Patents Assigned to Brewer Science
  • Publication number: 20130288064
    Abstract: New carbon nanotube (CNT) compositions and methods of using those compositions are provided. Raw carbon nanotubes are mechanically dispersed via milling into multifunctional alcohols and mixtures of multifunctional alcohols and solvents to form pastes or dispersions that are viscous enough to be printed using standard means such as screen printing. These pastes or dispersions are stable in both dilute and concentrated solution. The invention allows films to be formed on substrates (e.g., plastics, glass, metals, ceramics).
    Type: Application
    Filed: April 25, 2013
    Publication date: October 31, 2013
    Applicant: Brewer Science Inc.
    Inventor: Molly Hladik
  • Publication number: 20130280656
    Abstract: Photosensitive, developer-soluble bottom anti-reflective coatings are described. Compositions and methods of forming the same are also disclosed along with resulting microelectronic structures. The anti-reflective compositions comprise a multi-functional epoxy compound having multiple epoxy moieties pendant therefrom and one or more crosslinkable chromophores bonded thereto. The compounds are dispersed or dissolved in a solvent system with a vinyl ether crosslinker and can be used to create crosslinkable and de-crosslinkable coatings for microelectronics fabrication.
    Type: Application
    Filed: April 22, 2013
    Publication date: October 24, 2013
    Applicant: Brewer Science Inc.
    Inventors: Joyce Lowes, Jinhua Dai, Alice Guerrero
  • Publication number: 20130273330
    Abstract: Compositions for directed self-assembly patterning techniques are provided which avoid the need for separate anti-reflective coatings and brush neutral layers in the process. Methods for directed self-assembly are also provided in which a self-assembling material, such as a directed self-assembly block copolymer, can be applied directly to the silicon hardmask neutral layer and then self-assembled to form the desired pattern. Directed self-assembly patterned structures are also disclosed herein.
    Type: Application
    Filed: April 15, 2013
    Publication date: October 17, 2013
    Applicant: Brewer Science Inc.
    Inventors: Yubao Wang, Mary Ann Hockey, Douglas J. Guerrero, Vandana Krishnamurthy, Robert C. Cox
  • Publication number: 20130129995
    Abstract: The present invention provides novel methods of fabricating microelectronics structures, and the resulting structures formed thereby, using EUV lithographic processes. The method involves utilizing an assist layer immediately below the photoresist layer. The assist layer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate. The preferred assist layers are formed from spin-coatable, polymeric compositions. The inventive method allows reduced critical dimensions to be achieved with improved dose-to-size ratios, while improving adhesion and reducing or eliminating pattern collapse issues.
    Type: Application
    Filed: November 20, 2012
    Publication date: May 23, 2013
    Applicant: Brewer Science Inc.
    Inventor: Brewer Science Inc.
  • Patent number: 8445591
    Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and compatible compounds such as monomers, oligomers, and polymers comprising epoxy groups; poly(styrene-co-allyl alcohol); and mixtures thereof. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer to which may or may not be crosslinked upon heating.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: May 21, 2013
    Assignee: Brewer Science Inc.
    Inventors: Gu Xu, Kimberly A. Yess, Tony D. Flaim
  • Patent number: 8415083
    Abstract: This invention provides methods of creating via or trench structures on a developer-soluble hardmask layer using a multiple exposure-development process. The hardmask layer is patterned while the imaging layer is developed. After the imaging layer is stripped using organic solvents, the same hardmask can be further patterned using subsequent exposure-development processes. Eventually, the pattern can be transferred to the substrate using an etching process.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: April 9, 2013
    Assignee: Brewer Science Inc.
    Inventors: Sam X. Sun, Hao Xu, Tony D. Flaim
  • Patent number: 8408222
    Abstract: New baffles and methods of using these baffles are provided. The baffles comprise a body having an edge wall configured to direct the flow of a composition against a substrate (e.g., silicon wafer) edge. The edge wall comprises a vertical surface, a curved sidewall coupled to the vertical surface, and a lip coupled to the curved sidewall. A preferred baffle is annular in shape and formed from a synthetic resinous composition. Even more preferably, the baffle is not formed of a metal. The inventive methods comprise positioning the baffle adjacent a substrate during a spin coating process so that the edge wall causes the composition to cover the edges of the substrate and preferably a portion of the back side of the substrate.
    Type: Grant
    Filed: July 20, 2009
    Date of Patent: April 2, 2013
    Assignee: Brewer Science Inc.
    Inventors: Gary J. Brand, Philip H. Allen, Ramachandran K. Trichur
  • Patent number: 8399346
    Abstract: Scratch-resistant coatings for protecting front-side microelectromechanical and semiconductor device features during backside processing are provided, along with methods of using the same. The coatings are non-photosensitive, removable, and tolerate high processing temperatures. These coatings also eliminate the need for a separate etch stop layer in the device design. The coatings are formed from a composition comprising a component dissolved or dispersed in a solvent system. The component is selected from the group consisting of styrene-acrylonitrile copolymers and aromatic sulfone polymers.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: March 19, 2013
    Assignee: Brewer Science Inc.
    Inventors: Kimberly A. Yess, Madison M. Daily, Jr., Tony D. Flaim
  • Patent number: 8383318
    Abstract: Acid-sensitive, developer-soluble bottom anti-reflective coating compositions are provided, along with methods of using such compositions and microelectronic structures formed thereof. The compositions preferably comprise a crosslinkable polymer dissolved or dispersed in a solvent system. The polymer preferably comprises recurring monomeric units having adamantyl groups. The compositions also preferably comprise a crosslinker, such as a vinyl ether crosslinking agent, dispersed or dissolved in the solvent system with the polymer. In some embodiments, the composition can also comprise a photoacid generator (PAG) and/or a quencher. The bottom anti-reflective coating compositions are thermally crosslinkable, but can be decrosslinked in the presence of an acid to be rendered developer soluble.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: February 26, 2013
    Assignee: Brewer Science Inc.
