong bonds making them useful for hygiene, construction, and packaging applications.
    Type: Application
    Filed: October 13, 2015
    Publication date: April 14, 2016
    Applicant: BOSTIK, INC.
    Inventors: Steven Daniel Gray, David Frederic Freund, Richard Edward Hamann, Miao Hu, Fabrice Nicolas-Henri Flores
  • Publication number: 20160002508
    Abstract: A non-pressure sensitive hot melt adhesive for use in mailer applications uses a styrenic block copolymer (SBC) with a hydrogenated mid-block as the primary polymer in the composition. The adhesive contains about 10% to about 50% by weight of the SBC, about 2% to about 30% by weight of a polyolefin polymer as a secondary polymer in the composition, about 10% to about 70% by weight of a suitable plasticizer, about 0% to about 30% by weight of a wax, about 0% to about 50% by weight of one or more tackifying resins, about 0.1% to about 4% by weight of a stabilizer, and about 0% to about 3% by weight of auxiliary additives, so that the viscosity of the composition is equal to or less than about 10,000 cP at 163° C. The formulation balances the cohesive and adhesive strength required to insure the adhesive fails cohesively to prevent paper tear.
    Type: Application
    Filed: July 1, 2015
    Publication date: January 7, 2016
    Applicant: BOSTIK, INC.
    Inventors: Monina D. Kanderski, Michael D. Vitrano
  • Patent number: 9181461
    Abstract: A hot melt sealant and foam-in-place gasket composition based on a rubber such as ethylene propylene rubber (EPR) and/or ethylene propylene diene rubber (EPDM) and at least one semicrystalline olefinic polymer. The hot melt composition includes the rubber or a blend of rubbers in an amount of 5% to 50% by weight, at least one semicrystalline olefinic polymer in an amount of 5% to 40% by weight, at least one amorphous poly-?-olefin (APAO) polymer in an amount of 0% to 70% by weight, a compatible tackifier in an amount of 0% to 50% by weight, and a plasticizer in an amount of at least 30% by weight. The composition is particularly useful for foamed gasket applications as a replacement for pressure sensitive adhesive (PSA) coated foam tape.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: November 10, 2015
    Assignee: Bostik, Inc
    Inventor: Baoyu Wang