Abstract: An apparatus for gripping a substrate on its peripheral edge including a substrate support having proximate and distal ends, at least one distal rest pad disposed at the distal end, the at least one distal rest pad includes a back stop portion and is configured to support the peripheral edge of the substrate, at least one proximate rest pad disposed at the proximate end, the at least one proximate rest pad being configured to support the peripheral edge of the substrate, and an active contact member assembly disposed at the proximate end, the active contact member assembly including a pusher member, a contact member and a rotatable coupling member that are reciprocably movable towards the distal end for urging the substrate against the back stop portion, the contact member being rotatably secured to the pusher member and free to rotate about an axis of the rotatable coupling member.

Abstract: The present invention comprises a workpiece container for storing at least one workpiece having a bottom surface and a peripheral edge. In one embodiment, a workpiece support structure is located within the container enclosure, which forms multiple vertically stacked storage shelves within the enclosure. Each storage shelf includes, in one embodiment, a first tine and a second tine for supporting the workpiece in a substantially horizontal orientation. The bottom surface and peripheral edge of a workpiece seated on a storage shelf extends beyond the outer edge of both the first tine and the second tine. An end effector according to the present invention may engage these extended portions or “grip zones” of the workpiece.

Abstract: Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

Abstract: Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

Abstract: A container or array of containers that is are sealed with a peelable seal is transported via a conveyor along a processing path toward a desealing station at which an adhesive surface having a width substantially the same as or greater than the width of the seal is pressed against the upper surface of the peelable seal. A collection rod applies a downward pressure on the adhesive surface, pressing it against the seal and keeping the container or container array in position on the conveyor as the plate moves with the conveyor. As the leading edge of the seal passes the collection rod, the adhesive surface is rolled upward, away from the plane of the seal, pulling up on the leading edge of the seal to separate it from the container or container array while the container or container array is held down by the roller. The removed seal is then discarded.

Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

Abstract: A substrate transport apparatus including a frame, a drive section connected to the frame and including at least one independently controllable motor, at least two substrate transport arms connected to the frame and comprising arm links arranged for supporting and transporting substrates, and a mechanical motion switch coupled to the at least one independently controllable motor and the at least two substrate transport arms for effecting the extension and retraction of one of the at least two substrate transport arms while the other one of the at least two substrate transport arms remains in a substantially retracted configuration.

Abstract: A substrate processing apparatus is presented having a transport chamber defining substantially linear substrate transport paths, a linear array of substrate holding modules, each communicably connected to the chamber. The substrate transport has at least one transporter capable of holding and moving the substrate on more than one substantially linear substrate transport paths. The transport chamber having different transport tubes at least one of which is sealable at both ends of the transport tube and configured to hold an isolated atmosphere different from that of the transport tubes, each of the different transport tubes having one of the substrate transport paths located therein different from another of the transport paths located in another of the transport tubes, and being communicably connected to each other, where at least one of the transport tubes is configured to provide uninterrupted transit of the substrate transport through the transport tubes.

Abstract: A substrate transport apparatus including a first shaftless rotary motor including a first stator and a first rotor, the first stator being linearly distributed and the first rotor being coupled to a first arm, a second shaftless rotary motor including a second stator and second rotor, the second stator being linearly distributed and the second rotor being coupled to a second arm, the second arm being connected to the first arm and a first substrate support being coupled to at least one of the first and second arms, wherein the first stator and second stator are configured so that the first and second arms and the first substrate support are inside the stators and a motor output at a connection between the first and second shaftless rotary motors and a respective one of the first and second arms is a resultant force disposed peripheral to the first and second arms.

Abstract: An ionization gauge to measure pressure and to reduce sputtering yields includes at least one electron source that generates electrons. The ionization gauge also includes a collector electrode that collects ions formed by the collisions between the electrons and gas molecules. The ionization gauge also includes an anode. An anode bias voltage relative to a bias voltage of a collector electrode is configured to switch at a predetermined pressure to decrease a yield of sputtering collisions.