    Inventors: Jim D. Meador, Joyce A. Lowes, Ramil-Marcelo L. Mercado
  • Patent number: 8268449
    Abstract: New compositions for use as protective coatings and/or adhesives are provided. The compositions comprise a hydrocarbon resin (e.g., terpene rosin) and a rubber (e.g., EPDM) dispersed or dissolved in a solvent system. The solvent system is preferably a single-solvent system, and the compositions are preferably free of surfactants, dyes, and chromophores. The compositions can be cured or dried to form layers or films that are chemically and thermally resistant, but that can be readily dissolved and removed at the appropriate stage in the fabrication process.
    Type: Grant
    Filed: February 6, 2006
    Date of Patent: September 18, 2012
    Assignee: Brewer Science Inc.
    Inventors: John C. Moore, Michelle R. Fowler
  • Patent number: 8257910
    Abstract: The present invention provides methods of fabricating microelectronics structures and the resulting structures formed thereby using EUV lithographic processes. The method involves utilizing an underlayer immediately below the photoresist layer. The underlayer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate. The preferred underlayers are formed from spin-coatable, polymeric compositions. The inventive method allows reduced critical dimensions to be achieved while improving adhesion and reducing or eliminating pattern collapse issues.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: September 4, 2012
    Assignee: Brewer Science Inc.
    Inventors: Douglas J. Guerrero, Hao Xu, Vandana Krishnamurthy
  • Patent number: 8236669
    Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: August 7, 2012
    Assignee: Brewer Science Inc.
    Inventors: Wenbin Hong, Sunil K. Pillalamarri
  • Patent number: 8221571
    Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: July 17, 2012
    Assignee: Brewer Science Inc.
    Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
  • Patent number: 8206893
    Abstract: Novel, developer-soluble anti-reflective coating compositions and methods of using those compositions are provided. The compositions comprise a multi-functional acid reacted with a multi-functional vinyl ether to form a branched polymer or oligomer. In use, the compositions are applied to a substrate and thermally crosslinked. Upon exposure to light and post-exposure baking, the cured polymers/oligomers will decrosslink and depolymerize, rendering the layer soluble in typical photoresist developing solutions (e.g., alkaline developers).
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: June 26, 2012
    Assignee: Brewer Science Inc.
    Inventors: Hao Xu, Ramil-Marcelo L. Mercado, Douglas J. Guerrero, Jim D. Meador
  • Patent number: 8202442
    Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and optionally other addition-polymerizable monomers such as (meth)acrylate monomers, vinylbenzyl chloride, and diesters of maleic acid or fumaric acid. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer which may or may not be crosslinked upon heating.
    Type: Grant
    Filed: September 17, 2007
    Date of Patent: June 19, 2012
    Assignee: Brewer Science Inc.
    Inventors: Chenghong Li, Kimberly A. Yess, Tony D. Flaim
  • Patent number: 8192642
    Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and compatible compounds such as monomers, oligomers, and polymers comprising epoxy groups; poly(styrene-co-allyl alcohol); and mixtures thereof. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer which may or may not be crosslinked upon heating.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: June 5, 2012
    Assignee: Brewer Science Inc.
    Inventors: Gu Xu, Kimberly A. Yess, Tony D. Flaim
  • Patent number: 8168372
    Abstract: Novel, developer-soluble, hard mask compositions and methods of using those compositions to form microelectronic structures are provided. The composition comprises the compound a compound for controlling development rate, and a crosslinking agent in a solvent system. The methods involve applying the composition to a substrate and curing the composition. An imaging layer is applied to the composition, followed by light exposure and developing, during which the light-exposed portions of the imaging layer are removed, along with portions of the hard mask composition adjacent said light-exposed portions. The size of the hard mask composition structures are controlled by the development rate, and they yield feature sizes that are a fraction of the imaging layer feature sizes, to give a pattern that can ultimately be transferred to the substrate.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: May 1, 2012
    Assignee: Brewer Science Inc.
    Inventor: Sam X. Sun
  • Patent number: 8133659
    Abstract: This invention provides methods of creating via or trench structures on a developer-soluble hardmask layer using a multiple exposure-development process. The hardmask layer is patterned while the imaging layer is developed. After the imaging layer is stripped using organic solvents, the same hardmask can be further patterned using subsequent exposure-development processes. Eventually, the pattern can be transferred to the substrate using an etching process.
    Type: Grant
    Filed: January 29, 2009
    Date of Patent: March 13, 2012
    Assignee: Brewer Science Inc.
    Inventors: Sam X. Sun, Hao Xu, Tony D. Flaim
  • Patent number: 8092628
    Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
    Type: Grant
    Filed: October 31, 2008
    Date of Patent: January 10, 2012
    Assignee: Brewer Science Inc.
    Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
  • Patent number: 7998318
    Abstract: A via and contact hole fill composition and method for using the composition in the dual damascene production of circuits is provided. Broadly, the fill compositions include a quantity of solid components including a polymer binder and a solvent system for the solid components. The boiling point of the solvent system is less than the cross-linking temperature of the composition. Preferred solvents for use in the solvent system include those selected from the group consisting of alcohols, ethers, glycol ethers, amides, ketones, and mixtures thereof. Preferred polymer binders are those having an aliphatic backbone and a molecular weight of less than about 80,000, with polyesters being particularly preferred.
    Type: Grant
    Filed: October 13, 2004
    Date of Patent: August 16, 2011
    Assignee: Brewer Science Inc.
    Inventors: James E. Lamb, III, Xie Shao