Abstract: A time-optimal trajectory generation method, for a robotic manipulator having a transport path with at least one path segment, comprising generating a forward time-optimal trajectory of the manipulator along the at least one path segment from a start point of the at least one path segment towards an end point of the at least one path segment, generating a reverse time-optimal trajectory of the manipulator along the at least one path segment from the end point towards the start point of the at least one path segment, and combining the time-optimal forward and reverse trajectories to obtain a complete time-optimal trajectory, where the forward and reverse trajectories of the at least one path segment are blended together with a smoothing bridge joining the time-optimal forward and reverse trajectories in a position-velocity reference frame with substantially no discontinuity between the time-optimal forward and reverse trajectories.

Abstract: A substrate processing apparatus including a frame defining a chamber with a substrate transport opening and a substrate transfer plane defined therein, a valve mounted to the frame and being configured to seal an atmosphere of the chamber when closed, the valve having a door movably disposed to open and close the substrate transport opening, and at least one substrate sensor element disposed on a side of the door and oriented to sense substrates located on the substrate transfer plane.

Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

Abstract: A substrate transport apparatus for a processing tool. The apparatus has a drive section, a movable arm, and an end effector. The arm is operably connected to the drive section. The end effector is connected to the movable arm for holding and transporting the substrate in the processing tool. The apparatus has a substrate inertial capture edge grip connected to the end effector and arranged so that the grip effects capture and centering of the substrate onto the end effector from substrate inertia.

Abstract: A system for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor calculates the location of the center and the notch of the wafer based on measurements by the sensor(s) and generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

Abstract: A substrate processing system including a load port module configured to hold at least one substrate container for storing and transporting substrates, a substrate processing chamber, an isolatable transfer chamber capable of holding an isolated atmosphere therein configured to couple the substrate processing chamber and the load port module, and a substrate transport mounted at least partially within the transfer chamber having a drive section fixed to the transfer chamber and having a SCARA arm configured to support at least one substrate, the SCARA arm being configured to transport the at least one substrate between the at least one substrate container and the processing chamber with but one touch of the at least one substrate, wherein the SCARA arm comprises a first arm link, a second arm link, and at least one end effector serially pivotally coupled to each other, where the first and second arm links have unequal lengths.

Abstract: In an embodiment, the present invention discloses a EUV cleaner system and process for cleaning a EUV carrier. The euv cleaner system comprises separate dirty and cleaned environments, separate cleaning chambers for different components of the double container carrier, gripper arms for picking and placing different components using a same robot handler, gripper arms for holding different components at different locations, horizontal spin cleaning and drying for outer container, hot water and hot air (70 C) cleaning process, vertical nozzles and rasterizing megasonic nozzles for cleaning inner container with hot air nozzles for drying, separate vacuum decontamination chambers for outgassing different components, for example, one for inner and one for outer container with high vacuum (e.g., <10?6 Torr) with purge gas, heaters and RGA sensors inside the vacuum chamber, purge gas assembling station, and purge gas loading and unloading station.

Abstract: A loadport has a port door and a frame with an opening through which the port door interfaces with a container door of a container for holding semiconductor workpieces. In one embodiment, a movable closure mechanism is connected to the port door and is defined to be movable in a controlled manner relative to both the port door and the frame. In this embodiment, a stationary closure mechanism is disposed on the frame proximate to the opening. In another embodiment, a stationary closure mechanism is connected to the port door, and a movable closure mechanism is disposed on the frame proximate to the opening. In both embodiments, the movable closure mechanism is defined to engage with the stationary closure mechanism such that movement of the movable closure mechanism to engage with the stationary closure mechanism applies a closing force between the port door and the container door.

Abstract: A substrate processing apparatus is provided. The apparatus has a casing, a low port interface and a carrier holding station. The casing has processing devices within for processing substrates. The load port interface is connected to the casing for loading substrates into the processing device. The carrier holding station is connected to the casing. The carrier holding station is adapted for holding at least one substrate transport carrier so the at least one substrate transport carrier is capable of being coupled to the load port interface without lifting the at least one substrate transport carrier off the carrier holding station. The carrier holding station is arranged to provide a substantially simultaneous swap section for substantially simultaneous replacement of the substrate transport carrier from the carrier holding station.

Abstract: A helium management control system for controlling the helium refrigerant supply from a common manifold supplies cryogenic refrigerators with an appropriate helium supply. The system employs sensors to monitor and regulate the overall refrigerant supply. An appropriate supply of helium is distributed to each cryopump. If the total refrigeration supply exceeds the demand, or consumption, excess refrigerant is directed to cryogenic refrigerators which can utilize the excess helium to complete a current cooling function more quickly. If the total refrigeration demand exceeds the total refrigeration supply, the refrigerant supply to some or all of the cryogenic refrigerators will be reduced accordingly so that detrimental or slowing effects are minimized based upon the current cooling function.