Abstract: A substrate aligner providing minimal substrate transporter extend and retract motions to quickly align substrate without back side damage while increasing the throughput of substrate processing. In one embodiment, the aligner having an inverted chuck connected to a frame with a substrate transfer system capable of transferring substrate from chuck to transporter without rotationally repositioning substrate. The inverted chuck eliminates aligner obstruction of substrate fiducials and along with the transfer system, allows transporter to remain within the frame during alignment. In another embodiment, the aligner has a rotatable sensor head connected to a frame and a substrate support with transparent rest pads for supporting the substrate during alignment so transporter can remain within the frame during alignment. Substrate alignment is performed independent of fiducial placement on support pads.

Abstract: A substrate transport apparatus having a frame, a drive section and an articulated arm. The drive section has at least one motor module that is selectable for placement in the drive section from a number of different interchangeable motor modules. Each having a different predetermined characteristic. The articulated arm has articulated joints. The arm is connected to the drive section for articulation. The arm has a selectable configuration selectable from a number of different arm configurations each having a predetermined configuration characteristic. The selection of the arm configuration is effected by selection of the at least one motor module for placement in the drive section.

Abstract: In accordance with one aspect of the exemplary embodiments, a substrate transport apparatus is provided comprising a drive mechanism, a movable arm assembly connected to the drive mechanism, an end effector connected to the arm assembly. A chuck for holding a substrate is mounted on the end effector and having a movable edge gripper with a contact surface and an edge of the substrate may be gripped by actuating the movable edge gripper to engage the substrate with the contact surface. The apparatus further comprising a motion sensor for providing a signal to actuate the movable edge gripper to close and open the moveable edge gripper for capturing and releasing the substrate.

Abstract: A variety of process modules are described for use in semiconductor manufacturing processes.

Abstract: An ionization gauge includes an electron generator array that includes a microchannel plate that includes an electron generating portion of the microchannel plate comprising a source for generating seed electrons and an electron multiplier portion of the microchannel plate, responsive to the seed electrons generated by the electron generating portion, that multiplies the electrons. The ionization gauge includes an ionization volume in which the electrons impact a gaseous species, and a collector electrode for collecting ions formed by the impact between the electrons and gas species. The collector electrode can be surrounded by the anode, or the ionization gauge can be formed with multiple collector electrodes. The source of electrons can provide for a spontaneous emission of electrons, where the electrons are multiplied in a cascade.

Abstract: In accordance to an aspect of the disclosed embodiments, a substrate transport apparatus is provided. The substrate transport apparatus includes a frame defining a chamber, at least one stator module embedded at least partly into a peripheral wall of the chamber, the at least one stator module defining an axis of rotation. The substrate transport apparatus further includes at least one rotor substantially concentrically disposed relative to the at least one stator module about the axis of rotation, the at least one rotor being configured to interface with the at least one stator module and being suspended by a respective one of the at least one stator module substantially without contact within the chamber. The substrate transport apparatus further includes at least one substrate transport arm connected to the at least one rotor and having at least one end effector configured to hold at least one substrate.

Abstract: A substrate processing apparatus is provided. The apparatus has a casing, a low port interface and a carrier holding station. The casing has processing devices within for processing substrates. The load port interface is connected to the casing for loading substrates into the processing device. The carrier holding station is connected to the casing. The carrier holding station is adapted for holding at least one substrate transport carrier so the at least one substrate transport carrier is capable of being coupled to the load port interface without lifting the at least one substrate transport carrier off the carrier holding station. The carrier holding station is arranged to provide a substantially simultaneous swap section for substantially simultaneous replacement of the substrate transport carrier from the carrier holding station.

Abstract: Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

Abstract: A motor includes a stator and a rotor, equipped to be movable in at least a first direction relative to the stator, the rotor operably interfacing the stator so that a motor force is generated in a first direction, where the stator comprises an anti-cogging element configured to generate anti-cogging forces on the rotor in at least the first direction and a second direction at an angle to the first direction.