Abstract: A current limited voltage supply including a transistor and a capacitor is provided for powering digital logic cells of an integrated circuit. The transistor is connected in a current mirror configuration, such that a constant reference current is mirrored through the transistor to create a first supply current. The transistor is coupled to the digital logic cells and the capacitor. The first supply current is used to charge the capacitor while the digital logic cells are not switching. While the digital logic cells are switching, the capacitor discharges to the digital logic cells, thereby providing the digital logic cells with sufficient energy to implement high-speed switching. The capacitor minimizes voltage fluctuations within in the current limited voltage supply, such that analog circuitry can be reliably powered from a different branch of the same current mirror circuit.

Abstract: A crystal oscillator circuit having a parallel resonant frequency that is adjustable by switching trim capacitors in parallel with a crystal.

Abstract: A non-volatile memory (NVM) system includes a plurality of NVM cells fabricated in a dual-well structure. Each NVM cell includes an access transistor and an NVM transistor, wherein the access transistor has a drain region that is continuous with a source region of the NVM transistor. The drain regions of each NVM transistor in a column of the array are commonly connected to a corresponding bit line. The control gates of each NVM transistor in a row of the array are commonly connected to a corresponding word line. The source regions of each of the access transistors in the array are commonly coupled. The NVM cells are programmed and erased without having to apply the high programming voltage VPP across the gate dielectric layers of the access transistors. As a result, the NVM cells can be scaled down to sub-0.35 micron geometries.

Abstract: A charge pump provides a multiplication factor of ? by using a three-phase mode of operation. In a first mode, first and second capacitors are charged from an input voltage while a third capacitor drives the output voltage based on stored charge in the third capacitor. In a second mode, the output terminal is connected to the common node of the first and second capacitors. In a third mode, the voltage potential across the second capacitor is subtracted from the sum of the input voltage and the voltage potential across the first capacitor to generate the output voltage. Operated in this manner, the first, second, and third capacitors will provide the desired ?× voltage multiplication. This relatively low multiplication factor can be beneficial in applications requiring 2.5V and 1.8V supplies for integrated circuits, particularly where the input voltage is provided by a lithium battery.

Abstract: A non-volatile memory cell fabricated with a conventional CMOS process, including a flip-flop circuit having an NMOS transistor that shares a floating gate with a write PMOS capacitor and an erase PMOS capacitor. An erase function is implemented by inducing Fowler-Nordheim tunneling through the erase PMOS capacitor, thereby providing a positive charge on the floating gate. A write function is implemented by inducing Fowler-Nordheim tunneling through the NMOS transistor, thereby providing a negative charge on the floating gate. The write PMOS capacitor provides bias voltages during the erase and write operations. Prior to a read operation, the flip-flop circuit is reset. If the floating gate stores a positive charge, the NMOS transistor turns on, thereby switching the state of the flip-flop circuit. If the floating gate stores a negative charge, the NMOS transistor turns off, thereby leaving the flip-flop circuit in the reset state.

Abstract: A non-volatile memory (NVM) system includes a plurality of NVM cells fabricated in a dual-well structure. Each NVM cell includes an access transistor and an NVM transistor, wherein the access transistor has a drain region that is continuous with a source region of the NVM transistor. The drain regions of each NVM transistor in a column of the array are commonly connected to a corresponding bit line. The control gates of each NVM transistor in a row of the array are commonly connected to a corresponding word line. The source regions of each of the access transistors in the array are commonly coupled. The NVM cells are programmed and erased without having to apply the high programming voltage VPP across the gate dielectric layers of the access transistors. As a result, the NVM cells can be scaled down to sub-0.35 micron geometries.

Abstract: A non-volatile memory (NVM) system includes a plurality of NVM cells fabricated in a dual-well structure. Each NVM cell includes an access transistor and an NVM transistor, wherein the access transistor has a drain region that is continuous with a source region of the NVM transistor. The drain regions of each NVM transistor in a column of the array are commonly connected to a corresponding bit line. The control gates of each NVM transistor in a row of the array are commonly connected to a corresponding word line. The source regions of each of the access transistors in the array are commonly coupled. The NVM cells are programmed and erased without having to apply the high programming voltage VPP across the gate dielectric layers of the access transistors. As a result, the NVM cells can be scaled down to sub-0.35 micron geometries.

