Patents Assigned to Bostik, Inc.
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Patent number: 8163824Abstract: Multipurpose hot melt adhesive compositions which are suitable for use as both a construction and elastic attachment adhesive for disposable soft goods, such as disposable diapers, feminine sanitary napkins, surgical drapes, hospital pads, and adult incontinent products. The multipurpose hot melt adhesive compositions have a high level of creep resistance, high bond strength, and relatively low viscosity, and are composed of endblock resin in combination with a linear styrene-butadiene-styrene (SBS) copolymer wherein the copolymer has a styrene content greater than about 35% by weight, and preferably about 38% to about 50% by weight.Type: GrantFiled: April 22, 2010Date of Patent: April 24, 2012Assignee: Bostik, Inc.Inventors: Genta Okazaki, Mark D. Alper
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Patent number: 8129464Abstract: A hot melt adhesive composition, comprising a blend of components including about 10% to about 40% by weight of an elastomeric block copolymer, preferably styrene-isoprene-styrene (SIS) or styrene-butadiene-styrene (SBS), about 15% to about 70% by weight of a first midblock tackifying resin having a softening point of at least about 110° C. and having an aromatic content of at least about 1.5% by weight; about 0 to 55% of second midblock tackifying resin, about 5% to about 35% by weight of a plasticizer; and about 0% to about 20% by weight of an end block resin having a softening point lower than 125° C.; wherein the components total 100% by weight of the composition, the viscosity of the composition is equal to or less than about 20,000 mPa·s at 120° C., and is applied at a temperature lower that 150° C. and initial bond retention of the composition on elastic strands is at least about 60%.Type: GrantFiled: June 2, 2009Date of Patent: March 6, 2012Assignee: Bostik, Inc.Inventors: Fabienne Abba, Christopher Morel-Fourrier, Nicolas Edgard Sajot
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Publication number: 20110268909Abstract: A method for packaging plastic material using a film to surround the material, and more particularly to a method for packaging a copolyester, and the resulting package formed thereby. The method is preferably a coextrusion process for packaging an amorphous or semi-crystalline copolyester having a low glass transition temperature by extruding it through a die orifice, and coextruding a copolyester polymeric film having a high glass transition temperature to surround the low glass transition copolyester. The coated low glass transition copolyester may then be formed into individual packaged units having a finite size and shape.Type: ApplicationFiled: December 22, 2010Publication date: November 3, 2011Applicant: BOSTIK, INC.Inventors: Darius K. Deak, Herve Philippe Burriez
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Process for preparing an aqueous dispersion of a quaternary ammonium salt containing vinyl copolymer
Patent number: 7999031Abstract: A method of making an ion triggerable cationic polymer by solution copolymerizing one or more vinyl-functional cationic monomers, one or more water insoluble or hydrophobic vinyl monomers with alkyl side chains up to 4 carbons long, and, optionally, a minor amount of one or more vinyl monomers with linear or branched alkyl groups longer than 4 carbons, alkyl hydroxy, polyoxyalkylene, or other functional groups. The solution polymerization is accomplished by free radical polymerization in a mixture of an organic solvent such as acetone and water. After polymerization is complete, the organic solvent is preferably removed by a continuous process. The continuous process is preferably performed using a plate evaporator system.Type: GrantFiled: November 3, 2009Date of Patent: August 16, 2011Assignee: Bostik, Inc.Inventors: Glenn C. Calhoun, Rodney M. Weston -
Publication number: 20110154772Abstract: An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight percent of a moisture curable polymer system; and 40 to 90 weight percent of additives for modifying physical properties of the composition. The adhesive has a composition such that, when cured, results in an elastomeric film of uniform thickness that exhibits controlled moisture vapor transmission and sound abatement properties. A floor structure and a method for constructing the floor structure using the adhesive composition are also provided.Type: ApplicationFiled: December 30, 2010Publication date: June 30, 2011Applicant: BOSTIK, INC.Inventors: Michael S. Lontchar, Michael A. Chronister, Kristin J. Ryan
