Patents Assigned to Bostik, Inc.
-
Patent number: 10081212Abstract: A non-pressure sensitive hot melt adhesive for use in mailer applications uses a styrenic block copolymer (SBC) with a hydrogenated mid-block as the primary polymer in the composition. The adhesive contains about 10% to about 50% by weight of the SBC, about 2% to about 30% by weight of a polyolefin polymer as a secondary polymer in the composition, about 10% to about 70% by weight of a suitable plasticizer, about 0% to about 30% by weight of a wax, about 0% to about 50% by weight of one or more tackifying resins, about 0.1% to about 4% by weight of a stabilizer, and about 0% to about 3% by weight of auxiliary additives, so that the viscosity of the composition is equal to or less than about 10,000 cP at 163° C. The formulation balances the cohesive and adhesive strength required to insure the adhesive fails cohesively to prevent paper tear.Type: GrantFiled: July 1, 2015Date of Patent: September 25, 2018Assignee: BOSTIK, INC.Inventors: Monina D. Kanderski, Michael D. Vitrano
-
Patent number: 10017674Abstract: An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight percent of a moisture curable polymer system; and 40 to 90 weight percent of additives for modifying physical properties of the composition. The adhesive has a composition such that, when cured, results in an elastomeric film of uniform thickness that exhibits controlled moisture vapor transmission and sound abatement properties. A floor structure and a method for constructing the floor structure using the adhesive composition are also provided.Type: GrantFiled: December 30, 2010Date of Patent: July 10, 2018Assignee: BOSTIK, INC.Inventors: Michael S. Lontchar, Michael A. Chronister, Kristin J. Ryan
-
Patent number: 10011744Abstract: A hot melt adhesive composition comprises a polymer blend based on a low molecular weight semicrystalline propylene based polymer and a high molecular weight essentially amorphous propylene based polymer, both of which are prepared by using single-site catalysts. The composition further contains a compatible tackifier, a plasticizer, an antioxidant, and optionally a wax, a filler, a colorant, a UV absorber, another polymer, or combinations thereof. The hot melt composition has low viscosity ranging from 500 mPa·s to 35,000 mPa·s at 177° C. and is useful for a variety of industrial applications where bonding of low surface energy substrates is encountered, including disposable nonwoven hygienic articles, labeling and other assembly applications.Type: GrantFiled: January 13, 2017Date of Patent: July 3, 2018Assignee: Bostik, Inc.Inventors: Baoyu Wang, Kelley Gerschke, Terhi I. Hawkins, Charley Paul, Kimberly E. Secrist
-
Patent number: 9982171Abstract: A hot melt adhesive composition containing a functionalized polymer, namely, a metallocene catalyzed polyolefin elastomer grafted with maleic anhydride, together with a non-functionalized secondary polymer, namely, a metallocene catalyzed random or block polyolefin elastomer having a melt index equal to or greater than 15, a first tackifying resin having a softening point of at least 95° C., and a wax. The composition may optionally include an aromatic reinforcing resin having a softening point equal to or higher than 115° C., and a plasticizer. These hot melts provide superior hot tack, excellent adhesion, flexibility, and heat resistance above 150° F. in applications such as rigid packaging, hot fill packaging, and bottle labeling.Type: GrantFiled: September 25, 2014Date of Patent: May 29, 2018Assignee: Bostik, Inc.Inventors: Monina D. Kanderski, Michael D. Vitrano
-
Patent number: 9982172Abstract: An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight percent of a moisture curable polymer system; and 40 to 90 weight percent of additives for modifying physical properties of the composition. The adhesive has a composition such that, when cured, results in an elastomeric film of uniform thickness that exhibits controlled moisture vapor transmission and sound abatement properties. A floor structure and a method for constructing the floor structure using the adhesive composition are also provided.Type: GrantFiled: December 30, 2010Date of Patent: May 29, 2018Assignee: BOSTIK, INC.Inventors: Michael S. Lontchar, Michael A. Chronister, Kristin J. Ryan
-
Patent number: 9789007Abstract: The present invention is directed to a novel process for preparing an absorbent article, wherein the process comprises providing a first sheet layer (2); conforming said first layer on a first roll C2, whereby longitudinal corrugations are formed on the layer; conforming said corrugated layer (2) on a second roll C3, whereby a pattern of pockets (4, 4a) is obtained; providing a pre-metered amount of SAP particulate material (6); providing a second sheet layer (7) material and affixing it for sandwiching with the first sheet layer; and finishing the absorbent article.Type: GrantFiled: October 24, 2012Date of Patent: October 17, 2017Assignees: BASF SE, BOSTIK INC.Inventor: Jean-Francois Chartrel