Abstract: Embodiments of a digital potentiometer are disclosed that require lesser numbers of components than conventional digital potentiometers. A first string of elemental impedance devices, and at least one bulk impedance device, are provided between first and second reference terminals. The first string of elemental impedance devices is tapped by wiper switches. The at least one bulk impedance device has an impedance greater than an impedance of the first string. If desired, second and third bypassable impedance device strings also may be provided between the first and second reference terminals, with the impedance of the respective second and third strings being between the impedance of the first string and the impedance of one bulk impedance device. One or more dummy structures each including an impedance device in parallel with a permanently-on switch also may be between the first and second reference terminals to improve linearity.

Abstract: A non-volatile memory including one or more EEPROM cell pairs. Each EEPROM cell pair includes three transistors and stores two data bits, effectively providing a 1.5 transistor EEPROM cell. An EEPROM cell pair includes a first non-volatile memory transistor, a second non-volatile memory transistor and a source access transistor. The source access transistor includes: a first source region continuous with a source region of the first non-volatile memory transistor; a second source region continuous with a source region of the second non-volatile memory transistor, and a drain region that extends downward through a first well region to contact a second well region. The first, second and third semiconductor regions and the second well region have a first conductivity type, and the first well region has a second conductivity type, opposite the first conductivity type.

Abstract: A non-volatile memory (NVM) system includes a plurality of NVM cells fabricated in a dual-well structure. Each NVM cell includes an access transistor and an NVM transistor, wherein the access transistor has a drain region that is continuous with a source region of the NVM transistor. The drain regions of each NVM transistor in a column of the array are commonly connected to a corresponding bit line. The control gates of each NVM transistor in a row of the array are commonly connected to a corresponding word line. The source regions of each of the access transistors in the array are commonly coupled. The NVM cells are programmed and erased without having to apply the high programming voltage VPP across the gate dielectric layers of the access transistors. As a result, the NVM cells can be scaled down to sub-0.35 micron geometries.

Abstract: A non-volatile memory (NVM) system includes a set of NVM cells, each including: a NVM transistor; an access transistor coupling the NVM transistor to a corresponding bit line; and a source select transistor coupling the NVM transistor to a common source. The NVM cells are written by a two-phase operation that includes an erase phase and a program phase. A common set of bit line voltages are applied to the bit lines during both the erase and programming phases. The access transistors are turned on and the source select transistors are turned off during the erase and programming phases. A first control voltage is applied to the control gates of the NVM transistors during the erase phase, and a second control voltage is applied to the control gates of the NVM transistors during the program phase. Under these conditions, the average required number of Fowler-Nordheim tunneling operations is reduced.

Abstract: A hysteresis circuit including a comparator and capacitive voltage divider circuit. The capacitive voltage divider circuit includes a first capacitor coupled between an input terminal and a positive comparator input, a second capacitor coupled between ground and the positive comparator input, and a third capacitor coupled between the comparator output and positive comparator input. A reference voltage is applied to the negative comparator input. The comparator is powered by the input signal provided on the input terminal. When the voltage on the positive comparator input is less than the reference voltage, the third capacitor is effectively coupled in parallel with the first capacitor. When the voltage on the positive comparator input is greater than the reference voltage, the third capacitor is effectively coupled in parallel with the second capacitor.

Abstract: A nonvolatile memory integrated circuit arrayed in rows and columns is disclosed. Parallel lines of implant N-type regions are formed in a P-well of a semiconductor substrate, with lines of oxide material isolating each pair of the lines. Columns of memory cells straddle respective pairs of the implant region lines, with one line of the pair forming the source region and one line of the pair forming the drain region of each memory cell of the column. Each memory cell has a floating polysilicon storage gate. One of plural wordlines overlies each row of the memory cells. The portion of the wordline overlying each memory cells forms the control gate of the memory cell. Programming and erase operations occur by Fowler-Nordheim tunneling of electrons through a tunnel oxide layer between the floating gate and the source of the cell.