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Publication number: 20110159225Abstract: A conformable, pressure sensitive foam adhesive tape has a closed-cell polyolefin foam core, pressure sensitive adhesive having a polyacrylate backbone with modified silyl functionality, and a coated release liner. The coating on the release liner is a platinum-catalyzed polysiloxane coating.Type: ApplicationFiled: December 22, 2010Publication date: June 30, 2011Applicant: BOSTIK, INC.Inventors: James T. Boyle, Katherine Pelle
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Patent number: 7964662Abstract: An aqueous adhesive composition comprising a polychloroprene emulsion; an adhesion promoting agent that promotes adhesion to polyolefin substrates; a polyurethane polymer dispersion; an aqueous tackifying resin dispersion; and a rubber latex dispersion. A multi-layer composite and methods for adhering a thermoplastic material to a rigid substrate using the aqueous adhesive composition also are described.Type: GrantFiled: April 27, 2006Date of Patent: June 21, 2011Assignee: Bostik, Inc.Inventors: David F. Freund, Rodney M. Weston
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Publication number: 20110021103Abstract: A hot melt adhesive composition, comprising a blend of components including about 5% to about 50% by weight of an olefin block copolymer; about 10% to about 70% by weight of a first tackifying resin having a softening point of at least about 95° C.; about 0 to 65% of a second tackifying resin that is different than the first tackifying resin; about 0% to about 60% by weight of a plasticizer; about 0% to about 20% by weight of an aromatic reinforcing resin having a softening point equal to or higher than 115° C.; about 0.1% to about 5% by weight of a stabilizer; and about 1% to about 40% by weight of a secondary polymer that is different from the olefin block copolymer, the first and second tackifying resins and the reinforcing resin, having relatively low crystallinity, which low crystallinity is equal to or less than 250 Joules/gram, wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 mPa·s at 163° C.Type: ApplicationFiled: July 23, 2010Publication date: January 27, 2011Applicant: BOSTIK, INC.Inventors: Mark D. Alper, Monina D. Kanderski
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Patent number: 7838590Abstract: A hot melt adhesive composition, comprising a blend of components including about 1% to about 20% by weight of a styrene-ethylene-ethylene-propylene-styrene (SEEPS) random block copolymer; about 10% to about 70% by weight of a first midblock tackifying resin having a softening point of at least about 85° C.; about 0 to 65% of a second midblock tackifying resin; about 5% to about 60% by weight of a plasticizer; about 0% to about 20% by weight of an end block reinforcing resin having a softening point equal to or higher than 115° C.; and about 0.1% to about 5% of a stabilizer; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 mPa.s at 160° C. Laminates, especially those used in disposable soft goods, and methods of making such laminates using the hot melt adhesive composition are also described.Type: GrantFiled: June 8, 2007Date of Patent: November 23, 2010Assignee: Bostik, Inc.Inventor: Monina Kanderski
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Publication number: 20100264369Abstract: A wetness indicating adhesive composition comprising an adhesive base composition incorporating a fluorescing agent in the adhesive base composition that only fluoresces when wet, and not when dry. In one embodiment, the adhesive base composition may be composed of water soluble, or at least partially water soluble, components, and in another embodiment the adhesive base composition may be composed of water sensitive components as for example one or more water insoluble polymers and a surfactant. The fluorescing agent can either be dissolved or dispersed in the adhesive base composition, and is preferably a water soluble fluorescing agent that becomes visible under ultraviolet light only when an article such as a disposable diaper becomes wet.Type: ApplicationFiled: July 2, 2009Publication date: October 21, 2010Applicant: BOSTIK, INC.Inventor: Chongyao Zhang