-
Patent number: 9783712Abstract: A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; about 5% to about 50% of a plasticizer; about 1% to about 40% by weight of a secondary polymer which is either a semi crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).Type: GrantFiled: April 21, 2016Date of Patent: October 10, 2017Assignee: Bostik, Inc.Inventors: Richard Hamann, Lianne Rachow
-
Patent number: 9649229Abstract: The present invention is directed to a novel process for manufacturing an absorbent article comprising the steps of: providing a first sheet layer (2); providing an array of pockets (4, 4a) into said first sheet layer; providing a pre-metered amount of SAP particulate material (6); said pre-metered amount of SAP material being delivered from a rotating delivering drum (101, 111), said drum having apertures (103a, 103b, 103c, 103d, 113a, 113b, 113c) on its periphery corresponding to the array of pockets (4, 4a), said pre-metered amount of SAP material being delivered from the inner part of said drum (101, 111) through said apertures (103a, 103b, 103c, 103d, 113a, 113b, 113c); providing a second sheet layer (7) material and affixing it for sandwiching with the first sheet layer; finishing the absorbent article.Type: GrantFiled: October 24, 2012Date of Patent: May 16, 2017Assignees: BASF SE, BOSTIK INC.Inventor: Jean-Francois Chartrel
-
Patent number: 9624400Abstract: A low temperature heat seal coating solution which contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. The coating solution can be applied to a packaging web such as a foil or film by converters using conventional methods such as gravure, rod, slot die, or printing process. The heal seal coating can be sealed to itself or another substrate to manufacture food packaging bags or pharmaceutical blister packaging. The heat seal temperature can be as low as 70° C. under conventional equipment and conditions in the industry.Type: GrantFiled: March 25, 2015Date of Patent: April 18, 2017Assignee: Bostik, Inc.Inventors: Darius K. Deak, Thomas Lee Ruppert, Elaine Lo
-
Patent number: 9532906Abstract: The present invention is directed to a liquid-absorbing article comprising: a first sheet layer presenting an array of absorbent receiving pockets; masses of superabsorbent material, which masses are placed in said absorbent receiving pockets; a second sheet layer placed on top of the first layer; bonding beads placed between the respective pockets.Type: GrantFiled: October 24, 2012Date of Patent: January 3, 2017Assignees: BASF SE, BOSTIK INC.Inventors: Christophe Bauduin, Jean-Francois Chartrel, Thomas Daniel, Julien Liger, Renate Wuestefeld
-
Patent number: 9404004Abstract: A hot applied, non-crosslinking, non-butyl, sealant. These sealants are composed of olefin polymers, styrenic block copolymers, an ethylene vinyl acetate copolymer, tackifying resins, plasticizers, and preferably inorganic fillers, and organosilane adhesion promoters. Optionally, the sealant may include UV absorbers, antioxidants, pigments, and the like. The sealants are suitable for use as edge sealants for insulated glass (IG) window units.Type: GrantFiled: December 28, 2012Date of Patent: August 2, 2016Assignee: BOSTIK, INC.Inventors: Patrick John Czaplewski, David P. Keuler, Michael D. Vitrano
-
Publication number: 20160215176Abstract: A low activation temperature heat seal hot melt adhesive for packaging applications based on a blend of metallocene catalyzed polyolefin polymer, tackifying resin, wax and other optional additives. In order to achieve the high viscosity suitable for an extrusion heat seal application, the adhesive composition of the invention is highly loaded with polymer, and thus should have a viscosity of about 50,000 centipoise or more measured at a temperature of 300° F. Accordingly, the hot melt adhesive composition contains about 50% to about 90% by weight of metallocene catalyzed polyolefin polymer, about 5% to about 50% by weight of tackifying resin, about 0.5% to about 40% by weight of wax, about 0.1% to about 5% by weight of a stabilizer or antioxidant, and 0% to about 25% by weight of optional additives. The hot melt adhesive composition must have an activation temperature of about 160° F. or less, and provide a minimum peel force of about 1.Type: ApplicationFiled: January 22, 2016Publication date: July 28, 2016Applicant: Bostik, Inc.Inventors: Monina D. Kanderski, Michael D. Vitrano
-
Publication number: 20160177119Abstract: A hot applied, non-crosslinking, non-butyl, sealant. These sealants are composed of olefin polymers, styrenic block copolymers, an ethylene vinyl acetate copolymer, tackifying resins, plasticizers, and preferably inorganic fillers, and organosilane adhesion promoters. Optionally, the sealant may include UV absorbers, antioxidants, pigments, and the like. The sealants are suitable for use as edge sealants for insulated glass (IG) window units.Type: ApplicationFiled: December 28, 2012Publication date: June 23, 2016Applicant: Bostik, Inc.Inventors: Patrick John Czaplewski, David P. Keuler, Michael D. Vitrano