Abstract: A non-volatile memory including one or more EEPROM cell pairs. Each EEPROM cell pair includes three transistors and stores two data bits, effectively providing a 1.5 transistor EEPROM cell. An EEPROM cell pair includes a first non-volatile memory transistor, a second non-volatile memory transistor and a source access transistor. The source access transistor includes: a first source region continuous with a source region of the first non-volatile memory transistor; a second source region continuous with a source region of the second non-volatile memory transistor, and a third source region continuous with source regions of other non-volatile memory transistors located in the same row as the EEPROM cell pair.

Abstract: Embodiments of a digital potentiometer are disclosed that require lesser numbers of components than conventional digital potentiometers. A first string of elemental impedance devices, and at least one bulk impedance device, are provided between first and second reference terminals. The first string of elemental impedance devices is tapped by wiper switches. The at least one bulk impedance device has an impedance greater than an impedance of the first string. If desired, second and third bypassable impedance device strings also may be provided between the first and second reference terminals, with the impedance of the respective second and third strings being between the impedance of the first string and the impedance of one bulk impedance device. One or more dummy structures each including an impedance device in parallel with a permanently-on switch also may be between the first and second reference terminals to improve linearity.

Abstract: A non-volatile memory cell fabricated with a conventional CMOS process, including a flip-flop circuit having an NMOS transistor that shares a floating gate with a write PMOS capacitor and an erase PMOS capacitor. An erase function is implemented by inducing Fowler-Nordheim tunneling through the erase PMOS capacitor, thereby providing a positive charge on the floating gate. A write function is implemented by inducing Fowler-Nordheim tunneling through the NMOS transistor, thereby providing a negative charge on the floating gate. The write PMOS capacitor provides bias voltages during the erase and write operations. Prior to a read operation, the flip-flop circuit is reset. If the floating gate stores a positive charge, the NMOS transistor turns on, thereby switching the state of the flip-flop circuit. If the floating gate stores a negative charge, the NMOS transistor turns off, thereby leaving the flip-flop circuit in the reset state.

Abstract: Embodiments of a digital potentiometer are disclosed that require lesser numbers of components than conventional digital potentiometers. A first string of elemental impedance devices, and at least one bulk impedance device, are provided between first and second reference terminals. The first string of elemental impedance devices is tapped by wiper switches. The at least one bulk impedance device has an impedance greater than an impedance of the first string. If desired, second and third bypassable impedance device strings also may be provided between the first and second reference terminals, with the impedance of the respective second and third strings being between the impedance of the first string and the impedance of one bulk impedance device. One or more dummy structures each including an impedance device in parallel with a permanently-on switch also may be between the first and second reference terminals to improve linearity.

Abstract: A LED driver IC includes a control module(s) for controlling one or more LED drive parameters and non-volatile memory for storing settings data for that control module(s). The control module(s) is fully integrated into the LED driver IC and does not require any control input from off-chip components or signals. Therefore, the space requirements for LED circuits that make use of the LED driver IC can be minimized. Also, the non-volatile memory storage of settings data eliminates the need for an initialization or configuration input each time the LED driver IC is powered on. The non-volatile memory can be a one-time programmable memory or can be a reprogrammable memory.

Abstract: A voltage reference circuit provides a reference voltage that can be precisely programmed. The threshold voltage of a first non-volatile memory (NVM) transistor is programmed while coupled in parallel with a second NVM transistor. During programming, one or more capacitors are connected between the floating gate of the first NVM transistor and ground, and one or more capacitors are connected between the floating gate of the second NVM transistor and ground. The first and second NVM transistors are then coupled to a differential amplifier, which is used to generate a single-ended reference voltage in response to the programmed threshold voltage of the first NVM transistor. Bipolar transistors are selectively switched between the various capacitors and ground, thereby providing precise adjustment of the temperature coefficient of the voltage reference circuit.

Abstract: A step down switching regulator circuit that is particularly well-suited to drive high power LEDs includes a crossover conduction mode (XCM) control circuit that maintains operation at the crossover point between continuous conduction mode (CCM) and discontinuous conduction mode (DCM). This XCM operation provides an inductor current waveform that ramps up and down between zero and a desired maximum current. One or more comparators in the XCM control circuit can be used to control switching between the inductor current ramp up and ramp down phases. In this manner, complex feedback loop logic and PID controlled PWM signal generation logic can be avoided, and the need for external sense resistors and associated interface pins can be eliminated.