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Publication number: 20100249313Abstract: Multipurpose hot melt adhesive compositions which are suitable for use as both a construction and elastic attachment adhesive for disposable soft goods, such as disposable diapers, feminine sanitary napkins, surgical drapes, hospital pads, and adult incontinent products. The multipurpose hot melt adhesive compositions have a high level of creep resistance, high bond strength, and relatively low viscosity, and are composed of endblock resin in combination with a linear styrene-butadiene-styrene (SBS) copolymer wherein the copolymer has a styrene content greater than about 35% by weight, and preferably about 38% to about 50% by weight.Type: ApplicationFiled: April 22, 2010Publication date: September 30, 2010Applicant: BOSTIK, INC.Inventors: Genta Okazaki, Mark D. Alper
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Process For Preparing an Aqueous Dispersion of a Quaternary Ammonium Salt Containing Vinyl Copolymer
Publication number: 20100048801Abstract: A method of making an ion triggerable cationic polymer by solution copolymerizing one or more vinyl-functional cationic monomers, one or more water insoluble or hydrophobic vinyl monomers with alkyl side chains up to 4 carbons long, and, optionally, a minor amount of one or more vinyl monomers with linear or branched alkyl groups longer than 4 carbons, alkyl hydroxy, polyoxyalkylene, or other functional groups. The solution polymerization is accomplished by free radical polymerization in a mixture of an organic solvent such as acetone and water. After polymerization is complete, the organic solvent is preferably removed by a continuous process. The continuous process is preferably performed using a plate evaporator system.Type: ApplicationFiled: November 3, 2009Publication date: February 25, 2010Applicant: BOSTIK, INC.Inventors: Glenn C. Calhoun, Rodney M. Weston -
Process for preparing an aqueous dispersion of a quaternary ammonium salt containing vinyl copolymer
Patent number: 7619033Abstract: A method of making an ion triggerable cationic polymer by solution copolymerizing one or more vinyl-functional cationic monomers, one or more water insoluble or hydrophobic vinyl monomers with alkyl side chains up to 4 carbons long, and, optionally, a minor amount of one or more vinyl monomers with linear or branched alkyl groups longer than 4 carbons, alkyl hydroxy, polyoxyalkylene, or other functional groups. The solution polymerization is accomplished by free radical polymerization in a mixture of an organic solvent such as acetone and water. After polymerization is complete, the organic solvent is preferably removed by a continuous process. The continuous process is preferably performed using a plate evaporator system.Type: GrantFiled: September 16, 2005Date of Patent: November 17, 2009Assignee: Bostik, Inc.Inventors: Glenn C. Calhoun, Rodney M. Weston -
Publication number: 20090264580Abstract: A hot melt adhesive composition, comprising a blend of components including about 10% to about 40% by weight of an elastomeric block copolymer, preferably styrene-isoprene-styrene (SIS) or styrene-butadiene-styrene (SBS), about 15% to about 70% by weight of a first midblock tackifying resin having a softening point of at least about 110° C. and having an aromatic content of at least about 1.5% by weight; about 0 to 55% of second midblock tackifying resin, about 5% to about 35% by weight of a plasticizer; and about 0% to about 20% by weight of an end block resin having a softening point lower than 125° C.; wherein the components total 100% by weight of the composition, the viscosity of the composition is equal to or less than about 20,000 mPa·s at 120° C., and is applied at a temperature lower that 150° C. and initial bond retention of the composition on elastic strands is at least about 60%.Type: ApplicationFiled: June 2, 2009Publication date: October 22, 2009Applicant: BOSTIK, INC.Inventors: Fabienne Abba, Christopher Morel-Fourrier, Nicolas Edgard Sajot
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Process for preparing an aqueous dispersion of a quaternary ammonium salt containing vinyl copolymer
Patent number: 7592391Abstract: A method of making an ion triggerable cationic polymer by solution copolymerizing one or more vinyl-functional cationic monomers, one or more water insoluble or hydrophobic vinyl monomers with alkyl side chains up to 4 carbons long, and, optionally, a minor amount of one or more vinyl monomers with linear or branched alkyl groups longer than 4 carbons, alkyl hydroxy, polyoxyalkylene, or other functional groups. The solution polymerization is accomplished by free radical polymerization in a mixture of acetone and water.Type: GrantFiled: March 18, 2004Date of Patent: September 22, 2009Assignee: Bostik, Inc.Inventors: Glenn C. Calhoun, Rodney M. Weston -