-
Publication number: 20160151213Abstract: The present invention relates to absorbent cores especially ultrathin fluid absorbent cores comprising fluid-absorbent polymers in a plurality of pockets, wherein the particle size distribution of the fluid-absorbent polymers in the pockets vary by not more than 15% between the pockets.Type: ApplicationFiled: December 20, 2013Publication date: June 2, 2016Applicants: BASF SE, BOSTIK INC.Inventors: Christophe BAUDUIN, Jean Francois CHARTREL, Thomas DANIEL, Julien LIGER
-
Patent number: 9334431Abstract: A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has a) about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; b) about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; c) about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; d) about 5% to about 50% of a plasticizer; e) about 1% to about 40% by weight of a secondary polymer which is either a semi-crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; f) about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).Type: GrantFiled: May 21, 2014Date of Patent: May 10, 2016Assignee: BOSTIK, INC.Inventors: Richard Hamann, Lianne Rachow
-
Publication number: 20160102230Abstract: A hot melt adhesive made from a blend of a polypropylene-based polymer, a polyolefin elastomer, and an amorphous polyolefin. These adhesives exhibit excellent molten and pre-set flow allowing them to wet out substrates yet develop properties needed to form and maintain strong bonds making them useful for hygiene, construction, and packaging applications.Type: ApplicationFiled: October 13, 2015Publication date: April 14, 2016Applicant: BOSTIK, INC.Inventors: Steven Daniel Gray, David Frederic Freund, Richard Edward Hamann, Miao Hu, Fabrice Nicolas-Henri Flores
-
Publication number: 20160002508Abstract: A non-pressure sensitive hot melt adhesive for use in mailer applications uses a styrenic block copolymer (SBC) with a hydrogenated mid-block as the primary polymer in the composition. The adhesive contains about 10% to about 50% by weight of the SBC, about 2% to about 30% by weight of a polyolefin polymer as a secondary polymer in the composition, about 10% to about 70% by weight of a suitable plasticizer, about 0% to about 30% by weight of a wax, about 0% to about 50% by weight of one or more tackifying resins, about 0.1% to about 4% by weight of a stabilizer, and about 0% to about 3% by weight of auxiliary additives, so that the viscosity of the composition is equal to or less than about 10,000 cP at 163° C. The formulation balances the cohesive and adhesive strength required to insure the adhesive fails cohesively to prevent paper tear.Type: ApplicationFiled: July 1, 2015Publication date: January 7, 2016Applicant: BOSTIK, INC.Inventors: Monina D. Kanderski, Michael D. Vitrano
-
Patent number: 9181461Abstract: A hot melt sealant and foam-in-place gasket composition based on a rubber such as ethylene propylene rubber (EPR) and/or ethylene propylene diene rubber (EPDM) and at least one semicrystalline olefinic polymer. The hot melt composition includes the rubber or a blend of rubbers in an amount of 5% to 50% by weight, at least one semicrystalline olefinic polymer in an amount of 5% to 40% by weight, at least one amorphous poly-?-olefin (APAO) polymer in an amount of 0% to 70% by weight, a compatible tackifier in an amount of 0% to 50% by weight, and a plasticizer in an amount of at least 30% by weight. The composition is particularly useful for foamed gasket applications as a replacement for pressure sensitive adhesive (PSA) coated foam tape.Type: GrantFiled: August 17, 2006Date of Patent: November 10, 2015Assignee: Bostik, IncInventor: Baoyu Wang
-
Publication number: 20150313764Abstract: The present invention is directed to a novel process for dosing super absorbent polymer particles into a plurality of particles flows, comprising the steps of: (i) providing super absorbent polymer particles; (ii) imparting a rotation to said particles; and (iii) collecting separate flows of particles, wherein the step (ii) is performed with a rotating mobile (11) provided into a housing (12). Use for manufacturing absorbent article and article thus obtained.Type: ApplicationFiled: December 20, 2013Publication date: November 5, 2015Applicants: BASF SE, BOSTIK INC.Inventor: Jean Francois CHARTREL
-
Publication number: 20150299526Abstract: A hot melt adhesive composition made from polypropylene copolymer or polypropylene impact copolymer, a polyolefin elastomer, a low density polyethylene, a tackifying resin, a plasticizer, and a nucleating agent. These adhesives are fast setting yet show an improved balance of mechanical properties making them useful for hygiene, construction, and packaging applications.Type: ApplicationFiled: April 16, 2015Publication date: October 22, 2015Applicant: BOSTIK, INC.Inventors: Steven Daniel Gray, Miao Hu