Abstract: A workpiece handling module including a first housing member and a second housing member pivotally movable relative to the first member forming a housing having an access side and a second side opposite the access side and side walls, a first portion of the side walls is carried by the first member and a second portion of the side walls is carried by the second member, and at least one of the first and second housing members includes at least one sealable opening for allowing ingress and egress of workpieces to and from an interior chamber formed by the first and second housing members in a closed configuration, and the second portion of the side walls adjacent the access side and carried by the second member is greater than the first portion of the side walls adjacent the access side and carried by the first member.

Abstract: Methods and systems to reduce the consumption of purge gas for semiconductor substrate containers. The recirculation purging system recycles purge gas back to substrate containers by filtering and purifying gas flow from substrate containers, receiving gas flow from load port, or including a recirculation tank.

Abstract: Scalable storage can be achieved with linear array storage of wafers, comprising two linear arrays of storage compartments on opposite walls, with a middle transfer mechanism. Together with a buffer station for automatic material handling system, a scalable bare wafer stocker can provide flexible and uninterrupted services to a fabrication facility.

Abstract: A storage unit for biological samples has a horizontal footprint and multiple storage compartments separated by partitions and enclosed by a frame. The storage compartments have first and second openings and are fitted to the shape of a biopsy cassette or a glass slide and have a retention mechanism preventing the substantially vertical cassettes or slides in the storage compartments from falling out through the first opening and/or the second opening. A transfer system allows at least two storage units or at least one storage unit and one collection unit to be situated one above the other in alignment and displaced in relation to one another. The transfer system has a manipulator by which a biopsy cassette or a glass slide may be pushed from one storage unit to another, or into the collection unit.

Abstract: A spiral cam has a tubular shaped portion defined by an interior cavity and an exterior surface that includes a cam contour. A linear slide assembly having a length defined along a rotational axis is defined to slide lengthwise into the interior cavity of the spiral cam. The linear slide assembly allows for movement of the spiral cam along the rotational axis and prevents rotation of the spiral cam relative to the linear slide assembly. A cam roller is fixed at a position proximate to the exterior surface of the spiral cam. The cam roller is disposed separate from the linear slide assembly and within the cam contour of the spiral cam. The cam roller engages the cam contour to move of the spiral cam along the rotational axis when the linear slide assembly and spiral cam are rotated in unison about the rotational axis relative to the cam roller.

Abstract: A cryopump has a simple-to-manufacture frontal baffle plate with improved gas distribution and has a large-area second-stage array plate to capture Type II gases. The cryopump has a first-stage frontal baffle plate having orifices and flaps bent from and attached to the orifices. The cryopump has a second-stage top plate that is larger in area than cooling baffles of the second stage array.

Abstract: A cryopump system includes a cryopump having a first cooling stage and a second cooling stage connected to the first cooling stage, the second cooling stage including a gas adsorber having a hydrogen adsorbing capacity of at least about 2 standard liters. The thermal storage capacity of the second cooling stage is sufficient to enable control of hydrogen pressure within the cryopump to satisfy ignition safety limits and limits on hydrogen flow rate in an exhaust line to be within limits of an abatement system to be coupled to the cryopump, upon warming of the second cooling stage during regeneration of up to a fully loaded cryopump.

Abstract: A substrate transport apparatus comprising a drive section, a controller, an upper arm, forearm and substrate holder. A proximate end of the upper arm being rotatably mounted to the drive section at a shoulder joint. A proximate end of the forearm being rotatably mounted to a distal end of the upper arm at an elbow joint. The substrate holder being rotatably mounted to a distal end of the forearm at a wrist joint. The upper arm and the forearm being unequal in length from joint center to joint center. The substrate transport arm is adapted to transport substrate to and from at least two substrate holding areas with the drive section of the transport apparatus remaining in a fixed position relative to the holding areas. Each of the upper arm, forearm and substrate holder being independently rotatable with respect to each other.

Abstract: A substrate processing apparatus including a frame, a first SCARA arm connected to the frame, including an end effector, configured to extend and retract along a first radial axis; a second SCARA arm connected to the frame, including an end effector, configured to extend and retract along a second radial axis, the SCARA arms having a common shoulder axis of rotation; and a drive section coupled to the SCARA arms is configured to independently extend each SCARA arm along a respective radial axis and rotate each SCARA arm about the common shoulder axis of rotation where the first radial axis is angled relative to the second radial axis and the end effector of a respective arm is aligned with a respective radial axis, wherein each end effector is configured to hold at least one substrate and the end effectors are located on a common transfer plane.

Abstract: In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor workpieces, a container for holding at least one semiconductor workpiece therein for transport to and from the at least one processing tool and a first transport section elongated and defining a travel direction. The first transport section has parts, that interface the container, supporting and transporting the container along the travel direction to and from the at least one processing tool. The container is in substantially continuous transport at a substantially constant rate in the travel direction, when supported by the first transport section. A second transport section is connected to the at least one process tool for transporting the container to and from the at least one processing tool.