Publication number: 20080102232Abstract: The present invention provides a waterbased self seal adhesive system utilizing a self seal adhesive containing no natural rubber. The self seal adhesive system is comprised of a transfer adhesive disposed on a transfer web and an anchor adhesive disposed on an anchor web with the two adhesives forming the seal for the package. The self seal adhesives bond to themselves when pressure is applied to close or seal the packaging material. When peeled apart, the adhesive splits, adhesively fails from either or both the front web or the back web, or destroys one or both of the substrates of the package. Primer coatings may also be used to enhance performance of the self seal adhesive.Type: ApplicationFiled: December 27, 2007Publication date: May 1, 2008Applicant: Bostik, Inc., a Wisconsin corporationInventor: Harold Story
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Patent number: 7328547Abstract: A method for packaging plastic material using a film to surround the material, and more particularly to a method for packaging hot melt adhesives, the resulting package formed thereby, and the film composition used therein. The method is preferably a coextrusion process for packaging a pressure sensitive hot melt adhesive by extruding a hot melt adhesive through a die orifice, and coextruding a wax-based polymeric film to surround the hot melt adhesive. The coated adhesive may then be formed into individual packaged units having a finite size and shape. The polymeric film comprises a composition having at least 25% by weight of a wax material, an enthalpy of fusion of at least about 100 J/g, and an elongation value at break of at least about 100%. Any type of hot melt adhesive formulation can be packaged or surrounded by the polymeric film in the process.Type: GrantFiled: October 29, 2004Date of Patent: February 12, 2008Assignee: Bostik, Inc.Inventors: Atul Mehta, Michael A. Neperud, Nicolas E. Sajot, Dominique Chiarabini, Chrisophe Morel-Fourrier
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Patent number: 7235294Abstract: A water based, cold seal, cohesive coating for bonding one or more substrates together to form a flexible package to contain an article, especially useful for snack food packaging. The cohesive coating includes about 25% to about 90% by weight of a natural rubber latex emulsion, about 10% to about 75% by weight of a non-self-crosslinking acrylic emulsion, about 0.01% to about 10% by weight water, and one or more ingredient selected from an anti-foam agent, ammonia, a surfactant, an anti-blocking agent, an inert filler, and a conditioning agent, so that in combination the components total 100% by weight of the composition. The use of a non-self-crosslinking acrylic emulsion provides an improved cold seal cohesive that may be employed with current high temperature converting systems and provides improved adhesion to substrates, enhanced cohesion to itself, reduced blocking and avoids seal deadening.Type: GrantFiled: February 17, 2004Date of Patent: June 26, 2007Assignee: Bostik, Inc.Inventor: Harold G. Story
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Patent number: 7067585Abstract: A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%–50% by weight of the RCP copolymer, about 20%–65% by weight of a compatible tackifier, about 0%–40% by weight of a plasticizer, about 0%–3% by weight of a stabilizer, about 0%–40% by weight of a wax, and optionally about 0%–60% by weight of an atactic poly-?-olefin (APAO). The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.Type: GrantFiled: October 28, 2002Date of Patent: June 27, 2006Assignee: Bostik, Inc.Inventors: Baoyu Wang, Monina Dadap Kanderski, Lacretia A. Svenningsen, Diane M. Strelow, Chongyao Zhang, Mark A. Gibes
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Patent number: 7059760Abstract: A method and apparatus for post mixing an additive with a hot melt adhesives. The method includes the steps of providing a source of molten hot melt adhesive, feeding the hot melt adhesive to an inlet of a mixer, simultaneously feeding an additive for the hot melt adhesive to the inlet of the mixer, mixing the additive and molten hot melt adhesive in the mixer to form a homogeneous mixture, and recovering the homogenous mixture. The additive is preferably selected from wetness indicators, antimicrobial agents, pigments, dyes, ultraviolet light absorbers, antioxidants, fluorescent agents, pH indicators and fragrances. The method may be practiced either on a batch basis, or on a continuous basis.Type: GrantFiled: April 2, 2003Date of Patent: June 13, 2006Assignee: Bostik, Inc.Inventors: Atul Mehta, Michael Neperud, Eric Roussel